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Week In Review: Manufacturing, Test


On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

Why Every Design IP Needs A Complete QA Methodology


Design IP is a key contributor to innovation in the semiconductor industry today. As the complexity and scale of silicon designs increase, so does design and verification time. Design IP enables modularization and re-use of design components, so that designers can leverage already-existing components as a baseline to accelerate design schedules. Therefore, it is not surprising that the usage of... » read more

Strengthening The Global Semi Supply Chain


Rising design costs and complexity, geopolitical concerns, and unexpected supply chain glitches are driving companies across the semiconductor industry to build deeper and more effective partnerships, and to do so more often. This confluence of all these factors is creating disruptions around the globe. Compounding that, the end customer base is shifting from traditional chipmakers designing... » read more

Interactive Symmetry Checking Provides Faster, Easier Symmetry Verification For Analog And Custom IC Designs


Device symmetry ensures accurate, efficient performance of analog and custom IC designs. However, traditional physical verification for symmetry is complex and time-consuming. Calibre interactive symmetry checking runs inside the design environment to simplify and enhance IC symmetry verification. Design teams can use Calibre interactive symmetry checking to quickly and accurately analyze layou... » read more

How Memory Design Optimizes System Performance


Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

Blog Review: Sept. 21


Arm's Neil Burgess and Sangwon Ha explain why they've joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum. Synopsys' Manuel Mota examines ver... » read more

Why Geofencing Will Enable L5


What will it take for a car to be able to drive itself anywhere a human can? Ask autonomous vehicle experts this question and the answer invariably includes a discussion of geofencing. In the broadest sense, geofencing is simply a virtual boundary around a physical area. In the world of self-driving cars, it describes a crucial subset of the operational design domain — the geographic regio... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO


Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

How Mature Are Verification Methodologies?


Semiconductor Engineering sat down to discuss differences between hardware and software verification and changes and challenges facing the chip industry, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president o... » read more

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