Special Reports

Government Chip Funding Spreads Globally

By: Liz Allan

Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.
Partitioning In The Chiplet Era

By: Ann Mutschler

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
Using AI To Glue Disparate IC Ecosystem Data

By: Ed Sperling and Ann Mutschler

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need...

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Top Stories

Security Concerns Weigh Down Open-Source EDA

Issues vary by application and how and where it's used, but many tools already contain ...

Challenges In Reducing Wireless Latency

New protocols and technology will spur a whole new wave of chips, but those designs wil...

Managing Legacy In Automotive

As vehicle technology evolves, carmakers must decide which technologies move forward an...

The Cost Of EDA Data Storage And Processing Efficiency

Sustainability in the EDA process is less about the environment and more about preservi...

Preparing For Ferroelectric Devices

Managing crystal structure for ferroelectric performance.

Barriers To Chiplet Sockets

Perfection sometimes stands in the way of progress, and there is evidence this may be h...

RAG-Enabled AI Stops Hallucinations, Adds Sources

New GenAI method enables better answers and performs more functions.

Pressure Builds To Adopt Virtual Prototypes

Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but...

Devising Security Solutions For Hardware Threats

Keeping up with attackers is proving to be a major challenge with no easy answers; trai...

Optimizing Wafer Edge Processes For Chip Stacking

Several critical processes address wafer flatness, wafer edge defects and what's needed...

How Die Dimensions Challenge Assembly Processes

Chiplet-based products must accommodate small differences in die size and bump pitch, p...

New Materials Are in High Demand

Development methodologies combine old and new techniques, but getting any new material ...

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Latest News

Chip Industry Week In Review

Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; A...

Blog Review: Oct. 9

ECAD-MCAD collaboration; AXI4 locking mechanism; SRAM PUF; ADAS challenges; gate resistance; Gemini AI’s network comms.

more news »



Research

Research Bits: Oct. 8

Materials: Soft, flexible polymer semiconductors; photonic top...

Chip Industry Technical Paper Roundup: Oct. 8

Low-power electronics roadmap; preventing Rowhammer via memory...

Research Bits: Oct. 1

Rust-resistant coating for 2D semiconductors; polymeric materi...

more research »



Startup Corner

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

Startup Funding: March 2024

Investors connect with interconnects; $1.1 billion for 39 comp...

more startups »

Videos

Working With Chiplets


Data Routing In Heterogeneous Chip Designs


Emerging Technologies Driving Heterogeneous Integration


Real-Time Safety Monitoring


Knowledge Centers / Entities, people and technologies explored