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tag: Mentor

Targeting Redundancy In ICs
By Brian Bailey - 14 Jun, 2021 - Comments: 0

Technology developed for one purpose is often applicable to other areas, but organizational silos can get in the way of capitalizing on it until there is a clear cost advantage. Consider memory. All memories are fabricated with spare rows and columns that are swapped in when a device fails manufacturing test. "This is a common method to increase the yield of a device, based on how much memor... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Pro Design's proFPGA product family of FPGA desktop prototyping technologies. Through a prior OEM relationship, proFPGA technology is already part of the Xcelerator portfolio; Siemens noted that the acquisition will allow for fuller integration with its Veloce hardware-assisted verification system. Pro Design will continue to operate as an independen... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 11 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Xilinx introduced its Versal AI Edge series of adaptive SoCs, or adaptive compute acceleration platforms (ACAPs), that can be manage AI-ML workloads in edge applications. The chip is designed for flexible, low latency, edge applications where algorithms may need updating. The software programmable chips have an AI Engine-ML featur... » read more

Beyond The Water Cooler: 2020 Report On IC/ASIC Design And Verification Trends
By Harry Foster - 10 Jun, 2021 - Comments: 0

Verification and design engineers like to talk shop and discuss their experiences and visions. But even though engineers sharing stories around the water cooler (whatever form that takes—conferences, blogs, etc.) does provide all kinds of valuable insights, it doesn’t provide the full picture into the very large and complicated and extremely dynamic global semiconductor industry. To better ... » read more

Thermal Floorplanning For Chips
By Brian Bailey - 10 Jun, 2021 - Comments: 0

Heat management is becoming crucial to an increasing number of chips, and it's one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating thermal problems. Those designs either have to increase margins or become more intelligent about the way heat is generated, distributed, and dissi... » read more

Power, Performance — Avionics Designers Want It All
By Heidi Elliott - 10 Jun, 2021 - Comments: 0

Not long ago, the prevailing philosophy among chip designers for aviation systems could be summed up as, “I feel the need — the need for speed.” Today, aviation’s top guns have pulled back on the throttle a bit. There’s a more nuanced discussion balancing the need for performance versus power, with other factors coming into consideration such as safety, security certifications and ove... » read more

Primary, Anonymous, or What?
By Siemens EDA - 09 Jun, 2021 - Comments: 0

Top level primary I/Os remain mysterious in the verification world, specifically when you consider UPF-based low power designs. In real silicon, they are usually driven by off-chip supplies; however, verification complications are multifold for RTL and gate level simulations of them. This paper studies the “simulation-impacting” features of design top IOs and the effect of each feature on v... » read more

Blog Review: Jun 9
By Jesse Allen - 09 Jun, 2021 - Comments: 0

Arm's Partha Maji introduces a collaboration with the University of Cambridge to advance Bayesian statistics and probabilistic machine learning, which could play a vital role in safety-critical AI applications. Siemens' Thomas Dewey looks at a way to improve autonomous driving capabilities by enabling vehicles to train on past hazardous situations to provide and early warning for when they m... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Nextflow Software, a provider of advanced particle-based computational fluid dynamics (CFD) solutions. Nextflow Software will become part of the Simcenter software portfolio, providing rapid meshless CFD capabilities to accelerate the analysis of complex transient applications in the automotive, aerospace, and marine industries such as gear box lubri... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back To simplify IoT workflows, Arm announced that it is putting parts of its Common Microcontroller Software Interface Standard (CMSIS) into an open project called Open-CMSIS-Pack. The CMSIS is a vendor-independent abstraction layer for MCUs, especially Arm Cortex-M processors, that makes it possible for developers to deal with softwa... » read more

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