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   Special Reports

Shifting Toward Data-Driven Chip Architectures

By: Ed Sperling and Ann Steffora Mutschler

Rethinking how to improve performance and lower power in semiconductors.
There’s More To Machine Learning Than CNNs

By: Bryon Moyer

Different learning structures provide optimizations based on variables such as time, ac...
Big Changes Ahead For Connected Vehicles

By: Ann Steffora Mutschler

Tapping into multiple services, both inside and outside a car, requires a rethinking of...

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Top Stories

Thinner Channels With 2D Semiconductors

Research into new materials booms as the number of manufacturing challenges increases a...

Fan-Out Packaging Options Grow

Once viewed as a low-cost IC packaging option, fan-out is going mainstream and upstream.

Finding, Predicting EUV Stochastic Defects

Unusual effects at 5/3nm, including fewer defects with double patterning.

Geopolitical And Economic Outlook For Chips And Equipment

Supply-demand imbalances, new markets for advanced chips, and how a dual supply chain c...

Targeting Redundancy In ICs

Adding resiliency and robustness doesn't have to be expensive, especially if done corre...

Thermal Floorplanning For Chips

Many factors influence how hot a die or IP will get, but if thermal analysis is not don...

Power, Performance — Avionics Designers Want It All

Design activity grows as companies adopt leading-edge technology, tools, and methodolog...

Customizing Chips For Power And Performance

Infineon's CTO looks at new functional combinations and how they are changing chip design.

Reliability Costs Becoming Harder To Track

Test, metrology and inspection costs blur as the number of options increase and chips a...

Is There a Practical Test For Rowhammer Vulnerability?

New approaches surface for persistent DRAM issue.

Digging Much Deeper With Unit Retest

It's no longer just an automatic retest to improve yield. Rising product complexity, pr...

The Case For FPGAs In Cars

Why the normal shift to hardened logic doesn't necessarily apply.

more top stories »

Latest News

Week In Review: Manufacturing, Test

High-NA EUV R&D; more U.S. packaging; scan test; AVs.

Week In Review: Design, Low Power

Rambus CXL initiative, acquisitions; identifying parasitics; f...

Week In Review: Auto, Security, P...

US EV shifts; Cadence FloatingPoint DSPs; Arm's TSMC tested PO...

Blog Review: June 16

AMBA ATP updates; glitching chips; automotive embedded softwar...

more news »



Research

Manufacturing Bits: June 15

Next-gen RF signal processors; acoustic pulp fibers.

Power/Performance Bits: June 15

Low-loss photonic IC; MEMS for x-ray modulation; superconducto...

Manufacturing Bits: June 7

Superjunction SiC devices; measuring SiC lifetimes.

more research »



Startup Corner

Startup Funding: May 2021

Edge AI hardware shines for investors; $1.3B in funding for 40...

more startups »

Videos

Improving Power & Performance Beyond Scaling


Changes In Sensors And DSPs


EDA In The Cloud


Making Lidar More Useful

Knowledge Centers / Entities, people and technologies explored