Special Reports

The Race To 10/7nm

By: Mark LaPedus

Next nodes are expected to be long-lasting, because costs of developing chip after that...
Moore’s Law: Toward SW-Defined Hardware

By: Ed Sperling

Part 2: Heterogeneity and architectures become focus as scaling benefits shrink; IP ava...
22nm Process War Begins

By: Mark LaPedus

High price of moving to finFETs pushes foundries to offer a less expensive alternative.

 more »

Top Stories

Samsung Unveils Scaling, Packagin...

Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced ...

Reworking Established Nodes

Attention turns to pre-finFET processes because benefits of device scaling don't apply ...

Whatever Happened To HLS?

Experts at the table, part 3: Targeting FPGA resources, OpenCL, tackling safety and sec...

200mm Crisis?

Demand is up, capacity is flat. A look at what's behind this imbalance.

Extending EUV Beyond 3nm

Now that EUV is finally shipping, companies are working on extending it much further us...

Materials For Future Electronics

Flexible electronics, new memory types, and neuromorphic computing dominate research.

Maintaining Power Profiles At 10/7nm

Capturing what is driving power in a design means different things to different teams, ...

Power Challenges At 10nm And Below

Dynamic power density and rising leakage power becoming more problematic at each new no...

Closing The Loop On Power Optimiz...

Minimizing power consumption for a given amount of work is a complex problem that spans...

Analog’s Unfair Disadvantage

In a world that favors digital circuitry, analog has increasingly had to cope with proc...

2.5D, Fan-Out Inspection Issues Grow

Advanced packaging is now mainstream, but making sure these devices work properly while...

Wireless Test: Too Many Protocols

Vendors struggle to balance new technologies and markets, and almost perpetual updates,...

more top stories »


Latest News

Blog Review: May 24

Who owns auto data?; philosophy and functions; robots everywhe...

The Week In Review: Manufacturing

Chip rankings; silicon wafer shipments; ALD.

The Week In Review: IoT

IoT World wrap-up; startup funding; Google Cloud IoT Core.

The Week In Review: Design

Sondrel acquires IMGworks; formal apps for CDC, lint; UPF pars...

more news »



Research

Manufacturing Bits: May 23

Pushing optical metrology; advancing X-ray metrology; ionic me...

Power/Performance Bits: May 23

Biosupercapacitor; highly conductive transparent film; electro...

System Bits: May 23

Diamond transistors; switchable transistors; graphene kills ba...

more research »



Startup Corner

Performance-IP: Less Memory Latency

Embedded IP improves performance by identifying and isolating ...

more startups »

STOCK MARKET NEWS

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Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

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