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   Special Reports

Where All The Semiconductor Investments Are Going

By: Ed Sperling

Details on more than $500B in new investments by nearly 50 companies; what's behind the expansion frenzy, why now, and challeng...
SiPs: The Best Things in Small Packages

By: Laura Peters

Better materials and processes enable smaller, higher performing systems-in-package.
What’s Different About Next-Gen Transistors

By: Katherine Derbyshire

Advanced etch holds key to nanosheet FETs; evolutionary path for future nodes.

 more »

Top Stories

Improving Concurrent Chip Design, Manufacturing, And Test Flows

Realizing the benefits of digital twins is more complicated than translating data betwe...

Is UCIe Really Universal?

Why developing a multi-vendor standard for plug-and-play chiplets is so difficult.

EDA Tools For Quantum Chips

Quantum doesn’t always follow normal design rules; many unknowns remain.

The Drive Toward Virtual Prototypes

Prototypes are transforming rapidly to take on myriad tasks, but they are hampered by a...

Challenges In Backside Power Delivery

BPD boosts performance, but requires wafer bonding, substrate thinning, and possibly ne...

Hot Trends In Semiconductor Thermal Management

Cooler bonding, microfluidics, and engineered TIMs help get the heat out.

On-Chip Power Distribution Modeling Becomes Essential Below 7nm

Why and when it's needed, and what tools and technologies are required.

Improving Reliability In Automobiles

Focus turns toward predictive and preventive maintenance, with an emphasis on resilienc...

Taking Power Much More Seriously

Without the benefits of scaling to help reduce power consumption, design teams must tak...

Solving Thermal Coupling Issues In Complex Chips

Challenges mount, especially in 3D-ICs and chips developed at leading-edge nodes.

Balancing Power And Heat In Advanced Chip Designs

Both need to be dealt with at all stages of the design flow. Why it's now everyone's pr...

Weird Incidents Reveal L5 Challenges

Overcoming glitches and consumer reluctance will require disruptive technology.

more top stories »

Latest News

Blog Review: Nov. 23

FPGA verification effort; linting testbench code; memory prote...

Week In Review: Semiconductor Manufacturing, Test

Upcoming fall-out from U.S. trade controls, ASML considering M...

Week In Review: Auto, Security, Pervasive Computing

Stellantis buys aiMotive, MOU with Infineon; Tesla airbag OTA;...

Week In Review: Design, Low Power

Infineon, Stellantis CoolSiC MOU; DOE's 10 EV battery reuse R&...

more news »



Research

Research Bits: Nov. 21

Graphene heater for phase-change switches; silicon defects for...

Chip Industry’s Technical Paper Roundup: Nov. 21

New papers: lithography modeling; solving Rowhammer; energy-ef...

Research Bits: Nov. 15

Low temperature 3D bonding; ultrathin barium titanate capacito...

more research »



Startup Corner

Startup Funding: October 2022

113 startups raise $3.5B; batteries, AI, and new architectures...

more startups »

Videos

Heterogeneous Integration Issues And Developments


Why Changes In Computing Are Driving Changes In Photomasks


HBM3 In The Data Center


Using eFPGAs for Security

Knowledge Centers / Entities, people and technologies explored