Special Reports

3D NAND Flash Wars Begin

By: Mark LaPedus

Market overcrowding, more efficient manufacturing, and growing list of scaling issues c...
Auto Chip Test Getting Harder

By: Kevin Fogarty

Each new level of assistance and autonomy adds new requirements and problems, some of w...
Safety, Security And PPA Tradeoffs

By: Brian Bailey

The number of critical design metrics is expanding, but the industry still grapples wit...

 more »

Top Stories

Next-Gen Memory Ramping Up

At least 5 technologies are in the running, with 3D XPoint leading the pack.

Inspecting Unpatterned Wafers

Finding smaller defects earlier is becoming more difficult and expensive.

Big Shifts In Tech Conferences

New technologies and trends have created an explosion of shows; some attempt to go broa...

Old Vs. New Packages

Two packaging technologies are making microchips smaller and more durable.

Where FD-SOI Works Best

Experts at the Table, part 2: Why FD-SOI is being used alongside finFETs and other tech...

AI Architectures Must Change

Using the Von Neumann architecture for artificial intelligence applications is ineffici...

Do Parallel Tools Make Sense?

Experts at the Table, part 2: What can be done instead? And why are companies reluctant...

Chip Aging Becomes Design Problem

Assessing the reliability of a device requires adding more physical factors into the an...

More Processing Everywhere

Arm's CEO contends that a rise in data will fuel massive growth opportunities around AI...

Process Variation Not A Solved Issue

Experts at the Table: Biggest issues with process variation today, and its impacts on t...

$8.5B For Auto, IoT, Security Sta...

First-half funding analysis shows continued robust investment in tech.

Agile Standards

Standards development has changed from defining everything that might be nice, to a mor...

more top stories »

Latest News

Week In Review: Manufacturing, Test

Trade wars; materials merger; Magic Leap flops.

Week In Review: Design, Low Power

New speculative execution vulnerability; Arm's roadmap; DTCO a...

Week in Review: IoT, Security, Auto

Fax machines; funding mega-rounds; 3nm chips.

Blog Review: Aug. 15

China's semi growth; when formal gets stuck; 5G & AI; electrop...

more news »


Manufacturing Bits: Aug. 14

Strange metals; mild-temp superconductors; super grids.

System Bits: Aug. 14

AI for less toxic cancer treatment; superconductors with a twi...

Power/Performance Bits: Aug. 14

All-optical logic; 3D printed battery electrodes; on-chip opti...

more research »

Startup Corner

Syntiant: Analog Deep Learning Chips

Intel Capital funds startup to put AI in low-power mobile devi...

more startups »


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Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.


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