Special Reports

Getting Down To Business On Chiplets

By: Ed Sperling

Consortiums seek ways to ensure interoperability of hardened IP as way of cutting costs...
Foundries Prepare For Battle At 22nm

By: Mark LaPedus

Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But wh...
Why Chips Die

By: Brian Bailey

Semiconductor devices face many hazards before and after manufacturing that can cause t...

 more »

Top Stories

November Startup Funding: Big Deals Dominate

 Nine-figure funding rounds were common in November.
December 7th, 2018 By Jeff Dorsch

Dirty Data: Is the Sensor Malfunctioning?

 Why sensor data needs to be cleaned, and why that has broad implications for every aspe...
December 6th, 2018 By Susan Rambo

Autonomous Vehicle Design Begins To Change Direction

 It's unrealistic to road-test every corner case, so the automotive supply chain is shif...
December 6th, 2018 By Ann Steffora Mutschler

FPGA Graduates To First-Tier Status

 Achronix's CEO looks at the value of customized acceleration, and why FPGAs are better ...
December 6th, 2018 By Ed Sperling

Mitigating Risk Through Verification

 Automatic coverage model generation technology continues to advance.
December 5th, 2018 By Ann Steffora Mutschler

Making Sure A Heterogeneous Design Will Work

 Why the addition of multiple processing elements and memories is causing so much conste...
December 3rd, 2018 By Ed Sperling

Looking Beyond The CPU

 While CPUs continue to evolve, performance is no longer limited to a single processor t...
November 29th, 2018 By Brian Bailey

Bare Metal Programming

 New requirements for visibility drive different options, particularly for safety and se...
November 29th, 2018 By Ann Steffora Mutschler

IP Tracking and Management

 Experts at the Table, part 1: What are the important elements of an IP tracking and man...
November 29th, 2018 By Brian Bailey

AI Chip Architectures Race To The Edge

 Companies battle it out to get artificial intelligence to the edge using various chip a...
November 28th, 2018 By Kevin Fogarty

Overcoming Gender Stereotypes In Tech

 Problems run deeper in organizations than a survey of top executives would indicate.
November 23rd, 2018 By Ann Steffora Mutschler

Some Chipmakers Sidestep Scaling, Others Hedge

 No shortage of alternatives as materials, packaging and architectural options grow, and...
November 15th, 2018 By Ed Sperling

more top stories »


Latest News

Week In Review: Manufacturing, Test

 Lam CEO resigns; TSMC supplier awards; supply-chain fire.
December 7th, 2018 By Mark LaPedus

Week In Review: Design, Low Power

 RISC-V revs up; eFPGA AI acceleration; Imagination's new GPUs.
December 7th, 2018 By Jesse Allen

Week in Review: IoT, Security, Auto

 Warehouse robots; 2019 predictions; Siemens buys COMSA.
December 7th, 2018 By Jeff Dorsch

Blog Review: Dec. 5

 FPGA bug escapes; integrated photonics; AI needs new memories.
December 5th, 2018 By Jesse Allen

more news »



Research

Manufacturing Bits: Dec. 4

 Probing Mars; super rad-hard Intel chip; nano-satellites.
By Mark LaPedus

Power/Performance Bits: Dec. 4

 Bio-hybrid fungi; textile power storage; long-lasting aluminum...
By Jesse Allen

System Bits: Dec. 4

 Driverless car navigation; AI speeds up cancer research; easie...
By Ann Steffora Mutschler

more research »



Startup Corner

Training a Neural Network to Fall

 A cautionary tale of an early attempt to put AI on an IoT syst...
By Susan Rambo

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Inferencing In Hardware

December 6th, 2018


Formal Signoff

December 4th, 2018


Heterogeneous Computing

November 28th, 2018


ATE Lab To Fab

November 5th, 2018

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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