Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Superconducting Material With Exceptional Tunability


A technical paper titled “Strain-switchable field-induced superconductivity” was published by researchers at Massachusetts Institute of Technology (MIT), University of Washington, Argonne National Laboratory, Cornell University, Zhejiang University of Science and Technology, and George Mason University. Abstract: "Field-induced superconductivity is a rare phenomenon where an applied magne... » read more

Chip Industry’s Technical Paper Roundup: October 31


New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

Measurement-Induced Quantum Information Phases On Up To 70 Superconducting Qubits (Google/Stanford)


A technical paper titled “Measurement-induced entanglement and teleportation on a noisy quantum processor” was published by researchers at Google Quantum AI, Google Research, Stanford University, University of Texas at Austin, Cornell University, University of Massachusetts, University of Connecticut, Auburn University, University of Technology Sydney, University of California, and Columbia... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Security Research: Technical Paper Round-up


A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

Side-Channel Security Analysis of Intel Optane Persistent Memory


A new technical paper titled "Side-Channel Attacks on Optane Persistent Memory" was published by researchers at University of Virginia, Cornell University, and Graz University of Technology. This paper was included at the recent 32nd USENIX Security Symposium. Abstract: "There is a constant evolution of technology for cloud environments, including the development of new memory storage tech... » read more

Week In Review: Design, Low Power


Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Week In Review: Semiconductor Manufacturing, Test


Samsung announced plans to invest $230 billion (300 trillion won) over the next two decades to construct the world’s largest semiconductor manufacturing complex in South Korea’s Gyeonggi Province, reports AP. The complex will consist of five new semiconductor plants producing memory and logic chips. Chips will be the enabling engines, requiring massive investments in new technology, m... » read more

Week In Review: Manufacturing, Test


Highlights from ITC The hot topic at this week’s International Test Conference (ITC) was tackling silent data corruption, with panel discussions, papers, and Google’s Parthasarathy Ranganathan’s keynote address all emphasizing the urgency of the issue. In the past two years Meta, Google, and Microsoft have reported on silent errors, errors not detected at test, which are adversely impact... » read more

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