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   Special Reports

Automotive Outlook: 2022

By: Ann Steffora Mutschler

Short-term IC supply-chain problems and long-term architectural and business changes top the list of what's ahead.
Expanding Advanced Packaging Production In The U.S.

By: Mark LaPedus

Concerns about security and supply chain availability prompt new push.
Reliability Concerns Shift Left Into Chip Design

By: Ann Steffora Mutschler

Goals include offsetting rising manufacturing costs and limiting liability over longer lifetimes.

 more »

Top Stories

MIPI Standards Gaining Traction In New Markets

Convergence of vision and AI is driving adoption of MIPI standards beyond just mobile p...

Photomask Challenges At 3nm And Beyond

What are the next lithography-related issues as device scaling continues to the next pr...

Health Care Is Gold Mine For Hackers

Connected medical devices and systems offer many benefits, but they create security, sa...

200mm Shortages May Persist For Years

Some 300mm tools are converted to 200mm; equipment prices and chip manufacturing costs ...

New Ways To Improve Batteries

Researchers target safer, denser, and less expensive materials — even avocados.

Future Challenges For Advanced Packaging

OSATs are wrestling with a slew of issues, including warpage, thermal mismatch, heterog...

Will Steering Wheels Ever Disappear?

Short answer: Probably not.

A Minimal RISC-V

Is there room for an even smaller version of a RISC-V processor that could replace 8-bi...

SOT-MRAM To Challenge SRAM

Spin-orbit torque memory adds endurance and faster write speeds, but displacing existin...

Is Programmable Overhead Worth The Cost?

How much do we pay for a system to be programmable? It depends upon who you ask.

Setting Ground Rules For 3D-IC Designs

The few designs to reach silicon today are completely customized, with inconsistent too...

The Gargantuan 5G Chip Challenge

Millimeter-wave technology depends on some complex interactions and new technologies th...

more top stories »

Latest News

Blog Review: Jan. 26

Securing hardware; RISC-V ecosystem; multi-discipline environm...

Week In Review: Manufacturing, Test

Intel's Ohio fabs; India wants fabs; high-NA EUV; IC shortages.

Week In Review: Design, Low Power

DRAM verification; MIPI A-PHY doubles downlink data rate; EDA ...

Week In Review: Auto, Security, P...

Arm's HW security research now live; new MIPI A-Phy v.1.1; 5G ...

more news »



Research

Manufacturing Bits: Jan. 25

Stretchable thermometers; Moving from 2D to 3D objects.

Power/Performance Bits: Jan. 25

Nanoscale 3D optics; simple spatial light modulator; twisting ...

Manufacturing Bits: Jan. 18

Proton/antiproton measurements; charmed quarks.

more research »



Startup Corner

FortifyIQ: Hardware Security Veri...

Expanding functional verification to include security.

more startups »

Videos

Design Technology Co-Optimization


The Risk Of Losing Track Of Your IP


Always On DSPs


Radiation Hardening Chips For Outer Space

Knowledge Centers / Entities, people and technologies explored