Week In Review: Design, Low Power


Intel disclosed a speculative execution side-channel attack method called L1 Terminal Fault (L1TF). Leslie Culbertson, Intel's executive vice president and general manager of Product Assurance and Security, writes: "This method affects select microprocessor products supporting Intel Software Guard Extensions (Intel SGX) and was first reported to us by researchers at KU Leuven University, Techni... » read more

Impact Of IP On AI SoCs


The combination of mathematics and processing capability has set in motion a new generation of technology advancements with an entire new world of possibilities related to Artificial Intelligence. AI mimics human behavior using deep learning algorithms. Neural networks are what we define as deep learning, which is a subset of machine learning, which is yet a subset of AI, as shown in Figure 1. ... » read more

Embedded FPGA Timing


Namit Varma, senior director of Achronix’s India Technology Center, explains how to time an eFPGA, what can go wrong, what are the different clocking scenarios, and what impact variation has on the process. https://youtu.be/Jq4XUKnniB4 » read more

Not Enough Respect For SoC Interconnect


For high-volume system-on-chip (SoC) applications—artificial intelligence (AI), automotive, mobility, solid state drives and more—effective interconnect technology can generate hundreds of millions of dollars in revenue due to smaller chip area, better functionality and faster delivery of SoC platforms. State-of-the-art interconnect technology also allows chip designers to create SoC deriva... » read more

Solving Systemic Complexity


EDA and IP companies have begun branching out in entirely new directions over the past 12 to 18 months, pouring resources into entirely different problems than electrostatic issues and routing complexity. While they're still focused on solving complexity at 10/7/5nm, they also recognize that enabling Moore's Law isn't the only opportunity. For an increasing number of new and established chip... » read more

Debug Issues Grow At New Nodes


Debugging and testing chips is becoming more time-consuming, more complicated, and significantly more difficult at advanced nodes as well as in advanced packages. The main problem is that there are so many puzzle pieces, and so many different use cases and demands on those pieces, that it's difficult to keep track of all the changes and potential interactions. Some blocks are "on" sometimes,... » read more

On-Chip Monitoring Of FinFETs


Stephen Crosher, CEO of Moortec, sat down with Semiconductor Engineering to discuss on-chip monitoring and its impact on power, security and reliability, including predictive maintenance. What follows are excerpts of that conversation. SE: What new problems are you seeing in design? Crosher: There are challenges emerging for companies working on advanced nodes, including scaling and trans... » read more

EDA, IP Sales Strong Everywhere


EDA and semiconductor IP sales set new records around the globe, with the Americas passing the $1 billion revenue mark for the first time, according to just-released statistics from the ESD Alliance's Market Statistics Service. Newly compiled numbers for Q1 2018, the latest stats available, show growth in all regions, including Europe and Japan. In fact, the only negative number involved non... » read more

Verification As A Flow


Semiconductor Engineering sat down to discuss the transformation of verification from a tool to a flow with Vladislav Palfy, global manager application engineering for OneSpin Solutions; Dave Kelf, chief marketing officer for Breker Verification Systems; Mark Olen, product marketing group manager for Mentor, A Siemens Business; Larry Melling, product management director, System & Verificati... » read more

5nm Design Progress


Activity surrounding the 5nm manufacturing process node is quickly ramping, creating a better picture of the myriad and increasingly complex design issues that must be overcome. Progress at each new node after 28nm has required an increasingly tight partnership between the foundries, which are developing new processes and rule decks, along with EDA and IP vendors, which are adding tools, met... » read more

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