Special Reports

Chiplets, Faster Interconnects, More Efficiency

By: Ed Sperling

Why Intel, AMD, Arm, and IBM are focusing on architectures, microarchitectures, and fun...
The Next New Memories

By: Mark LaPedus

A new crop of memories in R&D could have a big impact on future compute architectures.
Power Is Limiting Machine Learning Deployments

By: Brian Bailey

Rollouts are constrained by the amount of power consumed, and that may get worse before...

 more »

Top Stories

Synthesizing Hardware From Software

 Can a software engineer create hardware? It may be possible, but not in the way that ex...
August 22nd, 2019 By Brian Bailey

What Is A Custom Processor?

 The definition has changed, and so has the impact on the design process.
August 22nd, 2019 By Ann Steffora Mutschler

Siemens-Mentor Deal Retrospective

 CEO Tony Hemmelgarn talks about autonomous cars, 5G, EDA integration and the Siemens ac...
August 21st, 2019 By Ed Sperling

Advanced Packaging Options Increase

 But putting multiple chips into a package is still difficult and expensive.
August 19th, 2019 By Ed Sperling

GaN Versus Silicon For 5G

 Silicon still wins in sub-6 GHz, but after that GaN looks increasingly attractive.
August 15th, 2019 By Kevin Fogarty

Wanted: More Fab Tool Part Standards

 More complex equipment and advanced processes require higher reliability from thousands...
August 15th, 2019 By Mark LaPedus

Power Modeling Standard Released

 IEEE 2416 is the newly released standard for power modeling. What can we expect from it?
August 14th, 2019 By Brian Bailey

U.S. Consortium Pulls Ecosystem Into Quantum

 Through QEDC, the U.S. government helps build industry support behind quantum computing.
August 12th, 2019 By Susan Rambo

Debug Tools Are Improving

 Experts at the Table: How is machine learning going to impact debug, and what other imp...
August 12th, 2019 By Brian Bailey

Optimizing Power For Learning At The Edge

 Making learning on the edge work requires a significant reduction in power, which means...
August 8th, 2019 By Brian Bailey

Determining Where Power Analysis Matters Most

 Need for accuracy varies greatly, depending on where in the design flow it is used and ...
August 8th, 2019 By Ann Steffora Mutschler

HBM2E: The E Stands for Evolutionary

 The new version of the high bandwidth memory standard promises greater speeds and feeds...
August 8th, 2019 By Andy Patrizio

more top stories »

Latest News

Week In Review: Manufacturing, Test

 AI chip boom or bust?; fab sensors; yield management.
August 23rd, 2019 By Mark LaPedus

Week in Review: IoT, Security, Autos

 Huawei’s foldable phone; underwater IoT; North Korean malware.
August 23rd, 2019 By Jeff Dorsch

Week In Review: Design, Low Power

 Large FPGA; NAND flash controller PHY; Synopsys results.
August 23rd, 2019 By Jesse Allen

Blog Review: Aug. 21

 Autonomous barriers; RTOS time; highly accelerated life testing.
August 21st, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: Aug. 20

 Making carbon nanotubes with AI; flexible tubes; printing CNTs.
By Mark LaPedus

System Bits: Aug. 20

 Blockchain tech; quantum material; wireless wearables.
By Jeff Dorsch

Power/Performance Bits: Aug. 20

 Six-angstrom waveguide; rare earth recycling; cooling buildings.
By Jesse Allen

more research »



Startup Corner

July Startup Funding

 Twenty-one startups raised mega-rounds.
By Jeff Dorsch

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


In-Memory Computing

August 8th, 2019


Smart NiCs

August 5th, 2019


Using Compression For High-Bandwidth Video

August 1st, 2019


Inferencing At The Edge

July 31st, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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