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Technology Access Discriminates


I try not to get on a soap box in my blogs, but I hope you will allow me to express a concern that I see building and the projection of an unintended outcome. I am talking about who does and does not have access to technology. Over time, this divide can cause a further division based on geography, income level, or some other factor. The ramifications of it are not realized until it is too late.... » read more

Hyperconnectivity And The Path To 6G


Some may view the recent uptick in the news about next-generation wireless networking, specifically 6G, with some healthy skepticism as 5G is “just rolling out.” But when looking at the timelines, it becomes clear why 6G is critical and is also excellent news for electronics, and by extension, the design of semiconductors and systems. The same key elements that transformed the data center t... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC has posted strong results and raised its capital spending budget to $30 billion, up from its prior guidance of $25 billion to $28 billion in 2021. “Its outlook indicates broad-based semiconductor demand continues to strengthen amid supply chain tightness,” said Weston Twigg, an analyst at KeyBanc, in a research note. “TSMC posted another quarter of strong demand for leadi... » read more

More Data Drives Focus On IC Energy Efficiency


Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

Xilinx AI Engines And Their Applications


This white paper explores the architecture, applications, and benefits of using Xilinx's new AI Engine for compute intensive applications like 5G cellular and machine learning DNN/CNN. 5G requires between five to 10 times higher compute density when compared with prior generations; AI Engines have been optimized for DSP, meeting both the throughput and compute requirements to deliver the hig... » read more

mmWave Chip, Package, And Board Beamforming Solutions


RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. 5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and ... » read more

Meeting The Challenges Of 5G RF Production Test Services


Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there has been an increased focus on publications and products that have been introduced to the marketplace. Some of the more popular RF eco-system applications include cellphone, Wi-Fi, automotive, Internet of Things (IoT), location services, and more. Wi-Fi and cellphone servi... » read more

Chiplets For The Masses


Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

5G NR Design For eMBB


This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

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