Week In Review: Manufacturing, Test


Chipmakers Intel posted mixed results in the quarter, and also cut its capital spending. “Intel’s updated CY20 capex guidance to $14.2-$14.5 billion, from prior view of $15 billion. Around $300 million of the reduction is due to the pending sale of the NAND assets to SK Hynix. The new capital spending will be down 11% year-over-year. Intel spent $3.7 billion in C3Q20, and as of September, ... » read more

What’s Ahead For Chips & Equipment?


It’s been a topsy-turvy year in the semiconductor industry. 2020 was supposed to be a strong year. Then, the coronavirus outbreak hit. Countries implemented various measures to mitigate the outbreak, such as stay-at-home orders and store closures. Economic turmoil and job losses soon followed. Earlier in the year, the chip market looked bleak. Now, business appears to be strong. To gain... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Week In Review: Design, Low Power


Tools & IP Cadence debuted System-Level Verification IP (System VIP), a suite of tools and libraries for automating SoC testbench assembly, bus and CPU traffic generation, cache-coherency validation, and system performance bottleneck analysis. Tests created using the System VIP solution are portable across Cadence simulation, emulation and prototyping engines and can also be extended to po... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Intel announced new security features for its code-named Ice Lake CPU, according to a story in SecurityWeek. The 10nm-based Xeon Scalable will have SGX trusted execution environment and several new features for memory encryption, firmware resilience, and cryptographic performance acceleration. The new Total Memory Encryption (TME) feature in the CPU will encrypt access to memory. S... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs AMD is in talks to acquire Xilinx in a deal that could be worth more than $30 billion, according to a report from The Wall Street Journal. If the deal transpires, AMD will enter the FPGA business, putting it further in competition with Intel. No deal has been struck, though. --------------------------------------------- Multiple sources believe that China’s Huawei i... » read more

HW Security Better, But Attack Surface Is Growing


Semiconductor Engineering sat down to discuss security on chips with Vic Kulkarni, vice president and chief strategist at Ansys; Jason Oberg, CTO and co-founder of Tortuga Logic; Pamela Norton, CEO and founder of Borsetta; Ron Perez, fellow and technical lead for security architecture at Intel; and Tim Whitfield, vice president of strategy at Arm. What follows are excerpts of that conversation,... » read more

Good Vs. Bad Acquisitions


M&A activity is beginning to heat up across the semiconductor industry, fueled by high market caps, low interest rates, and a slew of startups with innovative technology and limited market reach. Some of these deals are gigantic, such as the pending acquisition of Arm by Nvidia, and the proposed purchase of Maxim Integrated by Analog Devices. Others are more modest, such as Arteris IP's ... » read more

Israel: Startup Powerhouse


Israel is at the front of pack with China and the United States when it comes to tech startups. But when it comes to large, indigenous tech giants, the country is nowhere to be seen. Virtually every major semiconductor company does business in Israel, and many have a strong presence there through centers of excellence or companies they have acquired. But after decades of innovation ranging f... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs NXP has announced the grand opening of its 150mm (6-inch) RF gallium nitride (GaN) fab in Chandler, Ariz. This is said to be the most advanced fab dedicated to 5G RF power amplifiers in the United States. NXP’s new Chandler-based GaN fab is qualified now, with initial products ramping in the market and expected to reach full capacity by the end of 2020. GaN, a III-V techn... » read more

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