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Special Reports

Defect Challenges Grow At The Wafer Edge

By: Laura Peters

Better measurement of edge defects can enable higher yield while preventing catastrophic wafer breakage, but the number of possible defects...

3.5D: The Great Compromise

By: Ed Sperling

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

Increasing Roles For Robotics In Fabs

By: Gregory Haley

AI and robotics are taking on bigger, more complex, and increasingly autonomous tasks, but integration with existing equipment and processes...

Promises and Perils of Parallel Test

Test costs may be reduced, but how much depends on a whole bunch of factors.

September 10th, 2024 By Anne Meixner

Standardizing Fault Coverage In Analog/Mixed Signal Test

IEEE P2427 is poised to be the cornerstone in the testing and validation of AMS designs...

September 10th, 2024 By Gregory Haley

Balancing Programmability And Performance In Cars

Customization and adaptability are essential for software-defined vehicles, but there's...

September 5th, 2024 By Ann Mutschler

Photonics Could Reduce The Cost Of Lidar

Known as the workhorse technology for long-haul communications, photonics now plays a v...

September 5th, 2024 By Karen Heyman

Security Improving For Low-Cost Hardware

A variety of approaches can be applied to inexpensive devices without significantly aff...

September 5th, 2024 By Adam Kovac

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and h...

September 4th, 2024 By Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and les...

August 29th, 2024 By Karen Heyman

Edge Devices Require New Security Approaches

More attack points and more valuable data are driving new approaches and regulations.

August 29th, 2024 By Adam Kovac

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiple...

August 29th, 2024 By Brian Bailey

Developing Workflows To Streamline System-Level Design

EDA tool providers will serve as powerful allies for customers to develop and implement...

August 28th, 2024 By Ann Mutschler

As EDA Processes Becomes More Secure, So Do Chips

Researchers and engineers are working on increasingly secure processes in the EDA workf...

August 26th, 2024 By Adam Kovac

Hardware Security Set To Grow Quickly

As vulnerabilities become more widespread and better known, industry standards will hav...

August 22nd, 2024 By Adam Kovac

Latest News

Chip Industry Week In Review

Adani and Tower fab in India; new panel-level package center; global semi sales; Russian weapons with U.S. semis; Nvidia and Microsoft lawsuit; Hot Chips AI proce...

September 6th, 2024 By The SE Staff

Blog Review: Sept. 4

Silent data corruption is everyone's problem; reliability and electromigration; origami in space; the state of AI security.

September 4th, 2024 By Jesse Allen

more news »

more research »

Startup Corner

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

By Jesse Allen

Startup Funding: March 2024

Investors connect with interconnects; $1.1 billion for 39 comp...

By Jesse Allen

more startups »

Special Reports

Top Stories

Promises and Perils of Parallel Test

Standardizing Fault Coverage In Analog/Mixed Signal Test

Balancing Programmability And Performance In Cars

Photonics Could Reduce The Cost Of Lidar

Security Improving For Low-Cost Hardware

New AI Processors Architectures Balance Speed With Efficiency

AI’s Role In Chip Design Widens, Drawing In New Startups

Edge Devices Require New Security Approaches

Defining The Chiplet Socket

Developing Workflows To Streamline System-Level Design

As EDA Processes Becomes More Secure, So Do Chips

Hardware Security Set To Grow Quickly

Latest News

Chip Industry Week In Review

Blog Review: Sept. 4

Research

Research Bits: Sept. 9

Chip Industry Technical Paper Roundup: Sept. 9

Research Bits: Sept. 3

Startup Corner

Startup Funding: Q2 2024

Startup Funding: March 2024

Videos

Real-Time Safety Monitoring

Why Connectivity Is Changing Microcontrollers

Next-Gen High-Speed Communication In Data Centers

Real-World Applications Of Computational Fluid Dynamics

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