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   Special Reports

System-In-Package Thrives In The Shadows

By: Mark LaPedus

Multi-chip approach cuts across all package types, dominates smart phone and wearables ...
Will Monolithic 3D DRAM Happen?

By: Bryon Moyer

New and faster memory designs are being developed, but their future is uncertain.
Impact Of GAA Transistors At 3/2nm

By: Brian Bailey

Some things will get better from a design perspective, while others will be worse.

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Top Stories

The Silicon Carbide Race Begins

As SiC moves to higher voltages, BEV users get faster charging, extended range, and low...

Gearing Up For Next-Gen Power Semis

Aluminum nitride, diamond semiconductors, gallium oxide and vertical GaN are all being ...

Nudging 2D semiconductors forward

Stacked nanosheet transistors promise to extend silicon’s reign beyond the finFET era.

Challenges With Chiplets And Packaging

Experts at the Table: The impact of optics, copper hybrid bonding, more standardized in...

Long-Haul Trucking With Fewer Drivers

The economics are compelling, but technological challenges abound that are unique to th...

Wrestling With Analog At 3nm

A fabrication technology that does not provide adequate analog design capabilities is n...

Tradeoffs Between Edge Vs. Cloud

As localized processors become more powerful, what works best where?

New Memories Add New Faults

Why existing test approaches don't always work, and what still needs to be done to ensu...

Fabs Drive Deeper Into Machine Learning

Wafer image interpretation can impact yield and throughput.

Making Test Transparent With Better Data

How the new test data standard can make the test floor more accessible in real-time.

Will Automotive Ethernet Win?

Why it's so hard to provide a definitive answer, and what are the other contenders.

Grappling With Smart City Security Issues

Economics and convenience are driving cities to connect services, but they're also wide...

more top stories »

Latest News

Week In Review: Manufacturing, Test

ATE meets analytics; EUV resist deal; new fab; EU semi funding...

Week In Review: Design, Low Power

MoSys and Peraso merger; AI SoC development; MIPI C-PHY/D-PHY ...

Week In Review: Auto, Security, P...

Arm auto SW framework; 22FDX; Cadence AI dev; Infineon secures...

Blog Review: Sept. 15

Radiation modeling; coverage as art; AR contact lenses; 3D-IC.

more news »



Research

Manufacturing Bits: Sept. 14

Probabilistic computers; quantum AI computing.

Power/Performance Bits: Sept. 14

Thermal management material; colorful electronic paper; chargi...

Manufacturing Bits: Sept. 8

Calibrating a microphone; acoustic reporter genes.

more research »



Startup Corner

Startup Funding: August 2021

$3.5B for 35 companies scattered around the globe, including I...

more startups »

Videos

What's Changing In DRAM


Working With RISC-V


Changes In Auto Architectures


Sensor Fusion Everywhere

Knowledge Centers / Entities, people and technologies explored