Special Reports

The Secret Life Of Accelerators

By: Ed Sperling

Unique machine learning algorithms, diminished benefits from scaling, and a need for mo...
What’s After FinFETs?

By: Mark LaPedus

Chipmakers exploring nanosheet, nanoslab, nano-ring and hexagonal FETs.
What Does An IoT Chip Look Like?

By: Ed Sperling

As the definition of IoT evolves, so do architectures.

 more »

Top Stories

Designing For The IoT

 Each day of DAC started with an IoT-related keynote. Sometimes they agreed, sometimes n...
July 27th, 2017 By Brian Bailey

How Much Verification Is Necessary?

 Sorting out issues about which tool to use when is a necessary first step—and somethi...
July 27th, 2017 By Ann Steffora Mutschler

Machine Learning Popularity Grows

 After two decades of experimentation, the semiconductor industry is scrambling to embra...
July 26th, 2017 By Ann Steffora Mutschler

Foundries Accelerate Auto Efforts

 Push toward more electronics in cars turns what used to be a marginal business into a p...
July 20th, 2017 By Mark LaPedus

Is 7nm The Last Major Node?

 Technical issues increase, costs go up, and not all markets will benefit.
July 20th, 2017 By Ed Sperling

Filtering Out Fab Problems

 Entegris' CEO talks about materials purity down to parts per quadrillion, and what impa...
July 20th, 2017 By Mark LaPedus

Hybrid Emulation

 Experts at the Table, part 2: Finding the right balance of performance, visibility, tur...
July 19th, 2017 By Brian Bailey

Dealing With System-Level Power

 New tools, standards, languages and methodologies will be necessary to automate growing...
July 17th, 2017 By Ann Steffora Mutschler

IoT Myth Busting

 How cost-sensitive are IoT edge devices, what are the real drivers for this industry, a...
July 13th, 2017 By Brian Bailey

Is The IP Industry Healthy?

 First of two parts: IP has grown to become the largest segment of EDA revenue, but is ...
July 13th, 2017 By Brian Bailey

5G Test Equipment Race Begins

 Next-gen wireless communications technology is still under development, but instrument ...
July 12th, 2017 By Jeff Dorsch

Advanced Packaging Picks Up Steam

 System-in-package technology is poised to roll out across multiple new markets.
July 10th, 2017 By Jeff Dorsch

more top stories »


Latest News

Blog Review: July 26

 Security and isolation; connected mobility; IoT camera vulnera...
July 26th, 2017 By Jesse Allen

The Week In Review: Manufacturing

 EUV gains steam; Industry 4.0; mask trends; SEMI award.
July 21st, 2017 By Mark LaPedus

The Week In Review: IoT

 Particle raises $20M; Arrow teams with IBM; IIoT market forecast.
July 21st, 2017 By Jeff Dorsch

The Week In Review: Design

 Updates, benchmarks for CFD tools; semiconductor content grows...
July 21st, 2017 By Jesse Allen

more news »



Research

Manufacturing Bits: July 25

 Metrology for the intelligence community; direct-write silver ...
By Mark LaPedus

Power/Performance Bits: July 25

 Batteries: sodium-ion cathode; preventing dendrites; supercapa...
By Jesse Allen

System Bits: July 25

 Smart glove controls virtual objects; improving robot vision.
By Ann Steffora Mutschler

more research »



Startup Corner

Performance-IP: Less Memory Latency

 Embedded IP improves performance by identifying and isolating ...
By Ed Sperling

more startups »

STOCK MARKET NEWS

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Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

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EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Gale Morrison

Gale Morrison

Technology Editor
Michael Watts

Michael Watts

Contributing Editor/Patterning

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