Special Reports

3D NAND Flash Wars Begin

By: Mark LaPedus

Market overcrowding, more efficient manufacturing, and growing list of scaling issues c...
Auto Chip Test Getting Harder

By: Kevin Fogarty

Each new level of assistance and autonomy adds new requirements and problems, some of w...
Safety, Security And PPA Tradeoffs

By: Brian Bailey

The number of critical design metrics is expanding, but the industry still grapples wit...

 more »

Top Stories

Next-Gen Memory Ramping Up

 At least 5 technologies are in the running, with 3D XPoint leading the pack.
August 16th, 2018 By Mark LaPedus

Inspecting Unpatterned Wafers

 Finding smaller defects earlier is becoming more difficult and expensive.
August 16th, 2018 By Mark LaPedus

Big Shifts In Tech Conferences

 New technologies and trends have created an explosion of shows; some attempt to go broa...
August 16th, 2018 By Ed Sperling

Old Vs. New Packages

 Two packaging technologies are making microchips smaller and more durable.
August 15th, 2018 By Jeff Dorsch

Where FD-SOI Works Best

 Experts at the Table, part 2: Why FD-SOI is being used alongside finFETs and other tech...
August 15th, 2018 By Ed Sperling

AI Architectures Must Change

 Using the Von Neumann architecture for artificial intelligence applications is ineffici...
August 13th, 2018 By Brian Bailey

Do Parallel Tools Make Sense?

 Experts at the Table, part 2: What can be done instead? And why are companies reluctant...
August 10th, 2018 By Brian Bailey

Chip Aging Becomes Design Problem

 Assessing the reliability of a device requires adding more physical factors into the an...
August 9th, 2018 By Brian Bailey

More Processing Everywhere

 Arm's CEO contends that a rise in data will fuel massive growth opportunities around AI...
August 9th, 2018 By Ed Sperling

Process Variation Not A Solved Issue

 Experts at the Table: Biggest issues with process variation today, and its impacts on t...
August 9th, 2018 By Ann Steffora Mutschler

$8.5B For Auto, IoT, Security Sta...

 First-half funding analysis shows continued robust investment in tech.
August 8th, 2018 By Jeff Dorsch

Agile Standards

 Standards development has changed from defining everything that might be nice, to a mor...
August 8th, 2018 By Brian Bailey

more top stories »


Latest News

Week In Review: Manufacturing, Test

 Trade wars; materials merger; Magic Leap flops.
August 17th, 2018 By Mark LaPedus

Week In Review: Design, Low Power

 New speculative execution vulnerability; Arm's roadmap; DTCO a...
August 17th, 2018 By Jesse Allen

Week in Review: IoT, Security, Auto

 Fax machines; funding mega-rounds; 3nm chips.
August 17th, 2018 By Jeff Dorsch

Blog Review: Aug. 15

 China's semi growth; when formal gets stuck; 5G & AI; electrop...
August 15th, 2018 By Jesse Allen

more news »



Research

Manufacturing Bits: Aug. 14

 Strange metals; mild-temp superconductors; super grids.
By Mark LaPedus

System Bits: Aug. 14

 AI for less toxic cancer treatment; superconductors with a twi...
By Ann Steffora Mutschler

Power/Performance Bits: Aug. 14

 All-optical logic; 3D printed battery electrodes; on-chip opti...
By Jesse Allen

more research »



Startup Corner

Syntiant: Analog Deep Learning Chips

 Intel Capital funds startup to put AI in low-power mobile devi...
By Kevin Fogarty

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

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EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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