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   Special Reports

System-In-Package Thrives In The Shadows

By: Mark LaPedus

Multi-chip approach cuts across all package types, dominates smart phone and wearables ...
Will Monolithic 3D DRAM Happen?

By: Bryon Moyer

New and faster memory designs are being developed, but their future is uncertain.
Impact Of GAA Transistors At 3/2nm

By: Brian Bailey

Some things will get better from a design perspective, while others will be worse.

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Top Stories

Optimization Driving Changes In Microarchitectures

New approaches emerge as demand for improved power and performance overwhelm design tools.

Containing The Explosion In Data

Designs are getting bigger, verification runs longer, and every stage of development an...

Building Complex Chips That Last Longer

Experts at the Table: Using multiphysics and lots of computation to improve reliability...

Data Tsunami Pushes Boundaries Of IC Interconnects

Design teams rethink the movement of data on-chip, off-chip, and between chips in a pac...

The Silicon Carbide Race Begins

As SiC moves to higher voltages, BEV users get faster charging, extended range, and low...

Gearing Up For Next-Gen Power Semis

Aluminum nitride, diamond semiconductors, gallium oxide and vertical GaN are all being ...

Nudging 2D semiconductors forward

Stacked nanosheet transistors promise to extend silicon’s reign beyond the finFET era.

Challenges With Chiplets And Packaging

Experts at the Table: The impact of optics, copper hybrid bonding, more standardized in...

Long-Haul Trucking With Fewer Drivers

The economics are compelling, but technological challenges abound that are unique to th...

Wrestling With Analog At 3nm

A fabrication technology that does not provide adequate analog design capabilities is n...

Tradeoffs Between Edge Vs. Cloud

As localized processors become more powerful, what works best where?

New Memories Add New Faults

Why existing test approaches don't always work, and what still needs to be done to ensu...

more top stories »

Latest News

Week In Review: Manufacturing, Test

Chip industry revenue growth; DRAM pricing; casFETs; proteanTe...

Week In Review: Design, Low Power

Early virtual and hybrid prototyping; DSPs for embedded worklo...

Week In Review: Auto, Security, P...

Automated driving in Arctic; automotive invests in chip teleme...

Blog Review: Sept. 22

PCB failures; data center interfaces; refactoring UVM in Python.

more news »



Research

Security Research Bits

New security technical papers presented at the August 21 USENI...

Power/Performance Bits: Sept. 21

Catching switches in action; harvesting energy from fingertips...

Manufacturing Bits: Sept. 14

Probabilistic computers; quantum AI computing.

more research »



Startup Corner

Startup Funding: August 2021

$3.5B for 35 companies scattered around the globe, including I...

more startups »

Videos

What's Changing In DRAM


Working With RISC-V


Changes In Auto Architectures


Sensor Fusion Everywhere

Knowledge Centers / Entities, people and technologies explored