The Week In Review: Manufacturing


Chipmakers The NAND market is in flux. Not long ago, troubled Toshiba put its memory unit on the block. Finally, the company has selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. Others attempted to bid on the business, including Western Digita... » read more

The Week In Review: Design


M&A Silvaco will acquire SoC Solutions, adding more IP experience to the company's portfolio. SoC Solutions, based in Atlanta, GA, focuses on pre-configured IP subsystems and IP targeting low power IoT and machine-to-machine communication. Terms of the deal were not disclosed, but the acquisition is expected to close soon. Imagination is putting the rest of the company up for sale after... » read more

Foundry Roadmaps: Real Solutions, Or Just Hedging?


Major semiconductor foundries have revealed their advanced technology roadmaps for the next few years. They’re all investing billions of dollars into the development of process technologies and packaging options. The number of alternatives has been described as ‘dizzying’. How can all the foundries remain profitable? How does the customer decide which ‘route’ to take? For the 2... » read more

The Week In Review: Manufacturing


Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

New BEOL/MOL Breakthroughs?


Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

Inside FD-SOI And Scaling


Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], sat down with Semiconductor Engineering to discuss FD-SOI, IC scaling, process technology and other topics. What follows are excerpts of that conversation. SE: In logic, GlobalFoundries is shipping 14nm finFETs with 7nm in the works. The company is also readying 22nm FD-SOI technology with 12nm FD-SOI ... » read more

Modeling On-Chip Variation At 10/7nm


Simulation, a workhorse tool for semiconductor design, is running out of steam at 10/7nm. It is falling behind on chips with huge gate counts and an enormous number of possible interactions between all the different functions that are being crammed onto a die. At simulation's root is some form of SPICE, which has served as its underpinnings ever since SPICE was first published 44 years ago. ... » read more

2.5D, ASICs Extend to 7nm


The leading-edge foundry market is heating up. For example, GlobalFoundries, Intel, Samsung and TSMC have recently announced their new and respective processes. The new processes from vendors range anywhere from 10nm to 4nm, although the current battle is taking place at 10nm and/or 7nm. In fact, one vendor, GlobalFoundries, this week will describe more details about its previously-announced... » read more

Fab Spending Hits New High


The latest update to the World Fab Forecast report, published on May 31, 2017 by SEMI, reveals record spending for fab construction and fab equipment. Korea, Taiwan, and China all see large investments, and spending in Europe has also increased significantly. In 2017, over US$49 billion will be spent on equipment alone, a historic record for the semiconductor industry. Spending on new fab cons... » read more

System Bits: June 6


Silicon nanosheet-based builds 5nm transistor To enable the manufacturing of 5nm chips, IBM, GLOBALFOUNDRIES, Samsung, and equipment suppliers have developed what they say is an industry-first process to build 5nm silicon nanosheet transistors. This development comes less than two years since developing a 7nm test node chip with 20 billion transistors. Now, they’ve paved the way for 30 billi... » read more

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