DARPA and a number of major vendors are backing this modular approach, but hurdles remain.

D2S’ CEO sounds off on the impact of deep learning, EUV and other manufacturing advancements.

Improvements in power, performance and area are much more difficult to achieve, but solutions are coming into focus.

It’s been an uneven path leading to the current state of AI, and there’s still a lot of work ahead.

Shift to cloud model has kept power consumption in check, but that benefit may have run its course.

Continued integration is no longer the natural way forward for semiconductors. What needs to happen to make it easier?

Improvements in power, performance and area are much more difficult to achieve, but solutions are coming into focus.

Shift to cloud model has kept power consumption in check, but that benefit may have run its course.

The next-gen wireless technology is riddled with problems, but that hasn’t slowed the pace of development.

Edge compute covers a wide range of applications. Understanding bandwidth and capacity needs is critical.

Assessing the reliability of a device requires adding more physical factors into the analysis, many of which are interconnected in complex ways.

In-chip monitoring techniques are growing for automotive, industrial, and data center applications.

Using the Von Neumann architecture for artificial intelligence applications is inefficient. What will replace it?