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tag: automotive

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

The Silicon Carbide Race Begins
By Patrick Waurzyniak - 20 Sep, 2021 - Comments: 0

The growing adoption of silicon carbide (SiC) for a variety of automotive chips has reached the tipping point where most chipmakers now consider it a relatively safe bet, setting off a scramble to stake a claim and push this wide-bandgap technology into the mainstream. SiC holds great promise for a number of automotive applications, particularly for battery electric vehicles. It can extend d... » read more

Qualifying The ExposedPad TQFP For AEC-Q006 Grade 0
By Amkor - 15 Sep, 2021 - Comments: 0

Semiconductor packages used in various vehicle applications require high reliability. As technological innovations in the automotive market increase, the demand for highly reliable packaging is increasing for applications in autonomous driving, human interfaces, electric vehicles (EVs), hybrid electric vehicles (HEVs) and more. Package reliability is essential because automotive packages must p... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Functional Safety Working Group
By Accellera - 08 Sep, 2021 - Comments: 0

With the increasing demand of compute power, the electrical and electronic systems deployed in safety-critical applications become more and more complex. This complexity also extends to Functional Safety (FS) requirements, and it affects all parts of the system including hardware and software components. Addressing FS requires specific safety activities and operations, documented in what the... » read more

GPIOs: Critical IP For Functional Safety Applications
By Synopsys - 08 Sep, 2021 - Comments: 0

The prevalence and complexity of electronics and software (EE systems) in automotive applications are increasing with every new generation of car. The critical functions within the system on a chip (SoC) involve hardware and software that perform automotive-related signal communication at high data rates to and from the components off-chip. Every SoC includes general purpose IOs (GPIOs) on its ... » read more

Automotive: Innovations, Trends And The Intersection With Semiconductors
By KLA - 07 Sep, 2021 - Comments: 0

The semiconductor industry performed better than expected in 2020 despite the impact of COVID-19 on the global economy and is preparing for accelerated growth in 2021 and beyond. The global coronavirus pandemic significantly increased demand for communications electronics and fueled the growth in cloud computing to support remote work and learning. Semiconductor manufacturers, many running at p... » read more

Consistent Test Reuse Across MIL, SIL, And HIL In A Model-Driven Development Workflow
By Siemens EDA - 01 Sep, 2021 - Comments: 0

This paper presents a standards-based, systematic, and automated generative MDD/XIL workflow that helps automotive developers develop their production ECU V&V suites early during software modeling and re-use them throughout the overall systems engineering project. The test cases developed during design can be re-used through to production ECU testing and ultimately for automated regression V&V ... » read more

Current And Future Packaging Trends
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss IC packaging technology trends and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Thomas Uhrmann, directo... » read more

Physics-Based Sensor Validation Via Ansys: Driving New Automotive Innovations
By Ansys - 13 Aug, 2021 - Comments: 0

Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, highway signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on flawless sensor performance. With so many sensors supporting the advanced driv... » read more

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