Special Reports

The Secret Life Of Accelerators

By: Ed Sperling

Unique machine learning algorithms, diminished benefits from scaling, and a need for mo...
What’s After FinFETs?

By: Mark LaPedus

Chipmakers exploring nanosheet, nanoslab, nano-ring and hexagonal FETs.
What Does An IoT Chip Look Like?

By: Ed Sperling

As the definition of IoT evolves, so do architectures.

 more »

Top Stories

Why Fabs Worry About Tool Parts

 How a single O ring can affect yield, and what to do about it.
August 17th, 2017 By Mark LaPedus

Using Data To Improve Yield

 Information technology adds big efficiency boost to industrial operations.
August 17th, 2017 By Jeff Dorsch

What Is Spin Torque MRAM?

 Everspin's CEO drills down into new memory types, why and where they're needed, and why...
August 17th, 2017 By Mark LaPedus

How Reliable Are FinFETs?

 Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips a...
August 16th, 2017 By Ann Steffora Mutschler

Auto Suppliers: More Than Chips

 Not all suppliers to the automotive industry are providing semiconductors and system-le...
August 14th, 2017 By Jeff Dorsch

Applying Machine Learning

 NetSpeed’s CEO talks about the benefits and challenges of using machine learning to o...
August 13th, 2017 By Ann Steffora Mutschler

Using CNNs To Speed Up Systems

 Just relying on faster processor clock speeds isn't sufficient for vision processing, a...
August 10th, 2017 By Ann Steffora Mutschler

Is Design Innovation Slowing?

 The answer appears to be a resounding no, but innovation isn't necessarily happening in...
August 10th, 2017 By Brian Bailey

IP Challenges Ahead

 Part 2: For the IP industry to remain healthy it has to constantly innovate, but it's g...
August 10th, 2017 By Brian Bailey

The Rising Value Of Data

 Race begins to figure out what else can be done with data. But not all data is useful, ...
August 9th, 2017 By Ed Sperling

Cheaper Fan-Outs Ahead

 Demand for lower cost drives R&D for panel-level packaging. But which size?
August 7th, 2017 By Mark LaPedus

Advanced Packaging Moves To Cars

 Supply chain shake-up as OEMs look to fan-outs and systems in package for differentiati...
August 7th, 2017 By Ann Steffora Mutschler

more top stories »


Latest News

The Week In Review: Manufacturing

 Taiwan’s blackout; Xcerra deal in limbo?; blank inspection; ...
August 18th, 2017 By Mark LaPedus

The Week In Review: IoT

 LightSquared’s revival; Qualcomm, Logicalis team; IoT data m...
August 18th, 2017 By Jeff Dorsch

The Week In Review: Design

 Qualcomm buys ML startup; automotive IC growth; Synopsys' resu...
August 18th, 2017 By Jesse Allen

Blog Review: Aug. 16

 3D logic; when to hack a car; market predictions; jittery cloc...
August 16th, 2017 By Jesse Allen

more news »



Research

Manufacturing Bits: Aug. 15

 Self-collapse lithography; molecular chips; select dep blog.
By Mark LaPedus

System Bits: Aug. 15

 Machine learning for better streaming; organismoid learning; p...
By Ann Steffora Mutschler

Power/Performance Bits: Aug. 15

 Solar sunglasses; saliva-powered battery; thermally conductive...
By Jesse Allen

more research »



Startup Corner

Performance-IP: Less Memory Latency

 Embedded IP improves performance by identifying and isolating ...
By Ed Sperling

more startups »

STOCK MARKET NEWS

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Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

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EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Gale Morrison

Gale Morrison

Technology Editor
Michael Watts

Michael Watts

Contributing Editor/Patterning

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