Business News

Chip Industry Week In Review

 14A PDKs; 2nm funding; memory deal; optimizing EUV output; KGD screening; McKinsey's auto chips report; HW security exploits; humanoids; H-1B polic...
Published on June 12th,  2026 by The SE Staff

Chip Industry Week In Review

 Computex shows AI ecosystem; fully autonomous chip design; Intel targets AI racks; Nikon's 1.5 micron L/S litho; IC market rises; Apple's chiplet ...
Published on June 5th,  2026 by The SE Staff

Chip Industry Week In Review

 AI panel-level packaging innovations at ECTC; cool HBM; 2nm EDA tools; side-channel attacks in 2.5/3D; Huawei claims; IC talent initiative; glass c...
Published on May 29th,  2026 by The SE Staff

Chip Industry Week In Review

 Taiwan, Europe packaging buildout; 2nm ramps; quantum big $; 2 new university hubs; agent honeypots; Samsung strike averted; extreme environment ch...
Published on May 22nd,  2026 by The SE Staff

Chip Industry Week in Review

 Tata-ASML deal; what happened to H200 chips for China? $1.5T IC industry by 2030; new funding; AI memory tools; MRC spec; embedding solar chips in ...
Published on May 15th,  2026 by The SE Staff

Chip Industry Week In Review

 New Taiwan adv. packaging site; M&A activity; GF's CPO solution; Apple looks beyond TSMC; EU chip companies map; strong earnings; MIT's new lidar c...
Published on May 8th,  2026 by The SE Staff

Chip Industry Week in Review

 Google's TPUs now for sale; 2/3nm capacity crunch; IC tool sales to China stopped; memory shortage widens in 2027; mega-earnings; Arm's agentic too...
Published on May 1st,  2026 by The SE Staff

Chip Industry Week In Review

 Marvell's photonics buy; Onto's process control stake; TSMC A14/13 and EDA flows; Apple shuffle; LPDDR6; SOCAMM2 chipset; MATCH Act progress; EUV r...
Published on April 24th,  2026 by The SE Staff

Chip Industry Week In Review

 From shoes to GPUs; super agents; TSMC, ASML results; new chiplets and test facilities; Stanford AI index; photonics deals; compute architecture ha...
Published on April 17th,  2026 by The SE Staff

EDA And IP Numbers Up Again, But Numbers Are More Nuanced

 Q4 numbers reflect strengths and weaknesses in different segments.
Published on April 13th,  2026 by Ed Sperling

Startups

Startup Funding: Q1 2026

 Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.
Published on April 13th,  2026 by Jesse Allen

Startup Funding: Q4 2025

 More and bigger funding rounds for AI chips and AI for making chips; 75 companies raise $3 billion.
Published on January 19th,  2026 by Jesse Allen

Startup Tips To Get From Seed Funding To Series A, B, C

 Everyone has a bright idea about how to save power or boost performance, but how do you make sure your startup lasts the distance?
Published on October 16th,  2025 by Liz Allan

Chip Industry Startup Funding: Q3 2025

 Blowout quarter for AI and quantum; 75 companies raise $6 billion.
Published on October 6th,  2025 by Jesse Allen

Cognichip: Using AI To Speed Complex Chip Design

 Closing the gap between increased complexity and accelerating software innovation.
Published on July 15th,  2025 by Ed Sperling And Emma Riverso

Startup Funding: Q2 2025

 New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.
Published on July 14th,  2025 by Jesse Allen

EDA Startups At DAC 2025

 New challenges and opportunities, many involving AI, spur the launch of new EDA startups.
Published on July 9th,  2025 by Jesse Allen

Baya Systems: Moving Data Faster

 Taking aim at AI bottlenecks based on NoC technology developed by NetSpeed Systems.
Published on June 17th,  2025 by Ed Sperling And Emma Riverso

Startup Funding: Q1 2025

 AI chips and data center communications see big funding; 75 startups raise $2 billion.
Published on April 2nd,  2025 by Jesse Allen

Startup Funding: Q4 2024

 AI chips and interconnects end year on high note; $3 billion for 75 companies.
Published on January 8th,  2025 by Jesse Allen

Chip Industry Stocks*

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Blog Reviews

Blog Review: Jun. 3

 Verification IP; system-technology co-optimization; PCIe 7.0 ordering; design data challenges; process digital twins.
Published on June 3rd,  2026 by Jesse Allen

Blog Review: May 27

 Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.
Published on May 27th,  2026 by Jesse Allen

Blog Review: May 20

 Importing functions in PSS; rethinking server architecture; HBM challenges; heterogeneous integration roadmaps; sparse linear algebra.
Published on May 20th,  2026 by Jesse Allen

Blog Review: May 13

 GPU rasterizer for computational lithography; restructuring techniques; inline memory encryption; automotive electronic stability program.
Published on May 13th,  2026 by Jesse Allen

Blog Review: May 6

 AI data center challenges; C-PHY's 18 wire state mode; changes in CFD; ITA inspection cobot.
Published on May 6th,  2026 by Jesse Allen

Blog Review: Apr. 29

 Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect telemetry; design–manufactur...
Published on April 29th,  2026 by Jesse Allen

Blog Review: Apr. 22

 Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.
Published on April 22nd,  2026 by Jesse Allen

Blog Review: Apr. 15

 eUSB2-V2 advances; capacitor demystification; custom AI chips; GaN chiplet; prompts and infrastructure.
Published on April 15th,  2026 by Jesse Allen

Blog Review: Apr. 8

 LPDDR6; multiphysics for ISO 26262 and complexity; inference stack telemetry; frame rate upscaling.
Published on April 8th,  2026 by Jesse Allen

Blog Review: April 1

 Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet.
Published on April 1st,  2026 by Jesse Allen

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