Week in Review: IoT, Security, Auto


Products/Services Mentor, a Siemens Business, announced the release of the final phase of the Valor software New Product Introduction design-for-manufacturing technology, automating printed circuit board design reviews. The company has integrated DFM technology into the Xpedition software layout application. Arteris IP reports that Toshiba has taped out its next-generation advanced driv... » read more

Week In Review: Design, Low Power


M&A Intel will acquire Barefoot Networks, a maker of programmable Ethernet switch silicon and the P4 networking programming language for data centers. Founded in 2013, the Santa Clara-based company has raised $155.4 million in funding. Terms of the deal were not disclosed, but Intel expects the acquisition to be final in the third quarter of this year. Tools & IP Mentor extended it... » read more

Building Your First Chip For Artificial Intelligence? Read This First


As artificial intelligence (AI) capabilities enter new markets, the IP selected for integration provides the critical components of the AI SoC. But beyond the IP, designers are finding a clear advantage in leveraging AI expertise, services, and tools to ensure the design is delivered on time, with a high level of quality and value to the end customer for new and innovative applications. Over... » read more

Waiting For Chiplet Interfaces


There aren't many success stories related to chiplets today for a very simple reason—there are few standard interfaces defined for how to connect them. In fact, the only way to use them is to control both sides of the interface with a proprietary interface and protocol. The one exception is the definition of HBM2, which enables large quantities of third-party DRAM to be connected to a logi... » read more

HBM2 Vs. GDDR6: Tradeoffs In DRAM


Semiconductor Engineering sat down to talk about new DRAM options and considerations with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allen, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of th... » read more

BiST Grows Up In Automotive


Test concepts and methods that have been used for many years in traditional semiconductor and SoC design are now being leveraged for automotive chips, but they need to be adapted and upgraded to enable monitoring of advanced automotive systems during operation of a vehicle. Automotive and safety critical designs have very high quality, reliability, and safety requirements, which pairs pe... » read more

Choosing the Right Photonic Design Software


There are many factors to consider before deciding which photonic design software to use. To narrow the field, it can be helpful to ask these key questions as you investigate and compare software functionality. • Does the software provide enough flexibility to model and analyze products that offer the best solution to likely and possible design goals? • Is the simulation capable of pr... » read more

Blog Review: June 12


Synopsys' Taylor Armerding warns that city and state governments aren't learning from history when it comes to ransomware, and despite numerous examples of recent attacks are not implementing proper security measures or even keeping systems patched. Cadence's Paul McLellan shares highlights from the recent Embedded Vision Summit, including how light can be used at femtosecond intervals to ob... » read more

5G Drives New Test Approaches


Test/validation providers are claiming steady progress in the race to deliver 5G network components that support millimeter-wave as well as lower-frequency networks. Going from a state of no existing off-the-shelf test equipment suitable for 5G standalone new radio (NR), test companies are introducing equipment that can handle mmWave component testing on a limited scale. 5G is a next-generat... » read more

Week In Review: Design, Low Power


M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

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