Chip Industry Technical Paper Roundup: August 19


New technical papers recently added to Semiconductor Engineering’s library: [table id=465 /] Find more semiconductor research papers here. » read more

Server-Scale Programmable Photonic Fabric to Interconnect Accelerators Within Servers (Cornell University, Lightmatter)


A new technical paper titled "Morphlux: Programmable chip-to-chip photonic fabrics in multi-accelerator servers for ML" was published by researchers at Cornell University and Lightmatter. Abstract "We optically interconnect accelerator chips (e.g., GPUs, TPUs) within compute servers using newly viable programmable chip-to-chip photonic fabrics. In contrast, today, commercial multi-accelerat... » read more

Chip Industry Technical Paper Roundup: August 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=460 /] Find more semiconductor research papers here. » read more

Preventing End-to-End Slowdowns In Accelerated Chip Multi-Processors (Cornell University, Intel Labs)


A new technical paper titled "RACER: Avoiding End-to-End Slowdowns in Accelerated Chip Multi-Processors" was published by researchers at Cornell University and Intel Labs. Abstract "Recent chip multiprocessors incorporate several on-chip accelerators, marking the beginning of the Accelerated Chip Multi-Processor (XMP) era in datacenters. Despite the close proximity of accelerators and gener... » read more

Chip Industry Technical Paper Roundup: July 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=456 /] Find more semiconductor research papers here.   » read more

GAA Transistors: 3D Atomic-Scale Metrology of Strain Relaxation and Roughness via Electron Ptychography (Cornell, ASM, TSMC)


A new technical paper titled "3D Atomic-Scale Metrology of Strain Relaxation and Roughness in Gate-All-Around (GAA) Transistors via Electron Ptychography" was published by researchers at Cornell University, ASM and TSMC. Abstract "To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes dow... » read more

Chip Industry Week in Review


The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Research Bits: Apr. 1


Neuro-synaptic RAM Researchers from the National University of Singapore (NUS) and King Abdullah University of Science and Technology (KAUST) found that a standard silicon transistor can function like a biological neuron and synapse when arranged and operated in a specific way. The team was able to replicate both neural firing and synaptic weight changes by adjusting the resistance of the b... » read more

Chip Industry Technical Paper Roundup: Mar. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=415 /] Find more semiconductor research papers here. » read more

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