Special Reports

The Best DRAMs For Artificial Intelligence

By: Bryon Moyer

The choice of DRAM depends on where the action is.
Rethinking Chip Reliability For Harsh Conditions

By: Gregory Haley

Shift right, then left is becoming more common for test and inspection in mission- and safety-critical applications.
AR/VR Glasses Taking Shape With New Chips

By: Liz Allan

Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a...

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Top Stories

RISC-V’s Increasing Influence

Does the world need another CPU architecture when that no longer reflects the typical w...

Multi-Die Assemblies Complicate Parasitic Extraction

What used to be an afterthought is now a first-order concern for performance and power ...

Challenges In Using Sub-7nm ICs In Automotive

Targeted design for test, better fault models, and in-system testing must keep pace wit...

High-Quality Data Needed To Better Utilize Fab Data Streams

Engineers require timely and aligned data with just the right level of granularity.

How Secure Are Analog Circuits?

Multi-die assemblies enable more analog content, but that adds new security vulnerabili...

Mobile Chip Challenges In The AI Era

Edge AI, GenAI, and next-gen communications are adding more workloads to phones that ar...

Connecting AI Accelerators

How to put the pieces together in a complex design with AI is an unsolved problem.

Optimizing Data Movement

Problems and solutions for improving performance with more data.

A Balanced Approach To Verification

In the past, simulation was the only tool available for verification, but today there a...

Executive Outlook: Chiplets, 3D-ICs, and AI

Trouble spots, and some fixes, for the next wave of high-performance semiconductors.

Cooling Chips Still A Top Challenge

Heat pipes, lids, thermal interfaces, and micro-channel cooling help remove the heat ge...

Mask Complexity, Cost, And Change

Evolving lithography demands are challenging mask writing technology; shift to curvilin...

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Latest News

Chip Industry Week in Review

IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromo...

Chip Industry Week in Review

Qualcomm to buy Alphawave; reworking chip grants; global semi, equipment sales up; GF's $16B expansion; Arm's AI-defined vehicles platform; Mexico's push; DRAM/DD...

more news »



Opinion

The DAC Valuation

How much value does DAC really add to the industry? Large EDA ...

Photonics Speeds Up Data Center AI

Highlights from the Optical Fiber Communications Conference 2025.

more opinions »



Research

Research Bits: June 9

InGaOx GAA transistor; 2D hybrid glaphene; simulating plasma.

Chip Industry Technical Paper Roundup: June 9

Customizing a LLM for VHDL design; HW-centric analysis of Deep...

Chip Industry Technical Paper Roundup: June 3

Chiplet to chiplet communication; SRAM scaling with monolithic...

more research »



Startup Corner

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 st...

Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion f...

more startups »

Videos

Agentic AI In Chip Design


Big Changes In Medical Electronics


Optical Interconnectivity At 224 Gbps


Problems In Testing AI Chips


Knowledge Centers / Entities, people and technologies explored