Chip Industry Technical Paper Roundup: Jun. 2

Fixed HW implementations of neural networks; LLM inference scaling; silent data corruption detection; NAND flash tunneling; HW-SW co-design benchmarks for SoCs; chiplet side-channel attacks; GPU power management.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Physical Foundation Models: Fixed HW implementations of large-scale neural networks 🔗 Yale University, Cornell University, Boston University, NTT Research
Understanding Inference Scaling for LLMs: Bottlenecks, Trade-offs, and Performance Principles 🔗 Micron Technology, Argonne National Laboratory
ITHICA: Intra-Thread Instruction Checking Approach for Defect-Induced Silent Data Corruptions 🔗 Stanford University, Google
Impact of Band-to-Band Tunneling in the Charge Trap Layer of NAND Flash Memory 🔗 University of Seoul, Samsung Electronics
HSCO-Bench: An Agent-Driven End-to-End HW-SW Co-design Benchmark for Systems-on-Chip 🔗 Columbia University, IBM Research
Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems 🔗 Grenoble INP – UGA, CNRS, TIMA
CompPow: A Case for Component-level GPU Power Management 🔗 AMD

Find more semiconductor research papers here.

 



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