Blog Review: July 17


Mentor's John McMillan takes a look at the three general classes that have been established by IPC-2221B to reflect progressive increases in sophistication, functional performance requirements, and testing/inspection frequency for PCBs. Synopsys' Dinesh Siwal and Thenmozhy Kaliyamurthy point out the new features and improvements in DisplayPort 2.0, including greater speeds, better power effi... » read more

Breaking Down The Debug Process


Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. What fol... » read more

Empowering UPF Commands With Effective Elements Lists


The Unified Power Format (UPF) is intended for power management, power aware verification, and low power implementation. The more we explore the inherent features of UPF commands and options, and comprehend their interrelation, the more we become accurate, productive, and consistent in developing UPF for our intended purposes. Although the UPF is very well defined through the IEEE 1801 LRM, ... » read more

Power Is Limiting Machine Learning Deployments


The total amount of power consumed for machine learning tasks is staggering. Until a few years ago we did not have computers powerful enough to run many of the algorithms, but the repurposing of the GPU gave the industry the horsepower that it needed. The problem is that the GPU is not well suited to the task, and most of the power consumed is waste. While machine learning has provided many ... » read more

Low-Power Design Becomes Even More Complex


Throughout the SoC design flow, there has been a tremendous amount of research done to ease the pain of managing a long list of power-related issues. And while headway has been made, the addition of new application areas such as AI/ML/DL, automotive and IoT has raised as many new problems as have been solved. The challenges are particularly acute at leading-edge nodes where devices are power... » read more

Effective Elements List And Transitive Natures Of UPF Commands


Although UPF is very well defined through IEEE 1801 LRM, it is often difficult to comprehend many primitive and inherent features of individual UPF commands-options or relations between different varieties of UPF commands-options. In this paper, we provide a simplistic approach to find inherent links between UPF commands-options through their transitive nature. We also explain how these inheren... » read more

Tackling Safety And Security


Semiconductor Engineering sat down to discuss industry attitudes towards safety and security with Dave Kelf, chief marketing officer for Breker Verification; Jacob Wiltgen, solutions architect for functional safety at Mentor, a Siemens Business; David Landoll, solutions architect for OneSpin Solutions; Dennis Ciplickas, vice president of characterization solutions at PDF Solutions; Andrew Dauma... » read more

Blog Review: July 10


Synopsys' Eric Huang takes a look at how backward compatibility with USB 2.0 is provided when the IO voltages of new nodes can't support 3.3V signaling and how eUSB2 can boost the signal and provide support for external or legacy peripherals. In a video, Mentor Colin Walls explains endianness in embedded systems with a look at what it is, when it matters, and how to accommodate it in code. ... » read more

Challenges Of Logic BiST In Automotive ICs


The electronics in passenger cars continues to grow, and much of it is bound by the strict functional safety requirements formalized in the ISO 26262 standard. The ICs that drive the electronics systems in automobiles are also increasingly complex, designed to execute artificial intelligence algorithms that govern emerging self-driving capabilities. Designers are quickly adopting comprehensi... » read more

Silicon Photonics Begins To Make Inroads


Integrating photons and electrons on the same die is still a long way off, but advances in packaging and improvements in silicon photonics are making it possible to use optical communication for a variety of new applications. Utilizing light-based communication between chips, or in self-contained modules, ultimately could have a big impact on chip design. Photons moving through waveguides ar... » read more

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