Solving The Mixed Criticality Challenge In Automotive Controllers


Car users want immersive and interactive in-vehicle experiences, especially as autonomous driving technology takes over more of our driving responsibilities. To satisfy this demand, automotive manufacturers are deploying multiple display environments in their cars, from cockpits to heads-up displays and from central infotainment screens to rear-seat entertainment. All of these displays are powe... » read more

10Base-T1S Ethernet And The Use Of MACsec For Link Security


10Base-T1S (henceforth in this blog referred to as T1S) is a relatively new standard for a 10Mbit/s single-pair Ethernet over an unshielded, single-twisted pair that was introduced with the IEEE 802.3cg-2019 specification. It brings Ethernet technology into the low-cost, edge applications space, enabling connection of “edge nodes” (remote sensors, actuators, light controls, etc.) to a “he... » read more

Driving The Future: How Rust And Virtual ECUs Are Transforming AUTOSAR Classic Automotive Software


By Nicolas Amringer and Stefan Pruisken The landscape of automotive software is undergoing significant transformation, driven by growing system complexity, stringent safety standards, and the need for streamlined development cycles. Virtual ECUs (vECUs) have become indispensable for accelerating both development and validation processes. In this context, the adoption of Rust within AUTOSAR C... » read more

Redefining SoC Design: The Shift To Secure Chiplet-Based Architectures


The semiconductor industry is undergoing a paradigm shift from monolithic system-on-chip (SoC) architectures to modular, chiplet-based designs. This transformation is driven by escalating design complexity, soaring fabrication costs, and the relentless pursuit of efficiency. However, as chiplet adoption accelerates, security becomes a critical concern, requiring robust measures to protect data,... » read more

How To Catch “Disappearing” Latent Defects


Automotive is demanding more emphasis on chip reliability. By 2020, electronic devices will account for over 35% of the manufacturing cost of an automobile, and by 2030, that number is expected to rise to 50%. Tens of thousands of cars are manufactured each day, with each car using thousands of chips — and if even one of those chips fails in the field it may have disastrous consequences: los... » read more

Mixed-Criticality SW Architectures for Centralized HPC Platforms in Software-Defined Vehicles (Daimler, TU Munich)


A new technical paper titled "Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in Software-Defined Vehicles: A Systematic Literature Review" was published by researchers at Daimler Truck AG and Technical University of Munich. Abstract "Centralized electrical/electronic architectures and High-Performance Computers (HPCs) are redefining automotive software develo... » read more

Measurements and Simulation-Based Characterization Of eFuses


In conventional safety systems, the off state can be assumed to be safe. With ADAS, this is no longer automatically the case. This makes it necessary to adopt new approaches to fuse protection, which will subsequently spread to other industries. Traditionally, the vehicle electrical system was protected by sacrificial fuses. These reliably disconnect the power supply in the event of overcurr... » read more

In-System/In-Field Testing Using High-Quality Deterministic Test Patterns


The amount of electronic content in passenger cars is growing rapidly, primarily due to the integration of advanced safety features. The shift towards fully autonomous vehicles, which must comply with stringent safety standards, will further increase the number of electronic components required. Testing efforts must be of exceptional quality. The target test time is often limited to less than 1... » read more

The Challenges Of Testing Automotive Chips


For as long as semiconductor devices have been around, motor vehicles have been one of the toughest operating environments. Chips in automobiles, trucks, and buses are subject to extremes of temperature, humidity, vibration, and radiation. The challenges of designing for these environmental conditions have grown more pronounced with advanced technology nodes, which are necessary to satisfy mark... » read more

Challenges In Using Sub-7nm ICs In Automotive


The automotive industry is producing vehicles with increasing levels of real-time decision-making, enabled by thousands of ICs, sensors, and multi-chip packages, but making sure these systems work flawlessly throughout their expected lifetimes is a growing challenge. Automotive chips traditionally were developed at mature process nodes in five- to seven-year cycles, but much has changed over... » read more

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