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Chip Industry Technical Paper Roundup: June 8


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective 🔗 imec, KU Leuven ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs 🔗 KAIST Thermal- and Aging-Aware Rowhamme... » read more

Chip Industry Technical Paper Roundup: Jun. 2


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Physical Foundation Models: Fixed HW implementations of large-scale neural networks 🔗 Yale University, Cornell University, Boston University, NTT Research Understanding Inference Scaling for LLMs: Bottlenecks, Trade-offs, and Performance Princip... » read more

Chip Industry Technical Paper Roundup: May 26


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving 🔗 Nvidia, Groq Not All Thoughts Need HBM: Semantics-Aware Memory Hierarchy for LLM Reasoning 🔗 USC, University of Wisconsin-Madison Water-based, large-scale transfer of... » read more

Chip Industry Technical Paper Roundup: May 19


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook 🔗 Ghent U., imec Challenges and prospects of 2D electronics for future monolithic CFETs 🔗 SKKU, Hanyang U. et al. A Device-Physics-Informed Artific... » read more

Chip Industry Technical Paper Roundup: May 11


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in High NA EUV🔗 Science Tokyo Performance and Energy Benefits of MRDIMMs 🔗 Barcelona Supercomputing Center, UPC, ... » read more

Chip Industry Technical Paper Roundup: May 5


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗 Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct... » read more

Chip Industry Technical Paper Roundup: Apr. 21


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Neural Computers 🔗 Meta AI, KAUST Characterizing tip-sample interaction dynamics on EUV nanostructures using AFM with a high-aspect ratio tip 🔗 Purdue University, Intel, Bruker  Photonic chip packaging for extreme environments ὑ... » read more

Chip Industry Technical Paper Roundup: Apr. 14


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor 🔗 Teikyo University, RIKEN Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis 🔗 University of Florida Reliability of Wide B... » read more

Chip Industry Technical Paper Roundup: Mar. 31


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DiscoRD: An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips 🔗 ETH Zurich, Rutgers University Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review 🔗 Univ... » read more

Chip Industry Technical Paper Roundup: Mar. 24


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations NL2GDS: LLM-aided interface for Open Source Chip Design 🔗 University of Bristol, Rutherford Appleton Laboratory An Integrated Failure and Threat Mode and Effect Analysis (FTMEA) Framework with Quantified Cross-Domain Correlation Factors for Automot... » read more

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