Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
Consortiums seek ways to ensure interoperability of hardened IP as way of cutting costs, time-to-market, but it’s not going to be easy.
While CPUs continue to evolve, performance is no longer limited to a single processor type or process geometry.
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