Looming Issues And Tradeoffs For EUV


Momentum is building for extreme ultraviolet (EUV) lithography, but there are still some major challenges to solve before this long-overdue technology can be used for mass production. [gettech id="31045" comment="EUV"] lithography—a next-generation technology that patterns tiny features on a chip—was supposed to move into production around 2012. But over the years, EUV has encountered se... » read more

The Week In Review: Design


M&A Synopsys acquired materials modeling company QuantumWise. QuantumWise tools focus on atomic-scale modeling of nanostructures using quantum-mechanical computational methods, classical potentials, and electrostatic models. Based in Denmark, the company was started in 2008 when it acquired the assets of Atomistix. The technology will be integrated with Synopsys' Sentaurus TCAD. Terms of t... » read more

Fab Equipment Spending Sets New Record


Fab equipment spending (new and refurbished) is expected to increase by 37% for 2017, reaching a new annual spending record of about $55 billion. The World Fab Forecast also forecasts that in 2018, fab equipment spending will increase even more, another 5%, for a record high of about $58 billion. The last record spending was in 2011 with about $40 billion. The spending in 2017 is now expected t... » read more

What Happened To ReRAM?


Resistive RAM (ReRAM), one of a handful of next-generation memories under development, is finally gaining traction after years of setbacks. Fujitsu and Panasonic are jointly ramping up a second-generation ReRAM device. In addition, Crossbar is sampling a 40nm ReRAM technology, which is being made on a foundry basis by China’s SMIC. And not to be outdone, TSMC and UMC recently put ReRAM on ... » read more

Node Warfare?


By Mark LaPedus & Ed Sperling GlobalFoundries uncorked a 12nm finFET process, which the company said will provide a 15% increase in density and more than 10% improvement in performance over the foundry's existing 14nm process. This is GlobalFoundries' second 12nm process. It announced a 12nm FD-SOI process called 12FDX last September, although it first mentioned a 12nm process back in J... » read more

Blog Review: Sept. 20


Mentor's Jeff Miller warns that MEMS accelerometers are vulnerable to takeover using specially constructed sound waves, as demonstrated in a new paper. Synopsys' Pooja Gupta and Srinivas Vijayaragavan explain some major technology updates in SAS 24G with a look at Binary primitives, Extended Binary primitives and primitive parameters. Cadence's Paul McLellan shares highlights from TSMC's ... » read more

The Race To Autonomous Cars


To say that the race for autonomous transportation has been heating up would be a gross understatement. By now all, companies that aim to be leaders, or at least want a piece of the action have already established their presence. Some in a successful way, while others not so much. This is not a race that can be won by sprinting alone. It is a team relay where partnerships have to be formed, ... » read more

Light In A Package


Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

The Week In Review: IoT


Conferences Artificial intelligence, the Internet of Things, and 5G wireless communications were the talk of this week’s Mobile World Congress Americas event at the Moscone Center in San Francisco. Interesting topics, to be sure, yet they were eclipsed by a panel discussion on Wednesday afternoon about a matter of life or death. At a program put together by 151 Advisors, one of the panel ses... » read more

What’s After 7nm?


The rollout of 10/7nm was a long time coming, and for good reason. It's hard stuff, and chipmakers have to be ready to take a giant step forward with new processes, tools, and to deal with a slew of physical effects that no longer can be handled by just guard-banding a design. The big question is what's next, when it will happen, and how much it will cost. Preparing for the next process node... » read more

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