Special Reports

Single Vs. Multi-Patterning EUV

By: Mark LaPedus

Why this choice isn't as obvious as it might look.
Shedding Pounds In Automotive Electronics

By: Susan Rambo

Weight is suddenly a major concern for carmakers, but slimming down has repercussions.
How To Build An Automotive Chip

By: Ann Steffora Mutschler

Changing standards, stringent requirements and a mix of expertise make this a tough mar...

 more »

Top Stories

Lithography Options For Next-Gen Devices

 EUV is the clear winner down to 5nm, but what comes after that may be a combination of ...
April 18th, 2019 By Mark LaPedus

Inspecting IC Packages Using Die Sorters

 Why this obscure tool is becoming crucial for finding cracking defects in optoelectroni...
April 18th, 2019 By Mark LaPedus

Moore’s Law Now Requires Advanced Packaging

 Experts at the Table, part 1: Shrinking features isn't enough anymore. The big challeng...
April 18th, 2019 By Ed Sperling

Designing For The Edge

 Growth in data is fueling many more options, but so far it's not clear which of them wi...
April 17th, 2019 By Ann Steffora Mutschler

The Role Of EDA In AI

 Experts at the Table, part 3: Which aspects of AI implementation should EDA create tool...
April 17th, 2019 By Brian Bailey

Finding The Source Of EUV Stochastic Effects

 Resolving problems in advanced lithography could push this technology much more into th...
April 15th, 2019 By Katherine Derbyshire

Target: 50% Reduction In Memory Power

 Is it possible to reduce the power consumed by memory by 50%? Yes, but it requires work...
April 11th, 2019 By Brian Bailey

Low Power Meets Variability At 7/5nm

 Reductions in voltage, margin and increases in physical effects are making timing closu...
April 11th, 2019 By Ann Steffora Mutschler

Optimization Challenges For Safety And Security

 The road to optimized tradeoff automation is long. Changing attributes along the way ca...
April 11th, 2019 By Brian Bailey

From AI Algorithm To Implementation

 Experts at the Table, part 2: The transformation from algorithm to implementation has s...
April 10th, 2019 By Brian Bailey

Racing To The Edge

 The opportunity is daunting, but so are the challenges for making all the pieces work t...
April 9th, 2019 By Susan Rambo And Ed Sperling

New Approaches To Security

 Data analytics, traffic patterns and restrictive policies emerge as ways to ensure that...
April 9th, 2019 By Ed Sperling

more top stories »


Latest News

Week In Review: Manufacturing, Test

 6nm vs 5nm processes; Intel exits 5G chip biz; deep learning.
April 19th, 2019 By Mark LaPedus

Week in Review: IoT, Security, Auto

 Drone inspections; war exclusion; Apple’s LiDAR; IPOs.
April 19th, 2019 By Jeff Dorsch

Week In Review: Design, Low Power

 Intel buys Omnitek; Qualcomm, Apple drop litigation; 112G Long...
April 19th, 2019 By Jesse Allen

Blog Review: April 17

 Embedded power management; Industry 4.0 and semi; security sur...
April 17th, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: April 16

 Water that won’t freeze; modeling water behavior.
By Mark LaPedus

System Bits: April 16

 Borophene; trapping oxygen; sensitive measurements.
By Jeff Dorsch

Power/Performance Bits: April 16

 Faster CNN training; efficient flash for data centers; static ...
By Jesse Allen

more research »



Startup Corner

Rogue Valley Microdevices: MEMS F...

 Oregon-based specialty fab takes different approach.
By Ed Sperling

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Multi-Physics At 5/3nm

April 4th, 2019


GDDR6 - HBM2 Tradeoffs

April 3rd, 2019


Safety-Critical Design In Automotive

April 3rd, 2019


Billion-Gate Design Connectivity

March 26th, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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