Blog Review: Nov. 14


Mentor's Jin Hou and Joe Hupcey III explain two fundamental characteristics of formal analysis that simplify things for the formal algorithm and provide better wall clock run time and memory usage performance. Cadence's Paul McLellan shares highlights from five presentations all discussing what's behind AI's movement to edge devices, the vast amount of investment going into the area, and whe... » read more

Week In Review: Manufacturing, Test


Trade SEMI has voiced support and encouragement for trade discussions between U.S. President Donald Trump and the People's Republic of China President Xi Jinping. The talks are planned for Dec. 1 during the G20 Summit in Argentina. SEMI expressed hope for a deal and offered principles beneficial to the microelectronics supply chain. Recent tariffs and trade tensions, on top of rumored expor... » read more

Blog Review: Nov. 7


Arm's Shidhartha Das looks into maximizing the benefits of power delivery networks and explains a non-intrusive technique using an on-chip digital storage oscilloscope that can directly sample the power-rails to probe potential runtime bugs due to power delivery weaknesses. Synopsys' Snigdha Dua argues that scrambling is one of the most important features introduced in HDMI 2.0 and takes a l... » read more

Panel Fan-out Ramps, Challenges Remain


After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

DARPA Seeks To Engage With MEMS Industry


Napa, Calif. — DARPA is looking for a few good members of the MEMS industry to offer advice and help to the agency’s Rapid Innovation for Production MEMS (RIPM) concept. Ronald Polcawich, a program manager for the Defense Advanced Research Projects Agency’s Microsystems Technology Office, presented the keynote address on the second and final day of the 2018 MEMS & Sensors Executive... » read more

Blog Review: Oct. 31


Mentor's Joe Hupcey III digs into handling memories effectively with formal through abstraction and the easiest ways to address memory-related inconclusive results. Cadence's Paul McLellan explains DARPA's CHIPS program that aims to lower semiconductor design costs through chiplet-based designs, the current status of the work, and what the next steps will be. Synopsys' Sangeeta Kulkarni c... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries and the Chengdu municipality have signed an amendment and changed the strategy of their joint fab investment in Chengdu, China. Originally, GlobalFoundries was supposed to install 180nm/130nm processes in the China-based 300mm fab. The partners have decided to bypass that technology. Intead, the fab will start with GlobalFoundries’ 22nm FD-SOI process. “Ch... » read more

Blog Review: Oct. 24


Arm's Shidhartha Das digs into Power Delivery Networks with a look at how the specific roles of different components work to provide smooth supply conditions. In a video, VLSI Research's Dan Hutcheson chats with D2S CEO Aki Fujimura about the state of the photomask market, EUV optimism, and the most interesting findings from this year's eBeam Initiative survey. Synopsys' Prasad Subudhi K.... » read more

Week In Review: Manufacturing, Test


Chipmakers Amid ongoing delays with its 10nm process, Intel has reorganized its manufacturing unit, according to a report from The Oregonian/OregonLive. Sohail Ahmed, who has jointly led the unit since 2016, will retire next month, according to the report. The industry is racing to put extreme ultraviolet (EUV) lithography into production. TSMC recently taped-out its first 7nm chip using E... » read more

Silicon Wafers: Tight Supply, High Prices


For years, the silicon wafer industry suffered from oversupply and depressed prices, causing considerable consolidation in the industry. Then, two or so years ago, the IC industry entered into a boom cycle. Silicon wafer vendors began to experience tight supply amid strong demand from IC makers. Some silicon wafer makers even raised their prices. Today, the silicon wafer market remains st... » read more

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