Special report on thin wafer processing; defining chiplets, heterogeneous integration; challenges grow for medical ICs; weighing EUV photoresist options; interfacial delamination; AI models for fab.
3D-ICs for the masses; chiplet power issues; more data to optimize chips; design and generative AI; faster debug; MIPI in auto; drive strength; GNNs; ADAS porting issues; object detection.
Automation and AI improve failure analysis; cutting IC manufacturing costs by mixing financial data with fab analytics; fundamental changes needed in failure analysis to keep pace with changes in chip technology.
Fundamental auto tech changes; software-defined radar; wearable connectivity, AI; sensor fusion's impact in automotive; chiplets; shift-left pattern matching; HSM for SDVs; space robots; UCIe advances.
Better verification methodologies; supercomputing vs HPC; data management in multi-die ICs; universities augment engineering curricula; cracking the memory wall; HW/SW co-verification; HBM and AI HW; data center crunch; smart NoCs.
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