tag: Cornell University

Gallium Oxide Power Electronic Roadmap
By Technical Paper Link - 18 Apr, 2022 - Comments: 0

New research paper addressing challenges in using gallium oxide. ABSTRACT "Gallium Oxide has undergone rapid technological maturation over the last decade, pushing it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the potential for a new semiconductor system requires a concerted effort by the community to address technical barriers which limit performance. Du... » read more

Review of essential use of fluorochemicals in lithographic patterning and semiconductor processing
By Technical Paper Link - 06 Apr, 2022 - Comments: 0

New academic paper by researchers from Cornell University.   Abstract "We identify and describe categories of fluorochemicals used to produce advanced semiconductors within the lithographic patterning manufacturing processes. Topics discussed include the per- and polyfluoroalkyl substance (PFAS) materials used and their necessary attributes for successful semiconductor manufacturing... » read more

Big Changes In AI Design
By Ed Sperling And Susan Rambo - 06 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 31 Jul, 2020 - Comments: 0

Analog Devices (ADI) acquired the HDMI business of Invecas. “The acquisition of Invecas' HDMI business positions ADI to deliver more complete solutions throughout the entire customer journey – from chip, to certification, to end product," said John Hassett, Senior Vice President, Industrial and Consumer at Analog Devices. "We are thrilled to enhance ADI’s capabilities with the addition of... » read more

Manufacturing Bits: Feb. 25
By Mark LaPedus - 25 Feb, 2020 - Comments: 0

Diamond finFETs HRL Laboratories has made new and significant progress to develop diamond finFETs. HRL, a joint R&D venture between Boeing and General Motors, has developed a new ohmic regrowth technique for diamond FETs. This in turn could pave the way towards commercial diamond FETs. Applications include spacecraft, satellites and systems with extreme temperatures. Still in R&D, diamo... » read more

Manufacturing Bits: Dec. 23
By Mark LaPedus - 23 Dec, 2019 - Comments: 0

Gallium oxide transistors At the recent IEEE International Electron Devices Meeting (IEDM), Cornell University and Hosei University presented a paper on a gallium oxide vertical transistor with a record breakdown voltage. Crystalline beta gallium oxide is a promising wide bandgap semiconductor material, which is used for power semiconductor applications. Gallium oxide has a large bandgap of... » read more

Power/Performance Bits: Nov. 25
By Jesse Allen - 25 Nov, 2019 - Comments: 0

Rigid or flexible in one device Researchers at the Korea Advanced Institute of Science and Technology (KAIST), Electronics and Telecommunications Research Institute (ETRI) in Daejeon, University of Colorado Boulder, Washington University in St. Louis, Cornell University, and Georgia Institute of Technology proposed a system that would allow electronics to transform from stiff devices to flexib... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jun, 2019 - Comments: 0

Market research What’s the CapEx outlook for 2020? Semiconductor capital spending is down in 2019, but the industry faces another slump in 2020, according to IC Insights. The firm sees a 15% decline in CapEx for 2019 with a 5% drop expected in 2020. New 300mm fab construction in Korea is still going strong despite the memory downturn, according to SEMI. “Korea’s fab construction spen... » read more

Power/Performance Bits: June 4
By Jesse Allen - 04 Jun, 2019 - Comments: 0

Flexible high-temp dielectric Researchers at Rice University, Georgia Institute of Technology, and Cornell University developed a new high-temperature dielectric nanocomposite for flexible electronics, energy storage, and electric devices that combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The polymer nanofibers act as a structural reinforcement, w... » read more

System Bits: May 28
By Jeff Dorsch - 28 May, 2019 - Comments: 0

Home robotics get cozier Cornell University’s Guy Hoffman was perplexed when he first saw social robots in stores. “I noticed a lot of them had a very similar kind of feature – white and plasticky, designed like consumer electronic devices,” said Hoffman, assistant professor and the Mills Family Faculty Fellow in the Sibley School of Mechanical and Aerospace Engineering. “Especial... » read more

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