Special Reports

Multi-Patterning EUV Vs. High-NA EUV

By: Mark LaPedus

Next-gen litho is important for scaling, but it's also expensive and potentially risky.
Power Complexity On The Rise

By: Ann Steffora Mutschler

New architectures, different markets and more variables make it increasingly difficult ...
Revving Up For Edge Computing

By: Ed Sperling

New approaches to managing and processing data emerge, along with standard ways to comp...

 more »

Top Stories

The Growing Challenges Of 5G Test

Rapid changes in next-gen wireless technology and standards are only adding to the comp...

Gaps Emerge In Test And Analytics

Comparison data is required for understanding drift and AI changes, but that's not so s...

Testing In Context Gaining Ground

Why simple pass/fail testing no longer works.

Betting On Hydrogen-Powered Cars

Hydrogen fuel cells will play a role in the transportation ecosystem of the future, but...

A Trillion Security Risks

Why an explosion in IoT devices significantly raises the threat level.

November 2019 Startup Funding

Sixteen startups attracted funding rounds of nine figures in November.

Using FPGAs For AI

How good are standard FPGAs for AI purposes, and how different will dedicated FPGA-base...

Making And Protecting Advanced Masks

Experts at the Table: AI, EUV pellicles and inverse lithography are hot topics in mask ...

Transforming Silicon Bring-Up

The role of silicon for verification and validation is changing. While there is the des...

Thoroughly Verifying Complex SoCs

With so many variables, verifying complex, heterogenous designs is a task with many ten...

Optimizing Hardware Faster

Silexica's CEO talks about why high-level synthesis has become so important across diff...

Portable Stimulus And Digital Twins

Experts at the Table: How Portable Stimulus plays with the digital twin and the drive t...

more top stories »

Latest News

Week In Review: Manufacturing, Test

UMC rolls 22nm; Lam’s edge tools; design house rankings.

Week In Review: Design, Low Power

Cadence buys NI's AWR unit; FPGA simulation; RISC-V cores; ear...

Week In Review: IoT, Security, Auto

SiFive’s RISC-V for makers; AWS’s Graviton2; Synopsys’ s...

Blog Review: Dec. 4

Cell-aware test; open-source EDA; PIPE 5 PHY; parasitic PLLs.

more news »


Manufacturing Bits: Dec. 9

Metalens breakthroughs; 3D glass printing.

Power/Performance Bits: Dec. 9

Solar capture and storage; knee power.

Manufacturing Bits: Dec. 3

Microscopic movie star; watching electrons; molecular movies.

more research »

Startup Corner

November 2019 Startup Funding

Sixteen startups attracted funding rounds of nine figures in N...

more startups »


Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.


Simultaneous Localization And Mapping

Which Verification Engine When?

Visually Assisted Layout In Custom Design

Thermal Challenges And Moore's law

Knowledge Centers / Entities, people and technologies explored