Special Reports

Single Vs. Multi-Patterning EUV

By: Mark LaPedus

Why this choice isn't as obvious as it might look.
Shedding Pounds In Automotive Electronics

By: Susan Rambo

Weight is suddenly a major concern for carmakers, but slimming down has repercussions.
How To Build An Automotive Chip

By: Ann Steffora Mutschler

Changing standards, stringent requirements and a mix of expertise make this a tough mar...

 more »

Top Stories

EUV Arrives, But More Issues Ahead

Improvement still needed for uptime, defectivity, line edge roughness and process flows.

Making Chip Packaging Simpler

The promise of advanced packaging is being able to integrate heterogeneous chips, but a...

EUV Mask Readiness Challenges

Experts at the Table, Part 1: 250W power source appears sustainable and reliable, but d...

Gaps In 5G Test

Millimeter wave technology will require a whole new approach to ensuring reliability.

The Growing Challenge Of Thermal Guard-Banding

Margin is still necessary, but it needs to be applied more precisely than in the past.

Using Less Power At The Same Node

When going to a smaller node is no longer an option, how do you get better power perfor...

Memory Tradeoffs Intensify in AI, Automotive Applications

Why choosing memories and architecting them into systems is becoming much more difficult.

Using Analog For AI

Can mixed-signal architectures boost artificial intelligence performance using less power?

Micro-Mobility Market Potential Widens

From e-scooters to robotaxis, transportation is undergoing massive shifts.

Finding Defects In Chips With Machine Learning

Better algorithms and more data could bolster adoption, particularly at advanced nodes.

Domain Expertise Becoming Essential For Analytics

More data doesn't mean much unless you know what to do with it.

Next Wave Of Security For IIoT

New technology, approaches will provide some protection, but gaps still remain.

more top stories »

Latest News

Week In Review: Manufacturing, Test

Foundry rankings; HBM; 300mm fabs.

Week in Review: IoT, Security, Auto

Cities and tech; Norsk Hydro; AV safety and security.

Week In Review: Design, Low Power

Synopsys' new test products, ML library; Vayyar licenses Arter...

Blog Review: Mar. 20

Toward domain-specific architectures; floating point in embedd...

more news »


Manufacturing Bits: March 19

Exascale computers; controlling noise.

System Bits: March 19

Sustainable nanomesh; beyond 5G; photonics device.

Power/Performance Bits: Mar. 19

Explainable AI; low-power ASIC for small robots; ionic transis...

more research »

Startup Corner

Rogue Valley Microdevices: MEMS F...

Oregon-based specialty fab takes different approach.

more startups »


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Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.


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