Week In Review, Manufacturing, Test
Samsung's 3nm; Imec's interconnect news; CHIPS Act updates; Russian exports; education partnerships; quantum network consortium; laser breakthrough
Week In Review: Design, Low Power
Domain-specific logic simulation; new Arm CPUs, GPUs; high-frequency RF/MW simulation; memory, AMS design; Accenture buys XtremeEDA.
Week In Review: Auto, Security, Pervasive Computing
Global automotive chip market; auto deaths; viewers control sports 3D broadcasts; CEVA/Flex Logix ISA on the fly.
Week In Review: Manufacturing, Test
Intel's Ohio fab buildout warning; GF fab; Intel's New Mexico fab; sustainability in manufacturing; Imec's interconnects; quantum breakthrough; qua...
Week In Review: Design, Low Power
New RISC-V specifications; quantum security for RISC-V; physical design; rigid-flex; integrated BLE; PCIe 7.0 preview.
Week In Review: Auto, Security, Pervasive Computing
NHTSA wants 20 seconds from auto black boxes; MIT open-source self-driving simulator; AMD next gen Ryzen; Renesas IoT sensor system.
EDA Embraces Big Data Amid Talent Crunch
Need for higher productivity to compensate for talent shortages finally forces change.
Week In Review: Manufacturing, Test
Node scaling wars rev up; CFETs; CNT FETs; bismuth and antimony; Applied’s acquisition; power delivery schemes; 123 leaders hit D.C.; MCUs; quantum.
Week In Review: Auto, Security, Pervasive Computing
ADAS, ADS crash data from NHTSA; sensor glove; IoT dev kits; STT-MRAM.
Ways To Address The Materials Crunch
From neon gas to tool components, the industry is creating more resilient supply chains.
