Special Reports

New Security Risks Create Need For Stealthy Chips

By: Ed Sperling

Thinner dies and insulation layers add vulnerabilities for better hacker tools. Solutio...
Solving The Memory Bottleneck

By: Brian Bailey

Moving large amounts of data around a system is no longer the path to success. It is to...
The Race To Next-Gen 2.5D/3D Packages

By: Mark LaPedus

New approaches aim to drive down cost, boost benefits of heterogeneous integration.

 more »

Top Stories

What’s The Best Advanced Packaging Option?

 A dizzying array of choices and options pave the way for the next phase of scaling.
October 17th, 2019 By Mark LaPedus

Building An MRAM Array

 Why MRAM is so attractive.
October 17th, 2019 By Katherine Derbyshire

Mask Making Issues With EUV

 Experts at the Table: EUV lithography is moving into limited production, but there are ...
October 17th, 2019 By Mark LaPedus

Thomas Dolby’s Very Different View Of Progress

 Reporter's Notebook: A personal quest to bridge the gap between art and the digital world.
October 16th, 2019 By Ann Steffora Mutschler

Extending Portable Stimulus

 Experts at the Table: With the initial standard in place, what can we expect in terms o...
October 16th, 2019 By Brian Bailey

Pushing Memory Harder

 Can the processor/memory bottleneck be closed, or do applications need to be re-archite...
October 14th, 2019 By Brian Bailey

Focus Shifts To Wasted Power

 Low power is no longer enough. Is all of the power consumed usefully? Low energy is the...
October 10th, 2019 By Brian Bailey

Using Emulators For Power/Performance Tradeoffs

 Chip design's big iron is moving further forward in the design cycle.
October 10th, 2019 By Ann Steffora Mutschler

Less Margin, More Respins, And New Markets

 How physics is reshaping the leading edge of design.
October 10th, 2019 By Ed Sperling

Reducing Costly Flaws In Heterogeneous Designs

 Why finding and fixing errors in AI and automotive chips is so difficult.
October 8th, 2019 By Ed Sperling

Shrinking AV’s 1 Billion Test Miles

 What makes an autonomous vehicle safe in real-world traffic situations?
October 8th, 2019 By Kevin Fogarty

Testing Against Changing Standards In Automotive

 There is no right answer yet for autonomous vehicles, and that's causing problems.
October 8th, 2019 By Ed Sperling and Kevin Fogarty

more top stories »

Latest News

Week In Review: Manufacturing, Test

 CapEx race; EUV shipments; MEMS design software.
October 18th, 2019 By Mark LaPedus

Week In Review: Design, Low Power

 Video codec acquisition; automotive flow; Samsung MDI support.
October 18th, 2019 By Jesse Allen

Week in Review: IoT, Security, Autos

 Marvell & NAV Alliance; drone bill; Hyundai’s $35B plan; Int...
October 18th, 2019 By Jeff Dorsch And Susan Rambo

Blog Review: Oct. 16

 Future technologies; quantum computing; simulating auto ICs.
October 16th, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: Oct. 15

 Sandia’s fab upgrade; nanoantenna detectors.
By Mark LaPedus

Power/Performance Bits: Oct. 15

 Probabilistic computing; memory compaction for C; ear biometrics.
By Jesse Allen

System Bits: Oct. 15

 Minimizing damage; lithium-sulfur batteries; electro-adhesive ...
By Jeff Dorsch

more research »



Startup Corner

Over $7 Billion Raised In Mega-Ro...

 September was spectacular for startups, as 27 tech companies r...
By Jeff Dorsch

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


New Challenges In Testing 5G Devices

October 7th, 2019


Using Multiple Inferencing Chips In NNs

October 4th, 2019


The New CXL Standard

September 15th, 2019


Ensuring A 5G Design Is Viable

September 9th, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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