Systems & Design

Top Stories

Communication Is Key To Finding And Fixing Bugs In ICs

AI will be increasingly needed to make sense of huge amounts of data, allowing teams to work more effectively.

Can Models Created With AI Be Trusted?

Evaluating the true cost and benefit of AI can be difficult, especially within the semiconductor industry.

Multi-Die Design Pushes Complexity To The Max

Continued scaling using advanced packaging will require changes across the entire semiconductor ecosystem.

Dealing With AI/ML Uncertainty

How neural network-based AI systems perform under the hood is currently unknown, but the industry is finding ways to live with a black box.

Is There Any Hope For Asynchronous Design?

This approach has long held promise, but never managed to deliver. Is there a fundamental problem, or is it just bad luck?

NoCs In 3D Space

The network on chip has become essential for complex designs, but it needs to evolve to support 3D designs and enable the integration of chiplets.

What’s Missing In 2.5D EDA Tools

While it's possible to create interposer-based systems today, the tools and methodologies are incomplete, and there is a mismatch with organizations.

Interconnects Essential To Heterogeneous Integration

Chiplet communication will be impossible without interconnect protocols.

Engineers Or Their Tools: Which Is Responsible For Findin...

As chips become more complex, the tools used to test them need to get smarter.

3D-IC Intensifies Demand For Multi-Physics Simulation

New challenges are driving big changes throughout the design flow, from tools to job responsibilities.

More Top Stories »



Round Tables

Communication Is Key To Finding And Fixing Bugs In ICs

AI will be increasingly needed to make sense of huge amounts of data, allowing teams to work more effectively.

Engineers Or Their Tools: Which Is Responsible For Findin...

As chips become more complex, the tools used to test them need to get smarter.

Security Is Critical For Commercial Chiplets

Data management, trust, traceability, and provenance tracking are essential to making a chiplet marketplace work.

Chiplet IP Standards Are Just The Beginning

Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for A...

Commercial Chiplet Ecosystem May Be A Decade Away

Technology and business hurdles must be addressed before widespread adoption.

More Roundtables »



Multimedia

Challenges In RISC-V Verification

How to debug a multi-core chip and ensure it will be cache coherent and secure.

Cache Coherency In Heterogeneous Systems

Why maintaining flexibility in coherency is essential in heterogeneous designs.

Integration Challenges For RISC-V Designs

Modifying the source code allows for democratization of design, but it adds some hurdles for design teams.

Densification Of RF Designs

Design issues for 5G and 6G wireless communications.

Improving AI Productivity With AI

How engineers can utilize AI to push more design elements further left.

More Multimedia »



See All Posts in System-Level Design »

Latest Blogs

What Were They Thinking

Revitalizing DAC

It is great to see the DAC conference come back to life, but EDA companies ne...
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The 3D-IC Multiphysics Challenge Dictates A Shift-Left St...

Gleaning useful information well before all the details of an assembly are kn...
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Making Formal Normal

Verification In Crisis

How can formal verification help?
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NoC NoC

The Path Toward Future Automotive EE Architectures

The race to centralized computing.
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How To Get The Most Out Of Gate-All-Around Designs

Co-optimization of foundation IP and design flows for new transistors.
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Intelligent System Design

Exploring The Security Framework Of RISC-V Architecture I...

Controlling the access to physical memory addresses.
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First By Design

How 6G Research Will Revolutionize Mobile Experiences

AI will be used in just about every subsystem of 6G networks.
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Clock Talk

Staying Within The Margins

Why real-time values are essential for identifying future variations in volta...
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Inside Edge AI Processing

Considerations For Accelerating On-Device Stable Diffusio...

The generative AI model that is a critical test for NPU design.
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Editor's Note

Which Processor Is Best?

Intel's support for RISC-V marks a technological and cultural shift.
March 1, 2022

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This approach has long held promise, but never managed to deliver. Is there a fundamental problem, or is it just bad luck?

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Multi-Die Design Pushes Complexity To The Max

Continued scaling using advanced packaging will require changes across the entire semiconductor ecosystem.