Special Reports

Security Holes In Machine Learning And AI

By: Ed Sperling

A primary goal of machine learning is to use machines to train other machines. But what...
Big Trouble At 3nm

By: Mark LaPedus

Costs of developing a complex chip could run as high as $1.5B, while power/performance ...
FPGAs Becoming More SoC-Like

By: Ann Steffora Mutschler

Lines blur as processors are added into traditional FPGAs, and programmability is added...

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Top Stories

Data Center Power Poised To Rise

Shift to cloud model has kept power consumption in check, but that benefit may have run...

5nm Design Progress

Improvements in power, performance and area are much more difficult to achieve, but sol...

Architecting For AI

Experts at the Table, part 1: What kind of processing is required for inferencing, what...

Five DAC Keynotes

Thought-provoking talks about the future of technology, how to improve it, and what it ...

Bridges Vs. Interposers

Momentum growing for low-cost alternatives to interposers as a way of reducing overall ...

How To Test Autonomous Vehicles

New technologies, methodologies and flows will be required to guarantee self-driving ca...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testi...

Verification As A Flow

Experts at the Table, part 2: How did Portable Stimulus get its name, and will it repla...

Getting To The Self-Driving Car

There is still much work to be done, but that hasn't dampened the buzz around it.

FPGAs Drive Deeper Into Cars

Automotive OEMs are leveraging programmability for algorithms, evolving safety standard...

Regulations Trail Autonomous Vehi...

Chipmakers will continue to benefit, but it will be a long road until autonomous vehicl...

Design Reuse Vs. Abstraction

IP reuse has reduced the urgency for a higher level of abstraction in complex system-le...

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Latest News

Blog Review: July 18

DFI 5.0; embedded security; MEMS & sensors growth; sensor fusion.

Week In Review: Manufacturing, Test

FD-SOI bonanza; KLA-Tencor’s tools; equipment forecast.

Week in Review: IoT, Security, Auto

Daimler-Bosch deal; AT&T buys AlienVault; NI and Spirent.

Week In Review: Design, Low Power

Intel buys eASIC; electromagnetic risk analysis; photonics PDK.

more news »


Manufacturing Bits: July 16

Levitating metrology; better levitation; NY design effort.

System Bits: July 16

Synthetic biomolecular circuits; molecular clocks, electronics.

Power/Performance Bits: July 16

Bacterial solar; infrared rectenna; boron arsenide's thermal c...

more research »

Startup Corner

Syntiant: Analog Deep Learning Chips

Intel Capital funds startup to put AI in low-power mobile devi...

more startups »


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Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.


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