Special Reports

Chiplet Momentum Builds, Despite Tradeoffs

By: Brian Bailey

Pre-characterized tiles can move Moore's Law forward, but it's not as easy as it looks.
5G Heats Up Base Stations

By: Kevin Fogarty

Inefficient conversion of RF to digital and continuous connectivity issues are causing ...
The Case For Embedded FPGAs Strengthens And Widens

By: Brian Bailey

Combining the flexibility of a FPGA with the performance and cost benefits of an SoC is...

 more »

Top Stories

Is ADAS The Edge?

 Uncertainty about where processing will occur is causing confusion over definitions.
May 16th, 2019 By Ann Steffora Mutschler

Incremental System Verification

 Experts at the table: Part 2. How does a PSS model get verified and who will create tha...
May 16th, 2019 By Brian Bailey

Can The Hardware Supply Chain Remain Secure?

 The growing number of threats are cause for concern, but is it really possible to slip ...
May 15th, 2019 By Andy Patrizio

The Growing Uncertainty Of Sign-Off At 7/5nm

 Checking the electrical characteristics of circuits is becoming much more challenging.
May 9th, 2019 By Ann Steffora Mutschler

The Limits Of Energy Harvesting

 Why the promise of unlimited power in end devices has achieved only spotty success.
May 9th, 2019 By Ed Sperling and Kevin Fogarty

Raising The Abstraction Level For Power

 Finding the right abstraction for power analysis and optimization comes from tool integ...
May 9th, 2019 By Brian Bailey

EUV Mask Gaps And Issues

 Experts at the Table, part 2: EUV mask tools are ready, but pellicles and turnaround ti...
May 8th, 2019 By Mark LaPedus

Challenges In Making And Testing STT-MRAM

 Next-gen memory offers speed of SRAM and unlimited endurance, but it's not a simple tec...
May 7th, 2019 By Mark LaPedus

Gaps Emerge In Automotive Test

 Reliability requires different parts to work in sync, and much more time-consuming test...
May 7th, 2019 By Ed Sperling

Make Your Own Energy

 Efficient use of power and energy in electric vehicles and smart buildings will require...
May 2nd, 2019 By Ann Steffora Mutschler

Creating A Roadmap For Hardware Security

 Government and private organizations developing blueprints for semiconductor industry a...
May 2nd, 2019 By Kevin Fogarty and Ed Sperling

April Startup Funding: Corporate Gushers

 Money pours into startups with more big investments on the way.
May 2nd, 2019 By Jeff Dorsch

more top stories »


Latest News

HPE to Buy Cray in $1.3B Deal

 Exascale computing could put HPE on a strong footing for gover...
May 17th, 2019 By Jeff Dorsch

Week In Review: Manufacturing, Test

 Intel regains top spot in IC rankings; best tool vendors; SiC.
May 17th, 2019 By Mark LaPedus

Week in Review: IoT, Security, Auto

 Verizon’s NB-IoT; Intel bug; auto tariffs.
May 17th, 2019 By Jeff Dorsch

Week In Review: Design, Low Power

 SLAM DSP; DPU for VR; protocol debugging.
May 17th, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: May 14

 Radiation thermometers; laser welding; AI standards.
By Mark LaPedus

System Bits: May 14

 Faster supercomputers; quantum advances.
By Jeff Dorsch

Power/Performance Bits: May 14

 Detecting malware; colorful LEDs; supercomputer load balancing.
By Jesse Allen

more research »



Startup Corner

Uhnder: Digital Radar Chips

 Startup developed a single-chip solution that will dramaticall...
By Ed Sperling

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Latency Under Load: HBM2 vs. GDDR6

May 9th, 2019


New Challenges For Data Centers

May 7th, 2019


Automotive System Design

May 6th, 2019


Improving Edge Inferencing

May 2nd, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

About

Navigation

Connect With Us

Copyright ©2013-2019 SMG   |  Terms of Service  |  Privacy Policy