Special Reports

Multi-Patterning EUV Vs. High-NA EUV

By: Mark LaPedus

Next-gen litho is important for scaling, but it's also expensive and potentially risky.
Power Complexity On The Rise

By: Ann Steffora Mutschler

New architectures, different markets and more variables make it increasingly difficult ...
Revving Up For Edge Computing

By: Ed Sperling

New approaches to managing and processing data emerge, along with standard ways to comp...

 more »

Top Stories

The Growing Challenges Of 5G Test

 Rapid changes in next-gen wireless technology and standards are only adding to the comp...
December 10th, 2019 By Susan Rambo

Gaps Emerge In Test And Analytics

 Comparison data is required for understanding drift and AI changes, but that's not so s...
December 10th, 2019 By Ed Sperling

Testing In Context Gaining Ground

 Why simple pass/fail testing no longer works.
December 10th, 2019 By Jeff Dorsch

Betting On Hydrogen-Powered Cars

 Hydrogen fuel cells will play a role in the transportation ecosystem of the future, but...
December 5th, 2019 By Ann Steffora Mutschler

A Trillion Security Risks

 Why an explosion in IoT devices significantly raises the threat level.
December 5th, 2019 By Yuri Nagano

November 2019 Startup Funding

 Sixteen startups attracted funding rounds of nine figures in November.
December 5th, 2019 By Jeff Dorsch

Using FPGAs For AI

 How good are standard FPGAs for AI purposes, and how different will dedicated FPGA-base...
December 2nd, 2019 By Brian Bailey

Making And Protecting Advanced Masks

 Experts at the Table: AI, EUV pellicles and inverse lithography are hot topics in mask ...
November 27th, 2019 By Mark LaPedus

Transforming Silicon Bring-Up

 The role of silicon for verification and validation is changing. While there is the des...
November 26th, 2019 By Brian Bailey

Thoroughly Verifying Complex SoCs

 With so many variables, verifying complex, heterogenous designs is a task with many ten...
November 26th, 2019 By Ann Steffora Mutschler

Optimizing Hardware Faster

 Silexica's CEO talks about why high-level synthesis has become so important across diff...
November 26th, 2019 By Ed Sperling

Portable Stimulus And Digital Twins

 Experts at the Table: How Portable Stimulus plays with the digital twin and the drive t...
November 25th, 2019 By Brian Bailey

more top stories »

Latest News

Week In Review: Manufacturing, Test

 UMC rolls 22nm; Lam’s edge tools; design house rankings.
December 6th, 2019 By Mark LaPedus

Week In Review: Design, Low Power

 Cadence buys NI's AWR unit; FPGA simulation; RISC-V cores; ear...
December 6th, 2019 By Jesse Allen

Week In Review: IoT, Security, Auto

 SiFive’s RISC-V for makers; AWS’s Graviton2; Synopsys’ s...
December 6th, 2019 By Susan Rambo

Blog Review: Dec. 4

 Cell-aware test; open-source EDA; PIPE 5 PHY; parasitic PLLs.
December 4th, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: Dec. 9

 Metalens breakthroughs; 3D glass printing.
By Mark LaPedus

Power/Performance Bits: Dec. 9

 Solar capture and storage; knee power.
By Jesse Allen

Manufacturing Bits: Dec. 3

 Microscopic movie star; watching electrons; molecular movies.
By Mark LaPedus

more research »



Startup Corner

November 2019 Startup Funding

 Sixteen startups attracted funding rounds of nine figures in N...
By Jeff Dorsch

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Simultaneous Localization And Mapping

November 6th, 2019


Which Verification Engine When?

October 31st, 2019


Visually Assisted Layout In Custom Design

October 29th, 2019


Thermal Challenges And Moore's law

October 22nd, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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