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   Special Reports

Power Delivery Affecting Performance At 7nm

By: Brian Bailey

Slowdown due to impact on timing, and dependencies between power, thermal and timing th...
RISC-V Inches Toward The Center

By: Ann Steffora Mutschler

Access to source code makes it attractive for custom applications, but gaps remain in t...
People Vs. Self-Driving Cars

By: Susan Rambo

Why auto tech companies are so concerned about interactions with humans.

 more »

Top Stories

Wanted: Mask Equipment for Mature Nodes

 Shortfall caused by demand spike for analog, MEMS and RF chips.
October 18th, 2018 By Mark LaPedus

Can Graphene Be Mass Manufactured?

 Numerous questions surface about whether 2D materials are the best choice for extreme s...
October 18th, 2018 By Katherine Derbyshire

Machine Learning Invades IC Production

 Experts at the Table, part 1: Will machine learning and AI improve chip manufacturing?
October 18th, 2018 By Mark LaPedus

The Building Blocks Of Future Compute

 How Arm sees its role in emerging segments of tomorrow’s compute challenges.
October 17th, 2018 By Ann Steffora Mutschler

FAA Traffic Management Anticipates Flying Cars

 The plans for a drone air-traffic control system may set the ground work for bigger thi...
October 17th, 2018 By Kevin Fogarty

RISC-V: More Than a Core

 Interest in the open-source ISA marks a significant shift among chipmakers, but it will...
October 15th, 2018 By Brian Bailey

Power Issues Grow For Cloud Chips

 Optimizing processor design in high-performance computing now requires lots of small ch...
October 11th, 2018 By Ann Steffora Mutschler

Reliability, Machine Learning And Advanced Packaging

 Experts at the Table, part 1: The biggest concerns in chip design and how new markets a...
October 11th, 2018 By Ed Sperling

ADAS Meets Anthropology

 Why Nissan hired an anthropologist and how she expects people will deal with robotic cars.
October 10th, 2018 By Ed Sperling

Defect Challenges Growing In Advanced Packaging

 Spotting defects with existing inspection tools is getting harder, but upgrading to new...
October 8th, 2018 By Mark LaPedus

Lab-To-Fab Testing

 Test vendors are trying to build a bridge between verification and automated test in ma...
October 8th, 2018 By Ed Sperling

Automakers Take On More Responsibility

 Carmakers shake up supply chain with their own test and system-level integration strate...
October 8th, 2018 By Kevin Fogarty

more top stories »


Latest News

Week In Review: Manufacturing, Test

 Intel fab reorg; EUV race; expensive 5G phones.
October 19th, 2018 By Mark LaPedus

Week in Review: IoT, Security, Auto

 Arm Neoverse; raising Arizona R&D; Samsung buys Zhilabs.
October 19th, 2018 By Jeff Dorsch

Week In Review: Design, Low Power

 Arm's roadmap; AI architecture exploration; SoC development IDE.
October 19th, 2018 By Jesse Allen

Blog Review: Oct. 17

 Power in high-performance mobile; compression basics; memory m...
October 17th, 2018 By Jesse Allen

more news »



Research

Manufacturing Bits: Oct. 16

 World’s fastest camera; searching for bacteria.
By Mark LaPedus

System Bits: Oct. 16

 Quantum verification; quantum hackproof security; quantum algo...
By Ann Steffora Mutschler

Power/Performance Bits: Oct. 16

 On-chip modulator; building a resilient solar grid; boosting f...
By Jesse Allen

more research »



Startup Corner

Startup Puts Quantum Security on ...

 Taking quantum-mechanical principles and dragging them kicking...
By Kevin Fogarty

more startups »

STOCK MARKET NEWS

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Source: Premium Stock Market Widgets

Disclaimer:Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken in reliance thereon.

Videos


Variation At 10/7nm

October 18th, 2018


5G Test And Deployment

October 9th, 2018


Variability In Chip Manufacturing

October 9th, 2018


The Next Big Chip Companies

October 5th, 2018

Knowledge Centers / Entities, people and technologies explored

EDITORS
Ed Sperling

Ed Sperling

Editor in Chief
Mark LaPedus

Mark LaPedus

Executive Editor/ Manufacturing
Ann Steffora Mutschler

Ann Steffora Mutschler

Executive Editor/EDA
Susan Rambo

Susan Rambo

Managing Editor
Brian Bailey

Brian Bailey

Technology Editor/EDA
Ernest Worthman

Jeff Dorsch

Technology Editor
Katherine Derbyshire

Katherine Derbyshire

Technical Editor/Materials Engineering
Jesse Allen

Jesse Allen

Senior Editor/KC Administrator
Kevin Fogarty

Kevin Fogarty

Technology Editor

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