Pandemics And Panic Chip Buying


U.S.-China trade tensions are creating uncertainty in the semiconductor market, but it is also causing another event right now—panic chip buying. At present, some but not all foundry vendors are seeing “rush orders” for select products and are running their fabs at full capacity. It’s not just leading-edge devices, but also mature technologies. A surge of chip orders started in Ma... » read more

Manufacturing Bits: June 16


GaN power modules Gallium-nitride (GaN) devices are emerging in several markets, such as power semiconductors and RF. GaN, a binary III-V compound, is a wide-bandgap technology, meaning it is faster and more efficient than silicon-based devices. GaN has 10 times the breakdown field strength with double the electron mobility than silicon. Generally, some GaN vendors don’t use a traditio... » read more

Week In Review: Auto, Security, Pervasive Computing


Edge, cloud, data center Programmable logic company Efinix used Cadence’s Digital Full Flow to finish Efinix’s Trion FPGA family for edge computing, AI/ML and vision processing applications, according to a press release. Last week Efinix also announced three software defined SoCs based on the RISC-V core. The SoCs are optimized to the Trion FPGAs. AI, machine learning Amazon will tempo... » read more

AI, 5G, IoT Combine In The Fifth Wave Of Computing


Something hugely positive is happening as a result of AI, 5G and the Internet of Things (IoT) reaching maturity at the same time. Like three kids growing up together, these technologies are feeding off each other’s energy and enhancing each other’s impact on the world. It’s this union, far greater than the sum of its parts, that I call the Fifth Wave of Computing. Why the fifth? We... » read more

How To Design User Equipment Antenna Systems For 5G Wireless Networks


Next-generation cellular wireless communications will enable numerous innovative, cutting-edge technologies and products. The combination of millimeter-wave (mm-wave) and microwave bands accompanied by advanced spatial multiplexing techniques such as massive multiple-input multiple-output (MIMO) will form the backbone of a new cellular technology called 5G. The evolution to 5G promises low late... » read more

Making Silicon Photonics Chips More Reliable


Silicon photonics has the ability to dramatically improve on-die and chip-to-chip communication within a package at extremely low power, but ensuring that signal integrity remains consistent over time isn't so simple. While this technology has been used commercially for at least the past decade, it never has achieved mainstream status. That's mostly due to the fact that Moore's Law scaling h... » read more

Configuring Processors In The Field


The convergence of two technologies, extensible processors and embedded FPGAs, is enabling the creation of processors that can be dynamically configured in the field. But it's not clear if there is a need for them or how difficult would it be to program them. This remains an open question even though there is evidence of its usefulness in the past and new products are expected to reach the mark... » read more

Conflicting Demands At The Edge


Semiconductor Engineering sat down to define what the edge will look like with Jeff DeAngelis, managing director of the Industrial and Healthcare Business Unit at Maxim Integrated; Norman Chang, chief technologist at Ansys; Andrew Grant, senior director of artificial intelligence at Imagination Technologies; Thomas Ensergueix, senior director of the automotive and IoT line of business at Arm; V... » read more

Week In Review: Auto, Security, Pervasive Computing


An effort to fund U.S. science and technology initiatives with at least $100 billion is getting a thumbs up from the SIA (Semiconductor Industry Association). The Endless Frontier Act —  a bipartisan, bicameral bill introduced on Thursday in the U.S. House of Representatives — will invest money into semiconductor research and development and other related fields such as material science, q... » read more

Rising Packaging Complexity


Synopsys’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow. » read more

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