Week In Review: Design, Low Power


Allegro DVT acquired Amphion Semiconductor, bringing together two developers of video codec IP. Allegro DVT said the merger will make it the first semiconductor IP company to offer commercially available hardware-based, real-time encoder and decoder solutions for the new AV1 video encoding format for SoC implementations, supporting 4K/UHD up to 8K. Based in Belfast, Northern Ireland, Amphion wa... » read more

Less Food, More Thought


A trillion "things" are expected to be connected to the Internet sometime in the next decade. No matter how power-efficient these things are, they probably will require enough coin-sized lithium batteries to drain the world's supply of element No. 3 on the Periodic Table. They also will increase the demand for power everywhere, and that's even before tacking on electric vehicles, the edge, robo... » read more

Focus Shifts To Wasted Power


Mobile phones made the industry aware of power, but now the focus is shifting to the total energy needed to perform a task. Activity that is unnecessary to perform the intended task is wasted power, and reducing it requires some new methodologies and structural changes within development teams. There is a broadening awareness about power. "The companies doing SoCs for mobile lead the charge ... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

AI Warnings For Safer Driving


You’re driving to work, the same route you take every day. But this time, a storm passes over: you’re suddenly faced with heavy rain and reduced visibility. All of a sudden, the “accident score” meter on your car’s dashboard moves into the red. You ease off the gas, move out of the passing lane and your score drops down to amber—you can’t get it into the green due to the advers... » read more

Changes In Data Storage and Usage


Doug Elder, vice president and general manager of OptimalPlus, talks about what’s changing in the storage and collection, including using data lakes and data engineering to break down silos and get data into a consistent format, and why it’s essential to define data up front based upon how quickly it needs to be accessed, as well as who actually owns the data. » read more

Testing Against Changing Standards In Automotive


The infusion of more semiconductor content into cars is raising the bar on reliability and changing the way chips are designed, verified and tested, but it also is raising a lot of questions about whether companies are on the right track at any point in time. Concerns about liability are rampant with autonomous and assisted driving, so standards are being rolled out well in advance of the te... » read more

More Data, More Processing, More Chips


Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Coordinating Automotive Embedded Software Development Requires A Unified Approach


The rising intelligence and connectivity of vehicles are making the interactions between software and physical systems more complex, exposing the deficiencies of current processes, tools and methods. To compete in the technological race for the future of mobility, companies must evolve their software development processes today. A common digital thread connecting software and physical systems t... » read more

Week in Review – IoT, Security, Autos


Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

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