Week In Review: Manufacturing, Test


Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Week in Review: IoT, Security, Auto


Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week In Review: Design, Low Power


M&A Marvell will acquire Avera Semiconductor, the ASIC business of GlobalFoundries, for $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The agreements include transfer of Avera's revenue base, strategic design wins with infrastructure OEMs, and a new long-term wafer supply agreement between Globa... » read more

Week In Review: Manufacturing, Test


Trade More trade news: "The Trump administration is hiking duties on $200 billion worth of Chinese products to 25% from 10%," according to CNBC. The following is attributed to Gary Shapiro, president and CEO of the Consumer Technology Association (CTA), in response to President Trump’s plan to increase tariffs on $200 billion worth of Chinese imports to 25%: “The president is seeking a bet... » read more

Challenges In Making And Testing STT-MRAM


Several chipmakers are ramping up a next-generation memory type called STT-MRAM, but there are still an assortment of manufacturing and test challenges for current and future devices. STT-MRAM, or spin-transfer torque MRAM, is attractive and gaining steam because it combines the attributes of several conventional memory types in a single device. In the works for years, STT-MRAM features the ... » read more

Creating A Roadmap For Hardware Security


The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

Week In Review: Manufacturing, Test


Fab tools and test Lam Research has developed a new self-maintaining or self-cleaning chamber for its etch tools. With the technology, Lam announced a new industry benchmark has been set for productivity in etch processing using its self-maintaining equipment. Etch process modules are typically cleaned weekly or monthly. Recently, Lam and a chipmaker reached the milestone of going 365 days... » read more

Week in Review: IoT, Security, Auto


Internet of Things Wing received an Air Carrier Certification from the Federal Aviation Administration to begin making commercial deliveries with drones. The Alphabet unit is cleared to deliver packages in southwestern Virginia. Wing has had a pilot program going in the vicinity of Canberra, Australia, and was recently permitted to make commercial deliveries with unmanned aerial vehicles in th... » read more

Week In Review: Design, Low Power


A new working group has been proposed by Accellera to focus on the standardization of analog/mixed signal extensions (AMS) for the Universal Verification Methodology (UVM) standard. “Our ambition is to apply UVM for both digital and analog/mixed-signal verification,” said Martin Barnasconi, Accellera Technical Committee Chair. “The UVM-AMS PWG will assess the benefits of creating analog a... » read more

Controlling IC Manufacturing Processes For Yield


Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time. How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing ... » read more

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