Systems & Design

Top Stories

System State Challenges Widen

The state of a system is fundamental for performing many analysis and debug tasks, but understanding it and its context is a growing challenge.

EDA Pushes Deeper Into AI

AI is both evolutionary and revolutionary, making it difficult to assess where and how it will be used, and what problems may crop up.

3D-ICs May Be The Least-Cost Option

Advanced packaging has evolved from expensive custom solutions to those ready for more widespread adoption.

What Will That Chip Cost?

Establishing the true cost to develop an advanced chip is complicated, but headline numbers appear to be significantly inflated.

Anatomy Of A System Simulation

Balancing the benefits of a model with the costs associated with that model is tough, but it becomes even trickier when dissimilar models are combi...

Rethinking Design, Workflow For 3D

The semiconductor ecosystem is coping with new challenges in the transition to 3D advanced packaging.

Making Connections In 3D Heterogeneous Integration

New packaging options are stacking up, but taking advantage of them isn't easy.

Navigating EDA Vendor Cloud Options

Experts weigh in on the challenges of the cost of cloud, and working with multi-vendor tools in cloud environments.

Why Using Commercial Chiplets Is So Difficult

Security, reliability, and integration issues are slowing the market for plug-and-play tiles.

Everyone’s A System Designer With Heterogeneous Integra...

Engineers are encountering more unknowns, working with different people and tools, and focusing on new types of tradeoffs.

More Top Stories »



Round Tables

Navigating EDA Vendor Cloud Options

Experts weigh in on the challenges of the cost of cloud, and working with multi-vendor tools in cloud environments.

Why Using Commercial Chiplets Is So Difficult

Security, reliability, and integration issues are slowing the market for plug-and-play tiles.

Why Chiplets Don’t Work For All Designs

Getting this wrong can increase power and cost, while reducing performance.

Preparing For Commercial Chiplets

What's missing, what changes are underway, and why chiplets are increasingly necessary.

Tradeoffs Between On-Premise And On-Cloud Design

Which companies are using the cloud and why, and where are the hidden pitfalls.

More Roundtables »



Multimedia

Improving AI Productivity With AI

How engineers can utilize AI to push more design elements further left.

What To Do About Electrostatic Discharge

Issues multiply in advanced packages and at advanced nodes.

Coding And Debugging RISC-V

Customizing designs to improve performance and reduce power.

DSP Techniques For High-Speed SerDes

What's needed in chip design to handle an explosion in data.

Memory And High-Speed Digital Design

Safeguarding signal integrity with new and faster versions of DRAM.

More Multimedia »



See All Posts in System-Level Design »

Latest Blogs

What Were They Thinking

The Good Old Days Of EDA

Working in an industry during its infancy was an amazing experience, but it h...
November 30, 2023
First By Design

Nascent Chiplet Tech Gaining Attention In Defense and Com...

Semiconductor chiplet technology promises to extend the Moore's Law benefits ...
November 30, 2023
Inside Edge AI Processing

Considerations For Accelerating On-Device Stable Diffusio...

The generative AI model that is a critical test for NPU design.
November 30, 2023
A System Perspective

Help, 3D-IC Is Stuck In A Country Song

Capturing the impact of multi-physics on 3D-IC performance and behavior is st...
November 30, 2023
Looking Past The Horizon

A Path To Increase Cell Utilization Rate And Decrease Rou...

Increasing density makes congestion a challenge for both cities and chips.
November 30, 2023
Clock Talk

Artificial Intelligence Wonderland

The use of AI in semiconductor design and its impact on startups.
November 30, 2023
NoC NoC

SoC Integration And Data Transport Architecture Requireme...

Trends shaping chip design and what might be ahead in the next year.
November 30, 2023
Intelligent System Design

Building Tomorrow’s Electronics Piece By Piece

Standardized approaches will be needed to ensure that all chiplets work seaml...
November 30, 2023
Embedded Customization

Causes Of Memory Unsafety

Memory safety vulnerabilities are a significant proportion of those reported ...
October 26, 2023
Setting The Standard

Extending The Benefits Of UVM To Include AMS: An Update O...

Bringing reusable verification components and stimuli to analog and mixed-sig...
October 4, 2022
Editor's Note

Which Processor Is Best?

Intel's support for RISC-V marks a technological and cultural shift.
March 1, 2022

Knowledge Centers
Entities, people and technologies explored


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