Special Reports

Emerging Apps And Challenges For Packaging

By: Mark LaPedus

Heterogeneous integration is reshaping some markets, but not all applications require it.
The Next Big Leap: Energy Optimization

By: Brian Bailey

What's required to optimize your design for energy? The simple answer is a new EDA flow...
A Renaissance For Semiconductors

By: Brian Bailey

New horizontal technologies and vertical markets are fueling the opportunities for mass...

 more »

Top Stories

EUV Challenges And Unknowns At 3nm and Below

 Rising costs, complexity, and fuzzy delivery schedules are casting a cloud over next-ge...
November 19th, 2020 By Mark LaPedus

Bonding Issues For Multi-Chip Packages

 Disaggregation solves some problems, but it creates new ones.
November 19th, 2020 By Katherine Derbyshire

What’s Next In AI, Chips And Masks

 The impact of deep learning and new technology on scaling to future nodes.
November 19th, 2020 By Mark LaPedus

Uniquely Identifying PCBs, Subassemblies, And Packaging

 New approaches to preventing counterfeiting across the supply chain.
November 18th, 2020 By Bryon Moyer

Disaggregation And Smarter Chips Shift Liability For Security

 Chiplets and more data storage in hardware are making security a first-order problem fo...
November 17th, 2020 By Ed Sperling

Designs Beyond The Reticle Limit

 Chips are hitting technical and economic obstacles, but that is barely slowing the rate...
November 12th, 2020 By Brian Bailey

Dealing With Sub-Threshold Variation

 The value and challenges of circuits being not quite on or off.
November 12th, 2020 By Bryon Moyer

Difficult Memory Choices In AI Systems

 Tradeoffs revolve around power, performance, area, and bandwidth.
November 12th, 2020 By Ann Steffora Mutschler

Challenges Linger For EUV

 Experts at the Table: The challenges of putting EUV into production, and why DRAM will ...
November 11th, 2020 By Mark LaPedus

Adaptive Test Gains Ground

 Demand for improved quality at a reasonable cost is driving big changes in test processes.
November 10th, 2020 By Anne Meixner

Does HW Vs. SW Choice Affect Quality And Reliability?

 Tradeoffs become more important as designs become more complex, more critical, and more...
November 10th, 2020 By Bryon Moyer

Chips Good Enough To Bet Your Life On

 Experts at the Table: Strategies for improving automotive semiconductors.
November 10th, 2020 By Ed Sperling

more top stories »

Latest News

Week In Review: Manufacturing, Test

 PDF buys Cimetrix; maskless litho; OSAT ranking; TSMC fab.
November 20th, 2020 By Mark LaPedus

Week In Review: Design, Low Power

 Synopsys buys optical measurement company; PSS 2.0 draft; Arm-...
November 20th, 2020 By Jesse Allen

Week In Review: Auto, Security, P...

 Pervasive computing in IC manufacturing; Synopsys security; Ar...
November 20th, 2020 By Susan Rambo

Blog Review: Nov. 18

 Mobile holograms; auto ECU consolidation; NAND flash; IoT soft...
November 18th, 2020 By Jesse Allen

more news »



Research

Power/Performance Bits: Nov. 23

 Graphene energy; vanillin grid batteries.
By Jesse Allen

Manufacturing Bits: Nov. 17

 Intel’s gate-all-around FETs; vacuum transistors; 3D ICs.
By Mark LaPedus

Power/Performance Bits: Nov. 17

 NVMe controller for research; more accurate DNNs; photonic ult...
By Jesse Allen

more research »



Startup Corner

Startup Funding: October 2020

 Big funding for ADAS, autonomous driving, and EVs; twenty-four...
By Jesse Allen

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


112 SerDes Reliability

October 5th, 2020


Chip Challenges At 3/2nm

September 15th, 2020


AI Inference Acceleration

September 14th, 2020


Memory Access In AI Systems

July 27th, 2020

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Bryon Moyer

Bryon Moyer

Technology Editor
Andy Patrizio

Anne Meixner

Consulting Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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