Special Reports

Using Sensor Data To Improve Yield And Uptime

By: Ed Sperling

Deeper understanding of equipment behavior and market needs will have broad impact acro...
In-Memory Computing Challenges Come Into Focus

By: Katherine Derbyshire

Researchers digging into ways around the von Neumann bottleneck.
China’s Foundry Biz Takes Big Leap Forward

By: Mark LaPedus

30 facilities planned, including 10/7nm processes, but trade war and economic factors c...

 more »

Top Stories

In-Memory Vs. Near-Memory Computing

 New approaches are competing for attention as scaling benefits diminish.
February 21st, 2019 By Mark LaPedus

Mixed Outlook For Silicon Wafer Biz

 300mm market softening, 200mm still strong.
February 21st, 2019 By Mark LaPedus

Using AI Data For Security

 Pushing data processing to the edge has opened up new security risks, and lots of new o...
February 20th, 2019 By Ann Steffora Mutschler

Gearing Up For 5G

 This new communications standard could transform architectural decisions across the ind...
February 14th, 2019 By Brian Bailey

Adapting Mobile To A Post-Moore’s Law Era

 New techniques, architectures and approaches are making up for a reduction in scaling b...
February 14th, 2019 By Ann Steffora Mutschler

Why Analog Designs Fail

 Analog circuitry stopped following Moore’s Law a long time ago, but that hasn't alway...
February 14th, 2019 By Brian Bailey

Blockchain May Be Overkill for Most IIoT Security

 Without an efficient blockchain template for IoT, other options are better.
February 13th, 2019 By Kevin Fogarty

Mapping The Impact Of Heat On Photonics

 Thermal effects are difficult to quantify, but they can disrupt optical signals and red...
February 12th, 2019 By Ed Sperling

Lithography Challenges For Fan-out

 Advanced packaging moves into high-volume mobile markets, but requires more sophisticat...
February 12th, 2019 By Mark LaPedus

Reliability Becomes The Top Concern In Automotive

 Extended lifetimes and advanced-node designs are driving new approaches, but not everyt...
February 12th, 2019 By Ed Sperling And Susan Rambo

VCSEL Technology Takes Off

 iPhone X elevates niche optical technology to hot growth market. Now the question is wh...
February 7th, 2019 By Kevin Fogarty and Ed Sperling

Issues In Designing 5G Beamforming Antennas

 Assuring quality under changing conditions with shifting standards and use models is a ...
February 7th, 2019 By Kevin Fogarty

more top stories »


Latest News

Week In Review: Manufacturing, Test

 Foundry process roadmaps; Hynix fabs; KLA-Orbotech.
February 22nd, 2019 By Mark LaPedus

Week In Review: Design, Low Power

 Arm's infrastructure-class platforms; formal RISC-V ISA compli...
February 22nd, 2019 By Jesse Allen

Week in Review: IoT, Security, Auto

 Internet of Cows; Russian hacking; AI for AVs.
February 22nd, 2019 By Jeff Dorsch

Blog Review: Feb. 20

 Compression for 8k displays; silicon photonics; sensor accurac...
February 20th, 2019 By Jesse Allen

more news »



Research

Manufacturing Bits: Feb. 19

 Computed Axial Lithography; dichroic cups.
By Mark LaPedus

System Bits: Feb. 19

 Sustainable 3D printing; clearer car vision; organic semi mate...
By Jeff Dorsch

Power/Performance Bits: Feb. 19

 Energy harvesting rectenna; photonic quantum repeater; more st...
By Jesse Allen

more research »



Startup Corner

Kumu Networks: Full Duplex on One...

 Well-funded startup offers self-interference cancellation tech...
By Jeff Dorsch

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Boosting Analog Reliability

January 19th, 2019


Thermal Guard-Banding

January 17th, 2019


AI In Chip Manufacturing

January 15th, 2019


Edge Inferencing Challenges

January 10th, 2019

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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