Week in Review: IoT, Security, Automotive


Connectivity, 5G Rambus has revealed a PCI Express 5.0 interface on advanced 7nm finFET process node for heterogenous computing aimed at performance-intensive uses, such as AI, data center, HPC, storage and 400GbE networking. With a PHY and a digital controller core recently acquired Northwest Logic, the interface has 32 GT/s (gigatransfers per second) bandwidth per lane with 128 GB/s bandwidt... » read more

Week In Review: Manufacturing, Test


Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the share of semiconductor industry capital spending held by the top five companies was 25%, according to IC Insights. This meant that a number of companies invested and built new fabs during the... » read more

Week in Review: Iot, Security, Automotive


IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Blog Review: Nov. 6


Cadence's Paul McLellan considers why high-performance compute, high-performance networks, and security will all be vital to the next wave of devices and the importance of optimization. Synopsys' Taylor Armerding points to some best practices for assessing your supply chain to find the weak links that could lead to a security breach, from why to make it a priority to what to ask software ven... » read more

Migrating 3D Into The Mainstream


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Blog Review: Oct. 30


Cadence's Paul McLellan checks out the future of the automotive industry, the options for making the transition to autonomous driving, and how experience with electric vehicles influences perception of them. In a video, Mentor's Colin Walls digs into the challenges of testing memory in an embedded system. A Synopsys writer looks at doubling bandwidth in PCIe 5.0, the PHY logical changes a... » read more

Week In Review: Design, Low Power


ANSYS will acquire Dynardo, a provider of simulation process integration and design optimization (PIDO) technology. Dynardo's tools include algorithms for optimization, uncertainty quantification, robustness, scenario variation, sensitivity analysis, simulation workflow building and data mining. Based in Weimar, Germany, Dynardo was founded in 2001 and has been an ANSYS software partner; the ac... » read more

Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Week In Review: Manufacturing, Test


Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Week in Review: IoT, Security, Autos


Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

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