Research Bits: May 28


Nanofluidic memristive neural networks Engineers from EPFL developed a functional nanofluidic memristive device that relies on ions, rather than electrons and holes, to compute and store data. “Memristors have already been used to build electronic neural networks, but our goal is to build a nanofluidic neural network that takes advantage of changes in ion concentrations, similar to living... » read more

Chip Industry Technical Paper Roundup: April 30


These new technical papers were recently added to Semiconductor Engineering’s library. [table id=222 /] Find more technical papers here. » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition (Penn State, et al.)


A new technical paper titled "In-Operando Spatiotemporal Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition" was published by researchers at Pennsylvania State University, Cornell University, Argonne National Lab, Georgia Tech and Forschungsverbund Berlin. Abstract "The drive toward non-von Neumann device architectures has led to an intense focus on ins... » read more

Research Bits: April 16


Tunable thermal conductivity in memristors Researchers from the Center for Research in Biological Chemistry and Molecular Materials (CiQUS) and Forschungszentrum Juelich discovered that oxide-based memristive devices can demonstrate tunable thermal conductivity. Alongside the memristor's electrical resistive switching, a thermal resistive switching effect also occurs at the metal-oxide inte... » read more

Chip Industry Week In Review


By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

Chip Industry Technical Paper Roundup: Jan. 23


New technical papers added to Semiconductor Engineering’s library this week. [table id=189 /] More ReadingTechnical Paper Library home » read more

System For Composing Hardware Generators (Cornell Univ.)


A technical paper titled “Correct and Compositional Hardware Generators” was published by researchers at Cornell University. Abstract: "Hardware generators help designers explore families of concrete designs and their efficiency trade-offs. Both parameterized hardware description languages (HDLs) and higher-level programming models, however, can obstruct composability. Different concrete ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Superconducting Material With Exceptional Tunability


A technical paper titled “Strain-switchable field-induced superconductivity” was published by researchers at Massachusetts Institute of Technology (MIT), University of Washington, Argonne National Laboratory, Cornell University, Zhejiang University of Science and Technology, and George Mason University. Abstract: "Field-induced superconductivity is a rare phenomenon where an applied magne... » read more

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