Special Reports

People Vs. Self-Driving Cars

By: Susan Rambo

Why auto tech companies are so concerned about interactions with humans.
Big Changes For Mainstream Chip Architectures

By: Ed Sperling

AI-enabled systems are being designed to process more data locally as device scaling be...
3D NAND Flash Wars Begin

By: Mark LaPedus

Market overcrowding, more efficient manufacturing, and growing list of scaling issues c...

 more »

Top Stories

Machine Learning Shifts More Work to FPGAs, SoCs

 SoC bandwidth, integration expand as data centers use more FPGAs for machine learning.
September 24th, 2018 By Kevin Fogarty

Cryogenic Etch Re-Emerges

 Technology could play a bigger role in 3D NAND, but control and cost remain problematic.
September 20th, 2018 By Mark LaPedus

Variation’s Long, Twisty Tail Worsens At 7/5nm

 Multiple sources of variability are causing unexpected problems in everything from AI c...
September 20th, 2018 By Ed Sperling

SiC Chip Demand Surges

 Electric vehicles drive up market for silicon carbide power semiconductors, but cost re...
September 20th, 2018 By Mark LaPedus

Auto Chip Design, Test Changes Ahead

 Which tools and methodologies will work best to ensure electronics operate for extended...
September 19th, 2018 By Kevin Fogarty

Survey: EUV Optimism Grows

 Photomask business is expanding despite several challenges.
September 17th, 2018 By Mark LaPedus

Aging In Advanced Nodes

 Experts at the Table, part 1: Why aging and reliability no longer can be addressed with...
September 17th, 2018 By Ann Steffora Mutschler

Enabling Cheaper Design

 At what point does cheaper design enable a significant growth in custom semiconductor c...
September 13th, 2018 By Brian Bailey

Process Corner Explosion

 At 7nm and below, modeling what will actually show up in silicon is a lot more complica...
September 13th, 2018 By Ann Steffora Mutschler

Minimizing Chip Aging Effects

 Understanding aging factors within a design can help reduce the likelihood of product f...
September 13th, 2018 By Brian Bailey

Intel’s Next Move

 Company's push into deep learning opens door to a variety of new architectures, includi...
September 11th, 2018 By Ed Sperling

The Race To Zero Defects

 Complexity, scaling and economics are hindering test engineers from finding all of the ...
September 10th, 2018 By Jeff Dorsch

more top stories »


Latest News

Week In Review: Manufacturing, Test

 Tariffs; Intel-Micron saga; mask/litho survey.
September 21st, 2018 By Mark LaPedus

Week In Review: Design, Low Power

 AI processors and platforms; Renesas offers its IP; functional...
September 21st, 2018 By Jesse Allen

Week in Review: IoT, Security, Auto

 Security anxiety; digital health; goodbye, Airware.
September 21st, 2018 By Jeff Dorsch

Blog Review: Sept. 19

 Creating a new switch; effective formal; speculative execution...
September 19th, 2018 By Jesse Allen

more news »



Research

System Bits: Sept. 18

 SCADA security simulator; more efficient, transparent ML; AI i...
By Susan Rambo

Manufacturing Bits: Sept. 18

 Flexible nanowires; molecular wires.
By Mark LaPedus

Power/Performance Bits: Sept. 18

 Etching photovoltaics; solar panel degradation; photoelectrode...
By Jesse Allen

more research »



Startup Corner

Baum: Finding SoC Power Flaws

 Identifying power design flaws early with time/power-use analy...
By Kevin Fogarty

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Huge Performance Gains Ahead

August 30th, 2018


Energy-Efficient AI

August 30th, 2018


802.11ax: Faster Wireless

August 27th, 2018


UPF-Aware CDC

August 29th, 2018

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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