中文 English

Author's Latest Posts


Choosing The Correct High-Bandwidth Memory


The number of options for how to build high-performance chips is growing, but the choices for attached memory have barely budged. To achieve maximum performance in automotive, consumer, and hyperscale computing, the choices come down to one or more flavors of DRAM, and the biggest tradeoff is cost versus speed. DRAM remains an essential component in any of these architectures, despite years ... » read more

Growing System Complexity Drives More IP Reuse


IP reuse of both third-party and internal IP is growing, but it's also becoming more complex to manage. There is more IP being used, and more systems into which it needs to be integrated, combined with other IP, and tracked throughout an organization. In some cases, this is an economic requirement. In others, designs are so complex that engineering teams need to focus on where they will make... » read more

Designing For Multiple Die


Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As designs become more heterogeneous and disaggregated, they need to be modeled, properly floor-planned, verified, and debugged in the context of a system, rather than as individual components. Typi... » read more

3D-IC Reliability Degrades With Increasing Temperature


The reliability of 3D-IC designs is dependent upon the ability of engineering teams to control heat, which can significantly degrade performance and accelerate circuit aging. While heat has been problematic in semiconductor design since at least 28nm, it is much more challenging to deal with inside a 3D package, where electromigration can spread to multiple chips on multiple levels. “Be... » read more

IC Stresses Affect Reliability At Advanced Nodes


Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together for safety- and mission-critical applications. The causes of stress are numerous. In heterogeneous packages, it can stem from multiple components composed of different materials. “These materia... » read more

Improving Concurrent Chip Design, Manufacturing, And Test Flows


Semiconductor design, manufacturing, and test are becoming much more tightly integrated as the chip industry seeks to optimize designs using fewer engineers, setting the stage for greater efficiencies and potentially lower chip costs without just relying on economies of scale. The glue between these various processes is data, and the chip industry is working to weave together various steps t... » read more

On-Chip Power Distribution Modeling Becomes Essential Below 7nm


Modeling power distribution in SoCs is becoming increasingly important at each new node and in 3D-ICs, where tolerances involving power are much tighter and any mistake can cause functional failures. At mature nodes, where there is more metal, power problems continue to be rare. But at advanced nodes, where chips are running at higher frequencies and still consuming the same or greater power... » read more

Solving Thermal Coupling Issues In Complex Chips


Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and systems. Thermal coupling is essentially a junction between two devices, such as a chip and a package, or a transistor and a substrate, in which heat is transferred from one to the other. If not... » read more

Chip Design Shifts As Fundamental Laws Run Out Of Steam


Dennard scaling is gone, Amdahl's Law is reaching its limit, and Moore's Law is becoming difficult and expensive to follow, particularly as power and performance benefits diminish. And while none of that has reduced opportunities for much faster, lower-power chips, it has significantly shifted the dynamics for their design and manufacturing. Rather than just different process nodes and half ... » read more

Bespoke Silicon Rattles Chip Design Ecosystem


Bespoke silicon developers are shaking up relationships, priorities, and methodologies across the semiconductor industry, creating demand for skills that cross traditional boundaries, and driving new business models that leverage these enormous investments. Bespoke silicon designers today are a rare breed, capable of understanding the unique requirements of a specific domain, as well as a gr... » read more

← Older posts