Special Reports

How To Make Autonomous Vehicles Reliable

By: Ann Steffora Mutschler

Making sure ADAS designs function correctly over time will be an enormous challenge.
The Limits Of IP Reuse

By: Ed Sperling

The old model of write once, integrate many times doesn't always work. Here's why.
Four Foundries Back MRAM

By: Mark LaPedus

Next-gen embedded memory technology ramps up in wake of flash scaling issues.

 more »

Top Stories

What Happened To ReRAM?

 After years of delays, this next-gen memory is finally gaining traction.
September 21st, 2017 By Mark LaPedus

Unsolved Litho Issues At 7nm

 Computational challenges on the rise with EUV. Scanners are no longer interchangeable.
September 21st, 2017 By Ed Sperling

Challenges Mount For Photomasks

 Optical proximity correction, EUV pellicles, inverse lithography and actinic inspection...
September 21st, 2017 By Mark LaPedus

Managing Peak Power

 Slimmer margins and more data create big challenges for 5G mobile devices, infrastructu...
September 20th, 2017 By Ann Steffora Mutschler

Power Modeling and Analysis

 Experts at the Table, part 2: What does a power model look like and how do you ensure s...
September 20th, 2017 By Brian Bailey

Light In A Package

 Why silicon photonics is so difficult, and why it's becoming more popular.
September 18th, 2017 By Ed Sperling

Frenzy At 10/7nm

 Focus is on cutting costs across the board, and it turns out there is still quite a bit...
September 14th, 2017 By Ann Steffora Mutschler

Multi-Physics Combats Commoditiza...

 In a world of billion-gate designs, it is increasingly difficult to create a differenti...
September 14th, 2017 By Brian Bailey

LiDAR Market Continues To Percolate

 Are cheaper LiDAR devices on the way?
September 13th, 2017 By Jeff Dorsch

Integrated Photonics

 Experts at the Table, part 3: What is the role of EDA in building photonics systems, is...
September 12th, 2017 By Brian Bailey

Survey: Optimism Grows for EUV

 VSB here to stay despite multi-beam mask writers.
September 11th, 2017 By Mark LaPedus

Get Ready For In-Mold Electronics

 Changes in packaging under development for new applications and price points.
September 11th, 2017 By Jeff Dorsch

more top stories »


Latest News

The Week In Review: Manufacturing

 GF asks EU to investigate TSMC; node wars; Toshiba saga; found...
September 22nd, 2017 By Mark LaPedus

The Week In Review: Design

 Synopsys buys materials modeling company; security subsystem; ...
September 22nd, 2017 By Jesse Allen

The Week In Review: IoT

 IoT startup funding; Hot ‘Lanta; Synopsys news.
September 22nd, 2017 By Jeff Dorsch

Node Warfare?

 GlobalFoundries unveils 12nm finFET process; foundries jockey ...
September 20th, 2017 By Mark LaPedus

more news »



Research

Manufacturing Bits: Sept. 19

 Ion implant lithography; new AFMs; wide-bandgap semis.
By Mark LaPedus

System Bits: Sept. 19

 Flip-flop qubits; sound waves analyze blood; risk-on-a-chip.
By Ann Steffora Mutschler

Power/Performance Bits: Sept. 19

 Healing perovskites; silicon anode for li-ion batteries; elect...
By Jesse Allen

more research »



Startup Corner

Performance-IP: Less Memory Latency

 Embedded IP improves performance by identifying and isolating ...
By Ed Sperling

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

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EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Gale Morrison

Gale Morrison

Technology Editor
Michael Watts

Michael Watts

Contributing Editor/Patterning

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