Special Reports

Government Chip Funding Spreads Globally

By: Liz Allan

Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.
Partitioning In The Chiplet Era

By: Ann Mutschler

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
Using AI To Glue Disparate IC Ecosystem Data

By: Ed Sperling and Ann Mutschler

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need...

 more »

Top Stories

Security Concerns Weigh Down Open-Source EDA

 Issues vary by application and how and where it's used, but many tools already contain ...
October 10th, 2024 By Adam Kovac

Challenges In Reducing Wireless Latency

 New protocols and technology will spur a whole new wave of chips, but those designs wil...
October 10th, 2024 By Karen Heyman

Managing Legacy In Automotive

 As vehicle technology evolves, carmakers must decide which technologies move forward an...
October 10th, 2024 By Ann Mutschler

The Cost Of EDA Data Storage And Processing Efficiency

 Sustainability in the EDA process is less about the environment and more about preservi...
October 9th, 2024 By Adam Kovac

Preparing For Ferroelectric Devices

 Managing crystal structure for ferroelectric performance.
October 2nd, 2024 By Katherine Derbyshire

Barriers To Chiplet Sockets

 Perfection sometimes stands in the way of progress, and there is evidence this may be h...
September 30th, 2024 By Brian Bailey

RAG-Enabled AI Stops Hallucinations, Adds Sources

 New GenAI method enables better answers and performs more functions.
September 26th, 2024 By Karen Heyman

Pressure Builds To Adopt Virtual Prototypes

 Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but...
September 26th, 2024 By Brian Bailey

Devising Security Solutions For Hardware Threats

 Keeping up with attackers is proving to be a major challenge with no easy answers; trai...
September 25th, 2024 By Adam Kovac

Optimizing Wafer Edge Processes For Chip Stacking

 Several critical processes address wafer flatness, wafer edge defects and what's needed...
September 23rd, 2024 By Laura Peters

How Die Dimensions Challenge Assembly Processes

 Chiplet-based products must accommodate small differences in die size and bump pitch, p...
September 19th, 2024 By Anne Meixner

New Materials Are in High Demand

 Development methodologies combine old and new techniques, but getting any new material ...
September 19th, 2024 By Bryon Moyer

more top stories »

Latest News

Chip Industry Week In Review

 Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; A...
October 11th, 2024 By The SE Staff

Blog Review: Oct. 9

 ECAD-MCAD collaboration; AXI4 locking mechanism; SRAM PUF; ADAS challenges; gate resistance; Gemini AI’s network comms.
October 9th, 2024 By Liz Allan

more news »



Research

Research Bits: Oct. 8

 Materials: Soft, flexible polymer semiconductors; photonic top...
By Liz Allan

Chip Industry Technical Paper Roundup: Oct. 8

 Low-power electronics roadmap; preventing Rowhammer via memory...
By Linda Christensen

Research Bits: Oct. 1

 Rust-resistant coating for 2D semiconductors; polymeric materi...
By Liz Allan

more research »



Startup Corner

Startup Funding: Q2 2024

 Big rounds for AI chips; 91 startups raise $2.6 billion.
By Jesse Allen

Startup Funding: March 2024

 Investors connect with interconnects; $1.1 billion for 39 comp...
By Jesse Allen

more startups »

Videos

Working With Chiplets

October 2nd, 2024

Data Routing In Heterogeneous Chip Designs

September 30th, 2024

Emerging Technologies Driving Heterogeneous Integration

September 24th, 2024

Real-Time Safety Monitoring

August 28th, 2024

Knowledge Centers / Entities, people and technologies explored

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