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   Special Reports

Keeping IC Packages Cool

By: Laura Peters and Karen Heyman

Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Chip Substitutions Raising Security Concerns

By: Ed Sperling

Lots of unknowns will persist for decades across multiple market segments.
How To Optimize A Processor

By: Brian Bailey

There are at least three architectural layers to processor design, each of which plays a significant role.

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Top Stories

IC Reliability Burden Shifts Left

Challenges are changing for engineering teams, and they are crossing traditional bounda...

Why Hardware-Dependent Software Is So Critical

It may not be the most glamorous type of software development, but getting it right is ...

EDA Embraces Big Data Amid Talent Crunch

Need for higher productivity to compensate for talent shortages finally forces change.

What Quantum Batteries Have in Store

Why this technology could have a big impact on EV charging times.

Power Domain Implementation Challenges Escalate

More power domains are adding to chip complexity. Doing more throughout the design flow...

Ways To Address The Materials Crunch

From neon gas to tool components, the industry is creating more resilient supply chains.

Variation Making Trouble In Advanced Packages

Disaggregating SoCs into multiple chips introduces potential issues that may take years...

High-NA EUV May Be Closer Than It Appears

Tools are coming, but advanced resists and masks need to keep pace.

Chips Can Boost Malware Immunity

Building security into hardware, and utilizing best practices, can make it much harder ...

Audio, Visual Advances Intensify IC Design Tradeoffs

New features highlight need for better tools, faster PHYs, more standards, and a lot of...

Can Analog Make A Comeback?

The industry reached an inflection point where analog is getting a fresh look, but digi...

DRAM Thermal Issues Reach Crisis Point

Increased transistor density and utilization are creating memory performance issues.

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Latest News

Week In Review: Manufacturing, Test

Intel's Ohio fab buildout warning; GF fab; Intel's New Mexico ...

Week In Review: Design, Low Power

New RISC-V specifications; quantum security for RISC-V; physic...

Week In Review: Auto, Security, P...

NHTSA wants 20 seconds from auto black boxes; MIT open-source ...

Blog Review: June 22

Microarchitectural security; high-NA EUV; fault simulation; PC...

more news »



Research

Technical Paper Round-Up: June 21

Processing in-memory; flexible microprocessors; graphene nanor...

Research Bits: June 21

Security: Side-channel protection for edge AI; silk PUF; skyrm...

Technical Paper Round-up: June 14

GAA; CIM architecture; MIT's AI Chip; hybrid bonding; wafer de...

more research »



Startup Corner

Startup Funding: May 2022

FPGAs, CPUs, and equipment receive funding in China; 98 startu...

more startups »

Videos

Speeding Up Algorithms


Better Video Compression


Common Weakness Enumeration


Moving Intelligence To The Edge

Knowledge Centers / Entities, people and technologies explored