Reliability Of Embedded Wafer-Level BGA For Automotive Radar Applications


With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

At The Intersection Of Electronics And Automobiles


While we’re idling at this traffic light, let’s “blue sky” a bit. Over the course of a year, the average American driver spends the equivalent of more than seven 40-hour work weeks just sitting in a car. Crazy, right?  But who measures work weeks as only 40 hours anymore? Those 280+ hours spent driving means there’s a lot of non-productive overhead time, to borrow a term from semi... » read more

Automotive Opps Drive Change For Systems Companies


Without a doubt, the tremendous amount of activity surrounding the opportunities in today and tomorrow’s vehicles is mind-boggling but absolutely exciting. When big shifts occur such as the one we are seeing in automotive, that equates to big opportunities for companies that get it right with a certain application, at the right time. It means partnering with the right ecosystem partners, f... » read more

On-Chip Clock And Process Monitoring Using STAR Hierarchical System’s Measurement Unit


Functional safety is one of the most critical priorities for system-on-chips (SoCs) that are involved in automotive, aerospace and industrial applications. These requirements are driven by standards such as ISO 26262 and are the backbone of the design and testing of automotive ICs. Synopsys’ STAR Hierarchical System’s Measurement Unit helps ensure the accuracy of on-chip clock frequency and... » read more

How To Sleep Easier If You Test Auto ICs For A Living


Last month, I looked at the product definition process of automotive ICs, using the $7 billion microcontroller market as an illustration of design exploration to optimize performance, features, die size and product cost. Now I’d like to look at the back end of the process — the final IC testing that’s still critical no matter how sound the upfront work in defining a featuring set and aptl... » read more

The Road To Autonomous Driving Is Paved With New Opportunities For Chip Companies


The migration from human-driven to self-driven vehicles in the next few years will provide the semiconductor industry with new opportunities. Vehicles on the road today have so far featured only a few digital enhancements and even less automation. Indeed, the most noticeable enhancements have been made in the advancement of the infotainment console within the dashboard – the ability to str... » read more

Securing Automotive Over-The-Air (SOTA) Updates


Modern vehicles are essentially a network of networks – equipped with a range of embedded communication methods and capabilities. Consequently, there is broad industry consensus that vehicle cyber security should rank as a top priority for the automotive sector. In this context, automotive OEMs have begun to provide secure over-the-air (SOTA) updates for various systems. Recently, the non-... » read more

Enabling Automotive Design


Falling automotive electronics prices, propelled by advances in chip manufacturing and innovations on the design side, are driving a whole new level of demand across the automotive industry. Innovations that were introduced at the luxury end of the car market over the past couple years already are being implemented in more standard vehicles. The single biggest driver of change in the automo... » read more

Big Challenges, Changes For Debug


By Ann Steffora Mutschler & Ed Sperling Debugging a chip always has been difficult, but the problem is getting worse at 7nm and 5nm. The number of corner cases is exploding as complexity rises, and some bugs are not even on anyone's radar until well after devices are already in use by end customers. An estimated 39% of verification engineering time is spent on debugging activities the... » read more

Tech Talk: Verification


Frank Schirrmeister, Cadence's senior group director for verification platforms, talks about what's changing in verification with 5G, machine learning, greater connectivity, advanced packaging, and the growing need to build security into designs. https://youtu.be/GMF8BkmdJzE » read more

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