Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 2


This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into HBM implementation challenges. Click here for part 1, for an overview on HBM, and in part 3, we will introduce details of a custom HBM implementation. Implementing a 2.5D System-in-Package (SiP) with High Bandwidth Memory (HBM) is a complex process that spans across architecture definition, designi... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1


This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

Revolutionizing High-Performance Silicon With Next-Gen Chiplets


By Shivi Arora and Sue Hung Fung As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of wireless communications set to transform our lives. Poised to merge communication and computing, 6G promises to create a hyperconnected world that blends digital and physical experiences with ultra-fast speeds and low latency as a start... » read more

PCIe Over Optical: Transforming High-Speed Data Transmission


With the rise in AI requiring new computing models and enhanced data transmission methods to cope, the necessity for innovative, high-performance, and low-latency connectivity solutions has never been more apparent. PCIe over Optical is set to play a key role in enabling the growth of AI, and here we examine some of the intricacies of PCIe over Optical to explore its implementation, challenges,... » read more