Sweeping changes for leading-edge chip architectures; patterns and issues in AI chip design; quantum advantage race; voltage droop, P/P tradeoffs; verifying reliability; virtual metal fill; thermal models; IP blocks in silicon chip design; MIPI CSI-2 adoption in autos; downsizing applications-class CPUs; thermomechanical fatigue simulations; Nginx performance on AWS Graviton3; verifying library IP; modeling accumulation of charged plasma; Arm Total Compute.
Fab and field data transforming manufacturing; customized IC testing; improving chip reliability; glass substrates; PMIC validation; PVT monitors; new test strategies for heterogeneous integration; pA measurements in EVs; constraint verification solution; on-chip monitoring and deep data analytics system.
Special report on supply chain security; virtual vehicle design; setting standards; connected cars; quantum cryptography; design and verification approach for power modules; RF signal path between MMIC and antenna; eFPGAs; battery management systems; AI for complex PCB placement and routing; functional safety; touch-sensing technology; speech recognition for light bulbs; PCB design optimization.
Vector-driven design; prototyping issues; commercial chiplets; system safety over time; cloud design; chip predictions; IR drop; SoCs and NoCs; AI transformers; RISC-V myths; wide bandgap semiconductors; shifting left; computational software; Monte Carlo simulations; stop-for-top IP model; power supply noise; design flow for embedded; always-on camera subsystems.
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