Special Reports

Managing Device Certificates Is Becoming Harder

By: Bryon Moyer

As billions of new devices are connected to the Internet, simple approaches no longer w...
Variation Threat In Advanced Nodes, Packages Grows

By: Ed Sperling

Complex interactions and tighter tolerances can impact performance, power and life expe...
3D NAND’s Vertical Scaling Race

By: Mark LaPedus

More competition, business uncertainty, and much more difficult manufacturing processes.

 more »

Top Stories

Die-To-Die Stress Becomes A Major Issue

 Advanced nodes and packaging are turning minor issues into major ones.
January 14th, 2021 By Ann Steffora Mutschler

More Data, More Memory-Scaling Problems

 Challenges persist for DRAM, flash, and new memories.
January 14th, 2021 By Bryon Moyer

Verification’s Inflection Point

 What will the future of verification look like? New demands being placed on verificatio...
January 14th, 2021 By Brian Bailey

Hard-To-Hire Engineering Jobs

 The crunch to find skilled engineers goes fully global.
January 13th, 2021 By Susan Rambo

Too Much Fab And Test Data, Low Utilization

 For now, growth of data collected has outstripped engineers’ ability to analyze it all.
January 12th, 2021 By Anne Meixner

Testing Silicon Photonics In Production

 Much work still needs to be done to reduce costs and improve speed, and that requires a...
January 12th, 2021 By Bryon Moyer

Using Analytics To Reduce Burn-in

 Data-driven approach can significantly reduce manufacturing costs and time, but it's no...
January 12th, 2021 By Anne Meixner

Car Industry Changing Under The Hood

 Auto electronics are becoming more centralized, connected, and complex, and the entire ...
January 7th, 2021 By Ann Steffora Mutschler

Electronics Supply-Chain Trust Standards Emerge

 Fragmentation is still rampant, but there are signs of progress.
January 7th, 2021 By Bryon Moyer

Startup Funding: December 2020

 More than $1.5B in funding for 26 startups; December was a big month for AI hardware.
January 6th, 2021 By Jesse Allen

CEO Outlook: 2021

 The semiconductor industry will look and behave differently this year, and not just bec...
January 4th, 2021 By Ed Sperling

Testing More To Boost Profits

 With performance binning, chipmakers profit more from test.
December 30th, 2020 By Anne Meixner

more top stories »

Latest News

Week In Review: Manufacturing, Test

 Intel CEO shakeup; TSMC CapEx; inspection; China cobalt grab.
January 15th, 2021 By Mark LaPedus

Week In Review: Auto, Security, P...

 Flash at bottom of Tesla recall; auto chips supply low.
January 15th, 2021 By Susan Rambo

Week In Review: Design, Low Power

 Qualcomm to buy processor startup; DSP for sensors; EDA, IP up...
January 15th, 2021 By Jesse Allen

Blog Review: Jan. 13

 IC/ASIC design complexity; predictions for automotive, cloud, ...
January 13th, 2021 By Jesse Allen

more news »



Research

Manufacturing Bits: Jan. 11

 3D printing with liquids; tiny loudspeakers; 3D printing grant...
By Mark LaPedus

Power/Performance Bits: Jan. 11

 Quantum dot transistors; faster spin-orbit torque writing.
By Jesse Allen

Manufacturing Bits: Jan. 5

 Gallium oxide chips; leading-edge GaN foundry; growing GaN.
By Mark LaPedus

more research »



Startup Corner

Startup Funding: December 2020

 More than $1.5B in funding for 26 startups; December was a big...
By Jesse Allen

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


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October 5th, 2020


Chip Challenges At 3/2nm

September 15th, 2020


AI Inference Acceleration

September 14th, 2020


Memory Access In AI Systems

July 27th, 2020

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Bryon Moyer

Bryon Moyer

Technology Editor
Andy Patrizio

Anne Meixner

Consulting Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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