Special Reports

Designing Hardware For Security

By: Ed Sperling

Most attacks in the past focused on gaining access to software, but Meltdown and Spectr...
New Patterning Options Emerging

By: Mark LaPedus

Why self-aligned approaches are becoming so critical to scaling, and what problems stil...
Get Ready For Integrated Silicon Photonics

By: Brian Bailey

This more than Moore technology is still ramping up, and problems need to be solved, bu...

 more »

Top Stories

200mm Fab Crunch

 Shortages of used equipment and lower margins mean this problem isn't getting solved an...
May 21st, 2018 By Mark LaPedus

RF SOI Wars Begin

 5G is driving up demand for both 300mm and 200mm capacity. Both are in short supply.
May 17th, 2018 By Mark LaPedus

FinFET Metrology Challenges Grow

 Hybrid schemes are being deployed, with new equipment and machine learning ramping up.
May 17th, 2018 By Mark LaPedus

Chipmakers Look Beyond Scaling

 GlobalFoundries CTO Gary Patton digs into how customers' priorities are shifting with n...
May 17th, 2018 By Ed Sperling

Integrating Memristors For Neurom...

 The latest research on memory, variability, and compute architectures—and what comes ...
May 16th, 2018 By Katherine Derbyshire

More Lithography/Mask Challenges

 Experts at the table, part 3: Demand for compute power still growing; what's after 5nm.
May 16th, 2018 By Mark LaPedus

OSAT Consolidation Continues

 The merger of ASE Group and SPIL alters the competitive landscape, but more changes are...
May 14th, 2018 By Jeff Dorsch

Power Optimization Strategies Widen

 Different markets are heading in different directions, raising questions about whether ...
May 10th, 2018 By Brian Bailey

System-Level Power Modeling Takes...

 Why modeling power much earlier has suddenly become so critical for so many application...
May 10th, 2018 By Ann Steffora Mutschler

Does Power Verification Work?

 Verification implies comparison against an expected result, but the industry has yet to...
May 10th, 2018 By Brian Bailey

MIS Packaging Takes Off

 Molded interconnect substrate emerges as packaging choice for analog, power ICs and cry...
May 7th, 2018 By Mark LaPedus

Software-Defined Test And Measure...

 SDx is making inroads into 5G, automotive radar, and other new technology.
May 7th, 2018 By Jeff Dorsch

more top stories »


Latest News

The Week In Review: Manufacturing

 Fab tool customer satisfaction; chip rankings; wafer boom.
May 18th, 2018 By Mark LaPedus

The Week in Review: IoT

 IoT World; startup funding; White House moves.
May 18th, 2018 By Jeff Dorsch

The Week In Review: Design

 Safety-critical IP; digital twins; mobile video compression.
May 18th, 2018 By Jesse Allen

Blog Review: May 16

 USB Dual Mode; shifting left in automotive; Agile hardware; wh...
May 16th, 2018 By Jesse Allen

more news »



Research

Manufacturing Bits: May 22

 Exotic water; tracking water molecules; cryo-electron microsco...
By Mark LaPedus

System Bits: May 22

 AI benefits, disruptions; VR drone testing; wearable smart tec...
By Ann Steffora Mutschler

Power/Performance Bits: May 22

 Sensing without battery power; 1D interconnects; chromium memory.
By Jesse Allen

more research »



Startup Corner

Spark Microsystems: LP On-Chip Ra...

 Startup seeks to displace BLE with RF that is extremely low en...
By Kevin Fogarty

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

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EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor
Michael Watts

Michael Watts

Contributing Editor/Patterning

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