tag: AI

From Tool Agents To Flow Agents
By Brian Bailey - 30 Apr, 2025 - Comments: 0

Experts At The Table: AI is starting to impact several parts of the EDA design and verification flows, but so far these improvements are isolated to single tool or small flows provided by a single company. What is required is a digital twin of the development process itself on which AI can operate. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, in... » read more

Tape-Out Failures Are The Tip Of The Iceberg
By Brian Bailey - 24 Apr, 2025 - Comments: 4

The headline numbers for the new Wilson Research/Siemens functional verification survey are out, and it shows a dramatic decline in the number of designs that are functionally correct and manufacturable. In the past year, that has dropped from 24% to just 14%. Along with that, there is a dramatic increase in the number of designs that are behind schedule, increasing from 67% to 75%. Over the ne... » read more

AI Drives Re-Engineering Of Nearly Everything In Chips
By Ed Sperling - 24 Apr, 2025 - Comments: 0

AI's ability to mine patterns across massive quantities of data is causing fundamental changes in how chips are used, how they are designed, and how they are packaged and built. These shifts are especially apparent in high-performance AI architectures being used inside of large data centers, where chiplets are being deployed to process, move, and store massive amounts of data. But they also ... » read more

AI-Driven Verification Regression Management
By Paul Carzola - 24 Apr, 2025 - Comments: 0

By Paul Carzola and Taruna Reddy Coping with the endless growth in chip size and complexity requires innovative electronic design automation (EDA) solutions at every stage of the development process. Better algorithms, increased parallelism, higher levels of abstraction, execution on graphics processing units (GPUs), and use of AI and machine learning (ML) all contribute to these solutions. ... » read more

New Ways To Improve EDA Productivity
By Ann Mutschler - 24 Apr, 2025 - Comments: 0

EDA vendors are taking aim at new ways to improve the productivity of design and verification engineers, who are struggling to keep pace with exponential increases in chip complexity in tight time-to-market windows and with constrained engineering talent pipelines. In the past, progress often was as straightforward as improving algorithms or parallelizing computations in a linear flow. But w... » read more

Need For Speed Drives Targeted Testing
By Gregory Haley - 23 Apr, 2025 - Comments: 0

As packaging complexity increases and nodes shrink, defect detection becomes significantly more difficult. Engineers must contend with subtle variations introduced during fabrication and assembly without sacrificing throughput. New material stacks degrade signal-to-noise ratios, which makes metrology more difficult. At the same time, inspection systems face a more nuanced challenge — how t... » read more

Research Bits: April 22
By Jesse Allen - 22 Apr, 2025 - Comments: 0

PIC heterogeneous integration Researchers from Hewlett Packard Labs, Indian Institutes of Technology Madras, Microsoft Research, and University of Michigan built an AI acceleration platform based on heterogeneously integrated photonic ICs. The PIC combines silicon photonics along with III-V compound semiconductors that functionally integrate lasers and optical amplifiers to reduce optical l... » read more

Secure Handling Of Financial Data In Manufacturing
By Anne Meixner - 21 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the advantages associated with linking financial data with manufacturing data analytic platforms, real security challenges and the best uses for AI/ML methods, with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at p... » read more

Packaging With Fewer People And Better Results
By Gregory Haley - 17 Apr, 2025 - Comments: 0

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

What’s Changing In SerDes
By Ed Sperling - 16 Apr, 2025 - Comments: 0

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product marketing manager at Alphawave Semi, talks about the impact of faster data movement on the transmitter (more power) and on the receiver (gain and advanced equalization), how to ensure signal inte... » read more

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