Special Reports

5/3nm Wars Begin

By: Mark LaPedus

New transistors structures are on the horizon with new tools and processes, but there a...
Automakers Changing Tactics On Reliability

By: Susan Rambo

Focus shifts to more data-centric approaches as chip content increases.
Defining And Improving AI Performance

By: Brian Bailey

What does performance mean when discussing artificial intelligence? Many minds are work...

 more »

Top Stories

SiC Foundry Business Emerges

 Will a fabless approach work in the power semi market?
January 23rd, 2020 By Mark LaPedus

Finding Defects In EUV Masks

 New litho technology is in production, but not everything is working perfectly yet.
January 23rd, 2020 By Mark LaPedus

Non-Volatile Memory Tradeoffs Intensify

 Why NVM is becoming so application-specific and what the different options are.
January 22nd, 2020 By Ann Steffora Mutschler

Determining What Really Needs To Be Secured In A Chip

 Experts at the Table: Why previous approaches at security have only limited success.
January 20th, 2020 By Ed Sperling

Analog: Avoid Or Embrace?

 Data converters are required whenever you move between the analog and digital domains, ...
January 16th, 2020 By Brian Bailey

Priorities Shift In IC Design

 AI, edge applications are driving design teams to find new ways to achieve the best per...
January 16th, 2020 By Ann Steffora Mutschler

Moore’s Law, Supply Chains And Security

 Big changes ahead, from design to deployment.
January 16th, 2020 By Brian Bailey

Uses And Limitations Of AI In Chip Design

 OneSpin's CEO explains what's changing in AI, where it's being used, and what still has...
January 15th, 2020 By Ed Sperling

Making 3D Structures And Packages More Reliable

 Challenges and solutions for finding defects in new structures and multi-chip integrati...
January 14th, 2020 By Ed Sperling

Big Growth Areas: Connectivity, AI, Reliability

 Where the chip industry is heading this year, and where the biggest fallout will occur.
January 14th, 2020 By Brian Bailey

Auto Industry Shifts Gears On Where Data Gets Processed

 How to manage massive amounts of data in real time still isn't clear, but it can't be d...
January 9th, 2020 By Ann Steffora Mutschler

Security Risks In The Supply Chain

 Trojans, a dual supply chain and industry consolidation are creating new threats for ch...
January 9th, 2020 By Ed Sperling

more top stories »

Latest News

Blog Review: Jan. 22

 Social engineering; GDS to OASIS; persistence of memories; cab...
January 22nd, 2020 By Jesse Allen

Week In Review: Manufacturing, Test

 ISS recap; deposition sensors; NuFlare saga; TSMC.
January 17th, 2020 By Mark LaPedus

Week In Review: Design, Low Power

 AWR & eSilicon acquisitions finalized; MIPI I3C update and fut...
January 17th, 2020 By Jesse Allen

Week In Review: IoT, Security, Autos

 Apple acquiring edge AI startup; Cadence and Broadcom on to 5n...
January 17th, 2020 By Susan Rambo

more news »



Research

Manufacturing Bits: Jan. 21

 New high-frequency transistors; exotic 5G materials.
By Mark LaPedus

Power/Performance Bits: Jan. 21

 Two-layer MRAM; perfect secrecy; self-healing batteries.
By Jesse Allen

Manufacturing Bits: Jan. 13

 Plastic gold; atomic gold pyramids; gold outlook.
By Mark LaPedus

more research »



Startup Corner

November 2019 Startup Funding

 Sixteen startups attracted funding rounds of nine figures in N...
By Jeff Dorsch

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


How Chips Age

January 20th, 2020


Network Storage Optimization For IP

January 20th, 2020


Bridging Math And Engineering In ML

January 8th, 2020


Scan Diagnosis

December 20th, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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