Special Reports

HBM Issues In AI Systems

By: Brian Bailey

Speeding up memory reveals new challenges, especially when memory is part of the package.
Chiplet Momentum Rising

By: Mark LaPedus

Companies and organizations racing to define interfaces and standards as SoC scaling co...
Moving To GAA FETs

By: Katherine Derbyshire

Why finFETs are running out of steam, and what happens next.

 more »

Top Stories

Why It’s So Hard To Create New Processors

 Many companies are interested in developing their own processors, following the success...
March 26th, 2020 By Brian Bailey

Software-Defined Hardware Gains Ground — Again

 AI applications are prompting chipmakers to take another look at different options for ...
March 26th, 2020 By Ann Steffora Mutschler

Do You Trust Your IP Supplier?

 How secure is the IP that you are integrating into your system? Accellera wants to help...
March 26th, 2020 By Brian Bailey

What Machine Learning Can Do In Fabs

 Experts at the Table: It's not as accurate as simulation, but it's a lot faster.
March 25th, 2020 By Mark LaPedus

Memory Issues For AI Edge Chips

 In-memory computing becomes critical, but which memory and at what process node?
March 23rd, 2020 By Mark LaPedus

Improving EUV Process Efficiency

 New materials and equipment could have a significant impact on both cost and speed.
March 19th, 2020 By Mark LaPedus

Scaling Up Compute-In-Memory Accelerators

 New research points to progress and problems in a post-von Neumann world.
March 19th, 2020 By Katherine Derbyshire

The Ins And Outs Of Silicon Carbide

 Cree's CTO explains the different characteristics of silicon and SiC and where each one...
March 19th, 2020 By Ed Sperling

Designing Resilient Electronics

 Eliminating downtime in safety- and mission-critical applications.
March 18th, 2020 By Ann Steffora Mutschler

HBM Issues In AI Systems

 Speeding up memory reveals new challenges, especially when memory is part of the package.
March 16th, 2020 By Brian Bailey

Power Management Becomes Top Issue Everywhere

 Concerns about power are impacting everything, and AI is complicating it.
March 12th, 2020 By Ann Steffora Mutschler

Power Challenges In ML Processors

 Machine learning engines present some new power challenges that could trip up the unwar...
March 12th, 2020 By Brian Bailey

more top stories »

Latest News

Week In Review: Manufacturing, Test

 Foundry rankings; EUV DRAMs; ASE-SPIL clear hurdle.
March 27th, 2020 By Mark LaPedus

Week In Review: Auto, Security, P...

 COVID robotics; work from home security; Ethernet 800G.
March 27th, 2020 By Susan Rambo

Week In Review: Design, Low Power

 VIP for Ethernet 800G; PCB design for students; EDA revenue up...
March 27th, 2020 By Jesse Allen

Blog Review: March 25

 Memory for AI; PCIe Gen6; embedded software source code.
March 25th, 2020 By Jesse Allen

more news »



Research

Manufacturing Bits: March 24

 Autonomous microscopes; nanoindentation; AI tomography.
By Mark LaPedus

Power/Performance Bits: March 24

 Backscatter Wi-Fi radio; preventing IoT side-channel attacks; ...
By Jesse Allen

Manufacturing Bits: March 17

 Making MXenes; macroscopic MXenes.
By Mark LaPedus

more research »



Startup Corner

Startup Funding: February 2020

 From photoresists to LIDAR, 14 startups brought in $1B this mo...
By Jesse Allen

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


EDA In The Cloud

February 17th, 2020


Where Timing And Voltage Intersect

February 13th, 2020


Automotive Chip Design Workflow

February 16th, 2020


Changes In AI SoCs

February 11th, 2020

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Bryon Moyer

Bryon Moyer

Technology Editor
Andy Patrizio

Andy Patrizio

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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