Special Reports

How Metrology Tools Stack Up In 3D NAND Devices

By: Laura Peters

Buried features and re-entrant geometries drive application-specific metrology solutions.
Data Leakage Becoming Bigger Issue For Chipmakers

By: Ed Sperling

Increasing complexity, disaggregation, and continued feature shrinks add to problem; oversight is scant.
Nanoimprint Finally Finds Its Footing

By: Gregory Haley

Technology and business issues mean it won't replace EUV, but photonics, biotech and other markets provide plenty of room for g...

 more »

Top Stories

Developing An Unbreakable Cybersecurity System

New approaches are in research, but threats continue to grow.

Security Becomes Much Bigger Issue For AI/ML Chips, Tools

Lack of standards, changing algorithms and architectures, and ill-defined metrics open ...

How Many Sensors For Autonomous Driving?

Sensor technologies are still evolving, and capabilities are being debated.

Software-Defined Hardware Architectures

Hardware-software co-design is established, but the migration to multiprocessor systems...

Chiplet Planning Kicks Into High Gear

Issues involving design, manufacturing, packaging, and observability all need to be sol...

Chip Design CEO Outlook

Challenges and opportunities involving heterogeneous integration, geopolitics, and AI.

IP Becoming More Complex, More Costly

The IP industry is undergoing several transformations that will make it difficult for n...

Automotive Relationships Shifting With Chiplets

As the automotive ecosystem balances the best approaches for designing in increasingly ...

Chips Getting More Secure, But Not Quickly Enough

Awareness about potential vulnerabilities is increasing, but so is the complexity with ...

Etch Processes Push Toward Higher Selectivity, Cost Control

Etching tools are becoming more application-specific, with each new node requiring high...

Challenges Grow For Creating Smaller Bumps For Flip Chips

Pitches continue to decrease, but new tooling and technologies are required.

Managing Yield With EUV Lithography And Stochastics

How overlay, roughness and edge placement contribute to yield.

more top stories »

Latest News

Week In Review: Semiconductor Manufacturing, Test

Japan and U.S. joint IC roadmap; China-South Korea cooperation...

Week In Review: Auto, Security, Pervasive Computing

Arm Total Compute 2023; Tenstorrent, LG AI chips; DOT $52M on ...

Week In Review: Design, Low Power

Arm mobile platform; making software for RISC-V; GPU AI superc...

Blog Review: May 31

PSS in ATE; UFS 4.0; power module cooling; Matter updates.

more news »


Research Bits: May 30

Promising hybrid qubits; microwave qubits entangling with opti...

Research Bits: May 23

DNA-based molecular computing; molecular teamwork in organic s...

Chip Industry’s Technical Paper Roundup: May 23

Edge with RISC-V and HW accelerators; RL-guided routing; memor...

more research »

Startup Corner

Startup Funding: April 2023

Packaging and inspection companies draw funding; 124 startups ...

Startup Funding: March 2023

AI in the sensor, photonic packaging, freight ADAS funding; 12...

more startups »


Challenges In 5G/6G Packaging

LPDDR Flash In Automotive

Challenges In Writing SDC Constraints

Programmable General-Purpose I/O

Knowledge Centers / Entities, people and technologies explored