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   Special Reports

Breaking The 2nm Barrier

By: Mark LaPedus

New interconnects and processes will be required to reach the next process nodes.
Design For Reliability

By: Brian Bailey

How long a chip is supposed to function raises questions design teams need to think abo...
Why Improving Auto Chip Reliability Is So Hard

By: Susan Rambo

Aging, adaptation, and new processes and technology require big changes on every level.

 more »

Top Stories

Making Sense Of New Edge-Inference Architectures

How to navigate a flood of confusing choices and terminology.

Auto OEMs Face New Competitive Threats

EVs are creating openings for non-traditional players, creating havoc in the supply chain.

Security Provisioning Moves Out Of The Factory

Programmable options could have big impact on supply chain readiness.

Chiplets For The Masses

Chiplets are technically and commercially viable, but not yet accessible to the majorit...

Predicting And Avoiding Failures In Automotive Chips

Experts at the Table: New approaches rely on more and better data, but it also requires...

Startup Funding: February 2021

22 startups raise over $1.2B.

Firmware Skills Shortage

Adding intelligence into devices requires a different skill set, and finding enough qua...

When Is Verification Done?

The actual time may be more of a fuzzy risk assessment than a clear demarcation.

Big Challenges In Verifying Cyber-Physical Systems

Experts at the Table: Models and standards are rare and insufficient, making it difficu...

Part Average Tests For Auto ICs Not Good Enough

Advanced node chips and packages require additional inspection, analysis and time, all ...

Brazil Paves New Semiconductor Path

After failing in the fab race, the country has started focusing on less capital-intensi...

Shortages, Challenges Engulf Packaging Supply Chain

Innovative business models emerge, but so does possibility of consolidation.

more top stories »

Latest News

Week In Review: Manufacturing, Test

AI strategy report; L3 driving; China tool sales; dry resists;...

Week In Review: Design, Low Power

HDL-aware IDE; RISC-V Crypto test suites; eFPGAs for DARPA pro...

Week In Review: Auto, Security, P...

proteanTecs chip telemetry in with TSMC; Infineon WiFI 6; rock...

Blog Review: March 3

Verification with Python; extended clock frequencies in LPDDR5...

more news »



Research

Manufacturing Bits: March 2

Next-gen AFM; scanning probe lithography; new litho books.

Power/Performance Bits: March 2

Fast-charging EV battery; DNA origami nanowires; tiling nanosh...

Manufacturing Bits: Feb. 23

Space crystals; edge computing in space; Mars metrology.

more research »



Startup Corner

Startup Funding: February 2021

22 startups raise over $1.2B.

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Security In FPGAs And SoCs



Securing ICs With Information Flow Analysis



Data Overload In The Data Center



IP Safe Enough To Use In Cars

Knowledge Centers / Entities, people and technologies explored