Special Reports

What Makes A Chip Tamper-Proof?

By: Bryon Moyer

Identifying attacks and protecting against them is still difficult, but there has been ...
The Good And Bad Of Chiplets

By: Mark LaPedus

IDMs leverage chiplet models, others are still working on it.
‘More Than Moore’ Reality Check

By: Ann Steffora Mutschler

Multi-chip design is becoming more mainstream, but gaps remain.

 more »

Top Stories

Data Strategy Shifting Again In Cars

 How and where vehicle data gets processed continues to evolve.
June 4th, 2020 By Ann Steffora Mutschler

Conflicting Demands At The Edge

 Experts at the Table: Cost, power and security clash with the need for intelligence, l...
June 4th, 2020 By Ed Sperling

The Increasingly Ordinary Task Of Verifying RISC-V

 Integrating an open-source core into a complex SoC is looking very familiar.
June 3rd, 2020 By Ann Steffora Mutschler

(Artificially) Intelligent Verification

 While it seems like an obvious application, utilizing data for verification is highly n...
June 1st, 2020 By Brian Bailey

What’s So Important About Processor Extensibility?

 Designers must carefully weigh the gains against the costs, many of which are not immed...
May 28th, 2020 By Brian Bailey

FPGA Prototyping Complexity Rising

 Partitioning of blocks into manageable pieces is becoming harder, but new tools and app...
May 28th, 2020 By Ann Steffora Mutschler

What Will The Next-Gen Verification Flow Look Like?

 Experts at the Table: Machine learning is an essential element for dealing with complex...
May 28th, 2020 By Ed Sperling

Latest IC Outlook: More Uncertainty

 Analysis: Downturn is likely, but there are some bright spots.
May 26th, 2020 By Mark LaPedus

EUV’s Uncertain Future At 3nm And Below

 Manufacturing chips at future nodes is possible from a technology standpoint, but that'...
May 21st, 2020 By Mark LaPedus

Challenges In Stacking, Shrinking And Inspecting Next-Gen Chips

 One-on-one with Lam CTO Rick Gottscho.
May 21st, 2020 By Ed Sperling and Mark LaPedus

Compute-In Memory Accelerators Up-End Network Design Tradeoffs

 Compute paradigm shifting as more data needs to be processed more quickly.
May 21st, 2020 By Katherine Derbyshire

Design For Narrowband IoT

 The challenge of creating chips for ultra-low-power applications with long lifetimes an...
May 20th, 2020 By Ann Steffora Mutschler

more top stories »

Latest News

Week In Review: Manufacturing, Test

 U.S. rare earth setback; NI buys OptimalPlus; inverse litho.
June 5th, 2020 By Mark LaPedus

Week In Review: Design, Low Power

 Complete USB4 IP; Wi-Fi 6 IP for low-power; SweRV support; ana...
June 5th, 2020 By Jesse Allen

Week In Review: Auto, Security, P...

 HPCs for COVID-19 researchers; European AWS? China's IoT medic...
June 5th, 2020 By Susan Rambo

Blog Review: June 3

 Automotive Ethernet; quality software; MACsec explained.
June 3rd, 2020 By Jesse Allen

more news »



Research

Manufacturing Bits: June 2

 EUV lithography in outer space; chemistry in space.
By Mark LaPedus

Power/Performance Bits: June 2

 Neuromorphic memristor; hot qubits.
By Jesse Allen

Manufacturing Bits: May 26

 7-level nanosheets; next-gen HBMs; artificial iris.
By Mark LaPedus

more research »



Startup Corner

Startup Funding: April 2020

 Twenty-two startups drew $375M in April, with a big win for se...
By Jesse Allen

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Ensuring HBM Reliability

May 27th, 2020


Cleaning Data For Final Test

May 20th, 2020


Rising Packaging Complexity

May 19th, 2020


PCIe 5.0 Drill-Down

April 1st, 2020

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Bryon Moyer

Bryon Moyer

Technology Editor
Andy Patrizio

Andy Patrizio

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

About

Navigation

Connect With Us

Copyright ©2013-2020 SMG   |  Terms of Service  |  Privacy Policy