Special Reports

Single Vs. Multi-Patterning EUV

By: Mark LaPedus

Why this choice isn't as obvious as it might look.
Shedding Pounds In Automotive Electronics

By: Susan Rambo

Weight is suddenly a major concern for carmakers, but slimming down has repercussions.
How To Build An Automotive Chip

By: Ann Steffora Mutschler

Changing standards, stringent requirements and a mix of expertise make this a tough mar...

 more »

Top Stories

EUV Arrives, But More Issues Ahead

 Improvement still needed for uptime, defectivity, line edge roughness and process flows.
March 21st, 2019 By Katherine Derbyshire

Making Chip Packaging Simpler

 The promise of advanced packaging is being able to integrate heterogeneous chips, but a...
March 21st, 2019 By Ed Sperling and Mark LaPedus

EUV Mask Readiness Challenges

 Experts at the Table, Part 1: 250W power source appears sustainable and reliable, but d...
March 21st, 2019 By Mark LaPedus

Gaps In 5G Test

 Millimeter wave technology will require a whole new approach to ensuring reliability.
March 20th, 2019 By Kevin Fogarty

The Growing Challenge Of Thermal Guard-Banding

 Margin is still necessary, but it needs to be applied more precisely than in the past.
March 18th, 2019 By Ann Steffora Mutschler

Using Less Power At The Same Node

 When going to a smaller node is no longer an option, how do you get better power perfor...
March 14th, 2019 By Brian Bailey

Memory Tradeoffs Intensify in AI, Automotive Applications

 Why choosing memories and architecting them into systems is becoming much more difficult.
March 14th, 2019 By Ann Steffora Mutschler

Using Analog For AI

 Can mixed-signal architectures boost artificial intelligence performance using less power?
March 14th, 2019 By Brian Bailey

Micro-Mobility Market Potential Widens

 From e-scooters to robotaxis, transportation is undergoing massive shifts.
March 13th, 2019 By Jeff Dorsch

Finding Defects In Chips With Machine Learning

 Better algorithms and more data could bolster adoption, particularly at advanced nodes.
March 12th, 2019 By Mark LaPedus

Domain Expertise Becoming Essential For Analytics

 More data doesn't mean much unless you know what to do with it.
March 12th, 2019 By Ed Sperling

Next Wave Of Security For IIoT

 New technology, approaches will provide some protection, but gaps still remain.
March 7th, 2019 By Kevin Fogarty and Ed Sperling

more top stories »


Latest News

Week In Review: Manufacturing, Test

 Foundry rankings; HBM; 300mm fabs.
March 22nd, 2019 By Mark LaPedus

Week in Review: IoT, Security, Auto

 Cities and tech; Norsk Hydro; AV safety and security.
March 22nd, 2019 By Jeff Dorsch

Week In Review: Design, Low Power

 Synopsys' new test products, ML library; Vayyar licenses Arter...
March 22nd, 2019 By Jesse Allen

Blog Review: Mar. 20

 Toward domain-specific architectures; floating point in embedd...
March 20th, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: March 19

 Exascale computers; controlling noise.
By Mark LaPedus

System Bits: March 19

 Sustainable nanomesh; beyond 5G; photonics device.
By Jeff Dorsch

Power/Performance Bits: Mar. 19

 Explainable AI; low-power ASIC for small robots; ionic transis...
By Jesse Allen

more research »



Startup Corner

Rogue Valley Microdevices: MEMS F...

 Oregon-based specialty fab takes different approach.
By Ed Sperling

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Designing An AI ASIC

March 11th, 2019


The Winograd Transformation

March 7th, 2019


New Memory Options

February 28th, 2019


Reverse Debug

February 28th, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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