Special Reports

Intel Vs. Samsung Vs. TSMC

By: Ed Sperling

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
When To Expect Domain-Specific AI Chips

By: Brian Bailey

With the intended application evolving faster than silicon can be developed, optimizing hardware becomes a delicate balance.
3D Metrology Meets Its Match In 3D Chips And Packages

By: Laura Peters

Next-generation tools take on precision challenges in three dimensions.

 more »

Top Stories

Will AI Disrupt EDA?

 It's been decades since there was a disruption within EDA, but AI could change the semi...
July 25th, 2024 By Brian Bailey

Floor-Planning Evolves Into The Chiplet Era

 Automatically mitigating thermal issues becomes a top priority in heterogeneous designs.
July 25th, 2024 By Karen Heyman

What’s Next In System-Level Design?

 As chip complexity rises with disaggregation and chiplets, the design process will beco...
July 25th, 2024 By Ann Mutschler

Legacy Process Nodes Going Strong

 The critical, and growing, significance of mature node chips and processes.
July 23rd, 2024 By Bryon Moyer

Precision Patterning Options Emerge For Advanced Packaging

 Photolithography is still mainstream, but innovative new solutions are coming.
July 23rd, 2024 By Gregory Haley

New Interconnect Metals Need New Dielectrics

 Options emerge for thin films that are viable at the most advanced nodes.
July 23rd, 2024 By Katherine Derbyshire

Heat-Related Issues Impact Reliability In Advanced IC Designs

 Retaining data in memories and processors becomes more difficult as temperatures rise i...
July 18th, 2024 By Ann Mutschler

IC Power Optimization Required, But More Difficult To Achieve

 As chips and systems grow in complexity, power budgets are getting stretched. Just shif...
July 18th, 2024 By Adam Kovac

Data Center Thermal Management Improves

 CFD, multiphysics, and digital twins play increasing role in addressing heat within and...
July 18th, 2024 By Karen Heyman

Managing kW Power Budgets

 Strategies for dealing with increasing compute demands from AI and other applications.
July 17th, 2024 By Ed Sperling

Easing EV Range Anxiety Through Faster Charging

 Solving battery management, utilization, charging and vehicle-to-grid issues is essenti...
July 11th, 2024 By Ann Mutschler

Startup Funding: Q2 2024

 Big rounds for AI chips; 91 startups raise $2.6 billion.
July 10th, 2024 By Jesse Allen

more top stories »

Latest News

Chip Industry Week In Review

 Amkor's $400M advanced packaging funding; SK hynix plans DRAM/HBM fab; rare-earths deal; top technology megatrends; DDR5 standard; chiplet packaging deal; SDV par...
July 26th, 2024 By The SE Staff

Chip Industry Week In Review

 Leading-edge foundry plans; DoD IC center; 300mm funding; Intel's apprenticeship program; metrology and test acquisitions; Keysight's chiplet PHY simulation; ther...
July 19th, 2024 By The SE Staff

more news »



Research

Research Bits: July 22

 Sub-1nm gate; data storage metamaterial; counterfeit chip dete...
By Jesse Allen

Chip Industry Technical Paper Roundup: July 22

 SiC packaging; functional test sequences; 6G and beyond; verif...
By Linda Christensen

Chip Industry Technical Paper Roundup: July 16

 On-chip communication for programmable accelerators; neuromorp...
By Linda Christensen

more research »



Startup Corner

Startup Funding: Q2 2024

 Big rounds for AI chips; 91 startups raise $2.6 billion.
By Jesse Allen

Startup Funding: March 2024

 Investors connect with interconnects; $1.1 billion for 39 comp...
By Jesse Allen

more startups »

Videos

Toward Software-Defined Vehicles

July 24th, 2024

Changes In Formal Verification

July 11th, 2024

Promises And Pitfalls Of SoC Restructuring

June 12th, 2024

Making Adaptive Test Work Better

June 10th, 2024

Knowledge Centers / Entities, people and technologies explored

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