Single Vs. Multi-Patterning EUV


Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce released its foundry rankings for the first quarter of 2019. TSMC is still the clear leader, followed in order by Samsung, GlobalFoundries and UMC, according to the firm. It was a tough quarter for all foundries. Samsung has rolled out its new High Bandwidth Memory (HBM2E) product. The new solution, called Flashbolt, is the industry’s first HBM2E to deliver a 3.2Gbps... » read more

Week In Review: Design, Low Power


Synopsys announced several new products: a new test family, a physical verification solution, and a software library for neural net SoCs. TestMAX, the new family of test products, includes soft error analysis and X-tolerant logic BIST for automotive test and functional safety requirements. TestMAX enables test through functional high-speed interfaces and supports early validation of DFT logi... » read more

Slow And Cautious Start To 2019 For Memory Manufacturers


Both NAND and DRAM prices began dropping in the second half of 2018 after a couple years at record highs. Product oversupply and excess inventories are signaling a bleak outlook for the memory market in the first half of 2019. With these conditions in mind, SK Hynix and Samsung have slowed or put on hold their plans for capacity expansion in 2H18 and 2019. The chart below shows DRAM capacity... » read more

Week In Review: Manufacturing, Test


Chipmakers How bad is the slowdown in the IC industry? The memory market is terrible, while other markets are slowing. One company—Renesas--is feeling the brunt. Citing the IC slowdown, Renesas will temporarily halt production at 13 of the company's 14 production facilities, according to a report from Nikkei. Renesas confirmed the move. “Renesas is considering implementing measures to ... » read more

Week In Review: Manufacturing, Test


Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

Week In Review: Manufacturing, Test


Chipmakers IC Insights has released the process technology roadmaps for chipmakers and foundries. GlobalFoundries, Intel, Samsung, SMIC, TSMC and UMC are highlighted. GlobalFoundries has announced that the company’s 8SW RF SOI technology has delivered more than a $1 billion of client design win revenue since its launch in 2017. RF SOI is designed for RF switches and other devices in 4G/... » read more

5 Top Storylines For NAND Biz


2019 is expected to be a busy, if not difficult, year in the NAND flash memory market. Vendors will continue to ramp up 3D NAND, the successor to traditional 2D or planar NAND. Then, over the last year, prices for NAND have dropped with oversupply in the market. What’s in store in 2019? Vendors are expected to rush out their next-generation products. Then, there is a debate whether the... » read more

In-Memory Vs. Near-Memory Computing


New memory-centric chip technologies are emerging that promise to solve the bandwidth bottleneck issues in today’s systems. The idea behind these technologies is to bring the memory closer to the processing tasks to speed up the system. This concept isn’t new and the previous versions of the technology fell short. Moreover, it’s unclear if the new approaches will live up to their billi... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Taiwan specialty foundry vendor Vanguard International Semiconductor (VIS) will acquire GlobalFoundries’ Fab 3E facility in Singapore for $236 million. Fab 3E manages a monthly capacity of approximately 35,000 200mm wafers. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. VIS currently has three 200mm fa... » read more

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