Special Reports

What’s Next For Atomic Layer Etch?

By: Mark LaPedus

Technology begins shipping, but which approaches work best, and where, is still not cle...
China’s Ambitious Automotive Plans

By: Ed Sperling

After years of playing catch-up to multinationals, the country is targeting an opening ...
Trimming Waste In Chips

By: Brian Bailey

How much extra circuitry is necessary is a matter of debate, but almost everyone agrees...

 more »

Top Stories

Deals: Mentor-Solido, Marvell-Cavium

M&A activity heats up everywhere.

Here Comes High-Res Car Radar

A new crop of device makers are developing chips based on high-resolution radar technol...

Move Data Or Process In Place?

Second of two parts: Costs associated with moving data escalate when we move from chips...

Variation Spreads At 10/7nm

Differences in equipment under scrutiny as tolerances tighten.

Overlay Challenges On The Rise

Move to 10/7nm and beyond creates need for more precise metrology and alignment within ...

The Return Of Body Biasing

This technique lets engineering teams reach new power lows, but it's not always so simp...

New Drivers For I/O

Mobile phones are no longer driving I/O standards. Emerging industries take up the lead...

Lots Of Little Knobs For Power

A growing list of small changes will be required to keep power, heat, and noise under c...

The Next Phase Of Machine Learning

Chipmakers turn to inferencing as the next big opportunity for this technology.

Mixed Messages For Mixed-Signal

What does the future of analog mixed-signal design and verification look like? Can we e...

Litho Options For Panel Fan-out

Panels could sharply reduce the cost of fan-outs, but this approach will require new eq...

Chiplets Gaining Steam

Hard IP could reduce time and cost for heterogeneous designs, but there are still chall...

more top stories »

Latest News

The Week In Review: Manufacturing

Samsung tops Intel in IC rankings, NAND shortages, China’s I...

The Week in Review: IoT

Forrester on IoT; Marvell, Cavium combine; Altair chipset vali...

Week In Review: Design

Acquisitions; Intel security vulnerability; AI chip for healt...

Blog Review: Nov. 22

AI, database mergers, Xerox's Alto, USB 3.2; advanced packaging.

more news »


Manufacturing Bits: Nov. 21

Germanium-on-mica; foldable flash; HVPE.

System Bits: Nov. 21

Lamborghini-MIT hypercar; algorithm out-diagnoses radiologists...

Power/Performance Bits: Nov. 21

Solar: greener greenhouses; butterfly thin films; quantum dot ...

more research »

Startup Corner

Aeponyx: Optical Chips For Telecom

New company seeks to cut cost of optical switch by 10X, improv...

more startups »


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