Blog Review: April 1


Rambus' Steven Woo takes an in-depth look at on-chip memory for high performance AI applications and explores some of the primary differences between HBM and GDDR6. Synopsys' Taylor Armerding warns of the risks of legacy vulnerabilities, where software has problems that were never fixed then forgotten about or never discovered in the first place, and key steps for finding and addressing them... » read more

Blog Review: March 25


Rambus' Steven Woo checks out common memory systems that are used in the highest performance AI applications and points to the differences between on-chip memory, HBM, and GDDR. Mentor's Colin Walls considers whether software for embedded systems should be delivered as a binary library or source code and warns of some key potential issues when requesting source code. A Synopsys writer poi... » read more

Week In Review: Manufacturing, Test


The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Fab Equipment Poised For A Record 2021


Global fab equipment spending promises to crawl out of a gloomy 2019 and see a modest recovery this year before a sharp uptick drives record investments in 2021 in a vivid display of the decades-old cyclicality playing out in the semiconductor industry. Typically – and reliably – fab investments fall into negative territory after two years of growth, though a few periods have bucked that... » read more

Big Problems In A Little Data World


Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor industry. Titled “I’m Living in a Little Data World, but I Have a Big Problem,” Rick talked about the challenges faced by the “little data world” of process development and the potential for ... » read more

Blog Review: March 18


Arm's Divya Prasad investigates whether power rails that are buried below the BEOL metal stack and back-side power delivery can help alleviate some of the major physical design challenges facing 3nm nodes and beyond. Rambus' Steven Woo takes a look at a Roofline model for analyzing machine learning applications that illustrates how AI applications perform on Google’s tensor processing unit... » read more

Week In Review: Manufacturing, Test


Market research The coronavirus is having a major impact on the semiconductor, smartphone and related markets. For example, global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year, according to a report from SEMI. But the coronavirus (COVID-19) outbreak has eroded fab equipment spending in China and elsewhere in 2020, according to the rep... » read more

Blog Review: Mar. 11


Rambus' Steven Woo examines how the upcoming deployment of 5G will enable processing at the edge, and how the edge is getting refined further into the near edge and the far edge with a range of AI solutions across it. A Synopsys writer explains the types of Compute Express Link devices and CXL's unique verification challenges like maintaining the cache coherency between a host CPU and an acc... » read more

A Tipping Point For Women In Semiconductors


Yesterday was International Women’s Day, which for some people was a day of protest and action to raise awareness of issues that women face around the world. The day was more than just a feel-good Google doodle that blipped across our screens on Sunday: women were out in the streets getting arrested, tear gassed, and sprayed with water hoses. In some countries, the risk of openly walking with... » read more

Week In Review: Manufacturing, Test


Fab tools, materials and packaging Intel has recognized 37 companies for its annual suppliers’ awards. The list includes equipment, materials, packaging houses and other segments. These suppliers have collaborated with Intel to implement process improvements with good products and services. See who made the list here. ---------------------------------------- Lam Research has introduced... » read more

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