Special Reports

Auto Chip Aging Accelerates In Hot Climates

By: Ed Sperling

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
NAND Flash Targets 1,000 Layers

By: Bryon Moyer

New techniques go beyond improved deposition and etching, but challenges stack up, too.
Top-Down Vs. Bottom-Up Chiplet Design

By: Ann Mutschler

Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

 more »

Top Stories

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happe...

Chiplet Interconnects Add Power And Signal Integrity Issues

More choices, interactions, and tiny dimensions create huge headaches.

Where Is The Software For Shift Left?

Shift left requires abstractions on which early analysis can be performed. For architec...

Why Chips Fail, And What To Do About It

Improving reliability in semiconductors is critical for automotive, data centers, and A...

Aftermarket Sensors Boost Yield In Wafer Fabs

More data improves throughput, helps extend the life of equipment.

Silicon Lifecycle Management Gains Steam

Gaps remain, but the broad integration of data from design through manufacturing, test,...

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

Tools Needed To Track, Catalog Hardware Vulnerabilities

LLMs hold promise to avoid repeated security weaknesses, but roadblocks remain.

Radar, AI, And Increasing Autonomy Are Redefining Auto IC Designs

Adding more intelligence into vehicles is increasing reliance on some technologies that...

Where Cryptography Is Headed

Security teams are scrambling to devise technology that keeps data secure in an era of ...

Chip Companies Play Bigger Role In Shaping University Curricula

Design and AI companies are using a range of tools to help graduates become productive ...

Aging, Complexity, And AI In Analog Design

Where digital and analog designs are overlapping, and why it's becoming more difficult ...

more top stories »

Latest News

Chip Industry Week In Review

California SiC factory funding; IEDM announcements, including 2nm and 2D materials advances from Intel and TSMC, CFETs, and subtractive ruthenium metallization; R...

Chip Industry Week In Review

TSMC readies 2nm; record semiconductor sales; stronger export rules; China's materials retaliation; CHIPS Act funding withdrawal, new awards; Intel board addition...

more news »



Opinion

Goal-Driven AI

Any optimization problem must have a clear, unambiguous specif...

GenAI + Semiconductors + Humanity

AI will change the semiconductor startup ecosystem in myriad w...

more opinions »



Research

Research Bits: Dec. 11

Photonic AI processor; optoelectronic physical reservoir compu...

Research Bits: Dec. 3

Self-assembly of mixed-metal oxide arrays; biodegradable thin-...

Chip Industry Technical Paper Roundup: Dec. 3

Pooling CPU memory for LLM inference; high-bandwidth chiplet i...

more research »



Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

more startups »

Videos

Speeding Up Acoustic Wafer Inspection


The Evolution of HBM


Using Formal For RISC-V Security


Scaling Performance In AI Systems


Knowledge Centers / Entities, people and technologies explored