Special report on mass customization for AI inference; IC aging concerns; unbundling analog from digital; symmetry checking; AI memory; green IoT; GDDR7; 3DIO.
Tackling high-frequency IC test; sub-2nm metrology; new IC reliability issues; through-glass defects; SLM monitors; real-time IC health monitors; testing chiplets; ML.
Ferroelectric devices; how die size affects assembly; developing new materials; managing EMI in advanced packages; molded FCBGA for auto; source/drain contact recess; legacy nodes.
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