Special Reports

Deals That Change The Chip Industry

By: Ed Sperling

Nvidia-Arm is just the beginning; more acquisitions are on the horizon.
Momentum Builds For Advanced Packaging

By: Mark LaPedus

Increasing density in more dimensions with faster time to market.
Is DVFS Worth The Effort?

By: Brian Bailey

Dynamic voltage and frequency scaling can save a lot of power and energy, but design co...

 more »

Top Stories

Have Processor Counts Stalled?

 Have chips reached a plateau for the number of processor cores they can effectively mak...
September 24th, 2020 By Brian Bailey

New Uses For Assertions

 Proponents point to applications in system reliability, AI, and data analytics.
September 24th, 2020 By Ann Steffora Mutschler

Productivity Keeping Pace With Complexity

 Without productivity gains, design size and complexity would face huge headwinds. Those...
September 24th, 2020 By Brian Bailey

RISC-V: What’s Missing And Who’s Competing

 Experts at the Table: The open-source ISA is gaining ground in multiple markets, but th...
September 23rd, 2020 By Ed Sperling

DRAM, 3D NAND Face New Challenges

 Various memories and business outlooks are all over the map, sometimes literally, with ...
September 21st, 2020 By Mark LaPedus

Industry Pushes For Fab Tool Security Standards

 Vulnerabilities from old equipment plus huge value of data makes chip manufacturers a p...
September 17th, 2020 By Mark LaPedus

Neural Networks Without Matrix Math

 A different approach to speeding up AI and improving efficiency.
September 17th, 2020 By Katherine Derbyshire

Custom Designs, Custom Problems

 Experts at the Table: Power and performance issues at the most advanced nodes.
September 16th, 2020 By Ed Sperling

Integrity Problems For Edge Devices

 Noise becomes a significant issue at older nodes when voltage is significantly reduced,...
September 14th, 2020 By Brian Bailey

Nvidia To Buy Arm For $40B

 Analysis: What's driving the deal, and what to watch for.
September 13th, 2020 By Ed Sperling

Dealing With Device Aging At Advanced Nodes

 Gaps remain, but understanding about how circuits age and what to do about it is improv...
September 10th, 2020 By Ann Steffora Mutschler

Compiling And Optimizing Neural Nets

 Inferencing with lower power and improved performance.
September 10th, 2020 By Bryon Moyer

more top stories »

Latest News

Week In Review: Manufacturing, Test

 SMIC; CIA; mask survey; KLA's inspection tools; Lam's gapfill;...
September 25th, 2020 By Mark LaPedus

Week In Review: Design, Low Power

 Arm's roadmap; 22nm analog IP; IP and tools for GF's 12LP, 12L...
September 25th, 2020 By Jesse Allen

Week In Review: Auto, Security, P...

 California to ban sale of new gas-powered cars by 2035; Arteri...
September 25th, 2020 By Susan Rambo

Blog Review: Sept. 23

 Efficient inference; ML machines; ECXML file format; low power...
September 23rd, 2020 By Jesse Allen

more news »



Research

Manufacturing Bits: Sept. 29

 Exploring chemical reactions using EUV; science gateways.
By Mark LaPedus

Power/Performance Bits: Sept. 29

 Implantable transmitter; spray-on smart windows.
By Jesse Allen

Manufacturing Bits: Sept. 22

 Hairy nanoparticles; free-form ceramics; stronger SiC.
By Mark LaPedus

more research »



Startup Corner

Moov: Used Equipment Digital Mark...

 Startup leverages data technology to enable buying, selling of...
By Ed Sperling

more startups »

STOCK MARKET NEWS

Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Ensuring HBM Reliability

May 27th, 2020


Cleaning Data For Final Test

May 20th, 2020


Rising Packaging Complexity

May 19th, 2020


PCIe 5.0 Drill-Down

April 1st, 2020

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Bryon Moyer

Bryon Moyer

Technology Editor
Andy Patrizio

Andy Patrizio

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator

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