Blog Review: Sept. 18


Cadence's Paul McLellan checks out MLPerf and the challenges involved in developing a benchmark to assess machine learning training and inference performance. Synopsys' Om Prakash Thakur and Nusrat Ali take a look at the different types of NVDIMM and how it can bridge the performance gap between memory and storage solutions in servers. Mentor's Matthew Ballance points to why adoption of P... » read more

Week In Review: Design, Low Power


M&A ANSYS will acquire Livermore Software Technology Corp. (LSTC), a provider of explicit dynamics and other advanced finite element analysis technology. Based in Livermore, CA, LSTC was founded in 1987 to commercialize the DYNA3D technology developed at the Lawrence Livermore National Laboratory. DYNA3D became the company's premier product LS-DYNA, a general purpose nonlinear finite eleme... » read more

3D Power Delivery


Getting power into and around a chip is becoming a lot more difficult due to increasing power density, but 2.5D and 3D integration are pushing those problems to whole new levels. The problems may even be worse with new packaging approaches, such as chiplets, because they constrain how problems can be analyzed and solved. Add to that list issues around new fabrication technologies and an emph... » read more

Reducing Software Power


With the slowdown of Moore's Law, every decision made in the past must be re-examined to get more performance or lower power for a given function. So far, software has remained relatively unaffected, but it could be an untapped area for optimization and enable significant power reduction. The general consensus is that new applications such as artificial intelligence and machine learning, whe... » read more

Blog Review: Sept. 11


Cadence's Paul McLellan checks out the challenges of processing-in-memory and the steps involved in building a logic flow on a DRAM process. Synopsys' Taylor Armerding notes that with safety-critical software an ever-present factor in modern life, it's more necessary than ever to take the time to ensure quality and security when failures can be life-threatening. In a video, Mentor's Colin... » read more

Dell EMC Ready Solutions for HPC Digital Manufacturing – ANSYS Performance


This technical white paper describes the performance of ANSYS Fluent, Mechanical, and CFX on the Dell EMC Ready Bundle for HPC Digital Manufacturing, which was designed and configured specifically for Digital Manufacturing workloads, where Computer Aided Engineering (CAE) applications are critical for virtual product development. In addition, the architecture of the Dell EMC Ready Bundle for HP... » read more

New Technologies To Support 3D-ICs


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Blog Review: Sept. 4


Synopsys' Taylor Armerding checks out Apple's newly expanded bug bounty program, with bounty payouts are increasing to compete with malicious actors, and why even with security-oriented development the practice of bug bounties will remain needed. Mentor's Colin Walls shares a few more embedded software tips, this time on external variables, delay loops in real time systems, and meaningful pa... » read more

Week In Review: Design, Low Power


Rambus completed its acquisition of Northwest Logic, a supplier of memory, PCIe and MIPI digital controllers. The Hillsboro, OR office of Northwest Logic will remain in place, along with the entire staff. SureCore launched a new low power design service. The company's offering includes concept-to-tape-out low power mixed-signal design expertise such as design and layout capabilities, technol... » read more

On The Cusp Of 5G


Carriers and chipmakers are celebrating the rollout of the first standards-compliant commercial 5G services. "We are, officially in the era of 5G," said John Smee, vice president of engineering at Qualcomm at the recent 5G Summit at IEEE's International Microwave Symposium (IMS) in Boston. Movement is happening on the commercial end. Major U.S. carriers Verizon, AT&T and Sprint have set ... » read more

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