tag: Mentor

Four Steps To ISO 26262 Safety Mechanism Insertion And Validation
By Ping Yeung - 02 Apr, 2020 - Comments: 0

By Ping Yeung, Jin Hou, Vinayak Desai, and Jacob Wiltgen The complexity of automotive integrated circuits (ICs) has grown exponentially with the introduction of advanced driver-assistance systems and autonomous-drive technologies. Directly correlated to this hike in complexity is the increased burden of ensuring an IC is protected from random hardware faults—functional failures that occur ... » read more

Tracking Automotive’s Rapidly Shifting Ecosystem
By Ann Steffora Mutschler - 02 Apr, 2020 - Comments: 0

The automotive ecosystem is becoming much harder to navigate as automakers, Tier 1s and IP vendors redefine their relationships based upon shifting value caused by an rapidly expanding amount of increasingly interdependent and complex electronic content. Predictions of massive change started almost a decade ago with a number of pilot programs around autonomous vehicles. But those shifts real... » read more

New Ways To Optimize Machine Learning
By Bryon Moyer - 02 Apr, 2020 - Comments: 0

As more designers employ machine learning (ML) in their systems, they’re moving from simply getting the application to work to optimizing the power and performance of their implementations. Some techniques are available today. Others will take time to percolate through the design flow and tools before they become readily available to mainstream designers. Any new technology follows a basic... » read more

Blog Review: April 1
By Jesse Allen - 01 Apr, 2020 - Comments: 0

Rambus' Steven Woo takes an in-depth look at on-chip memory for high performance AI applications and explores some of the primary differences between HBM and GDDR6. Synopsys' Taylor Armerding warns of the risks of legacy vulnerabilities, where software has problems that were never fixed then forgotten about or never discovered in the first place, and key steps for finding and addressing them... » read more

Solving the E/E Dilemma of Electric And Autonomous Vehicles
By Mentor, a Siemens Business - 01 Apr, 2020 - Comments: 0

As automotive manufacturers and suppliers develop advanced technologies to realize the trends of autonomy, connectivity, electrification, and shared mobility, they are encountering a number of dilemmas as each trend drives different aspects of vehicle development. This paper will focus on the E/E design challenges created by electric and autonomous vehicles, and describe a multi-domain architec... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 Mar, 2020 - Comments: 0

Tools & IP Synopsys debuted VIP and a UVM source code test suite for IP supporting Ethernet 800G. The VIP supports DesignWare 56G Ethernet, 112G Ethernet, and 112G USR/XSR PHYs for FinFET processes, which can be integrated for 800G implementations based on 8 lane x 100 Gb/s technology. The VIP can switch speed configurations dynamically at run time and includes a customizable set of frame ... » read more

What’s Changing, What Isn’t
By Ed Sperling - 26 Mar, 2020 - Comments: 0

The global pandemic is creating economic chaos on a global scale. The big question now is when the coronavirus is brought under control, and just how long its effects will extend beyond the current health crisis. For the semiconductor industry, which has weathered many long and deep financial swings, this one at least is finite. When the virus stops spreading, or when treatments are availabl... » read more

Why It’s So Hard To Create New Processors
By Brian Bailey - 26 Mar, 2020 - Comments: 1

The introduction, and initial success, of the RISC-V processor ISA has reignited interest in the design of custom processors, but the industry is now grappling with how to verify them. The expertise and tools that were once in the market have been consolidated into the hands of the few companies that have been shipping processor chips or IP cores over the past 20 years. Verification of a pro... » read more

EDA In The Cloud
By Michael White - 26 Mar, 2020 - Comments: 0

Interest in the use of third-party public clouds in conjunction with electronic design automation (EDA) applications has never been higher. Back in February, Ed Sperling and I did a video interview (embedded below) to discuss EDA and cloud computing. This article follows up on that interview, providing some additional insight into why and how the integrated circuit (IC) industry reached this po... » read more

Reducing IR And EM Issues With Automated Via Insertion
By Mentor, a Siemens Business - 25 Mar, 2020 - Comments: 0

IR drop and EM issues are significant performance and reliability detractors at advanced nodes. Adding vias is the most effective means of correction, but traditional custom scripts are difficult and time-consuming, and do not guarantee correct-by-construction vias. The Calibre YieldEnhancer PowerVia utility uses manufacturing requirements to perform automated insertion of DRC/LVS-clean vias. R... » read more

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