Observability Is A Missing Layer In AI-Era Chiplet Design


Key Takeaways: In chiplet-based architectures, observability must be designed as a fabric-aligned, cross-die telemetry plane so architects can correlate traffic, latency, congestion, and fault behavior across package boundaries without losing system context. AI can extract value from high-volume silicon telemetry only when the architecture provides consistent instrumentation, near-senso... » read more

Rethinking Chip Verification


Key Takeaways: AI and modern tools are easing traditional verification pain, but they're not addressing the underlying bottleneck in complex designs. Work is underway to create a golden, unambiguous spec above RTL, tracing requirements from spec to implementation to verification and checking for gaps, conflicts, and inconsistencies across levels and blocks, often with AI help. Tool c... » read more

Chip Industry Week In Review


IBM unveiled a 7Å transistor architecture that uses staggered nanosheet transistors stacked on a precisely beveled angle, almost like tiles on a roof. That allows more transistors to be crammed into a given area, boosting performance by 50% or power efficiency by up to 70%. Perhaps even more important, IBM claims a 40% improvement in SRAM scaling, which is orders of magnitude faster and lower ... » read more

I/O Design Challenges Grow In AI Data Centers And HPC Clusters


Key Takeaways: A designer’s choice of I/O connectors and interconnect protocols can be the difference between a massively profitable AI chip and a flop. I/O tradeoffs impact airflow, cooling, rack design, power coming into the rack, and other critical aspects of HPC chip design. Reliability is paramount, so standards must be followed, and I/Os need redundant pins. Other innovations... » read more

Verification Methodologies Struggle To Keep Up With AI


Key Takeaways:  The rapid development of AI has resulted in new capabilities being provided to verification teams, beyond their ability to rationally insert them into accepted methodologies.  There is a lot of uncertainty about who will benefit the most from this technology. Is AI a junior engineer replacement or an enhancer?  The biggest benefits will come when AI helps engineers... » read more

Reducing Avoidable Memory Trips In HBM Systems


Picture a highway during rush hour. When a road has limited capacity, traffic backs up quickly because only so many cars can move through at once. Adding more lanes increases capacity, but it does not always guarantee a smoother commute. If cars keep flooding onto the highway, if exits are poorly placed, or if drivers have to stay on the road for long distances, congestion can still build. More... » read more

Automate the Pain Away: HW/SW Interface Design Methodology


As System-on-Chip (SoC) designs become increasingly complex, engineering teams face growing challenges coordinating hardware and software development across multiple domains. Today's projects require more than isolated point tools — they demand connected methodologies that streamline workflows from system architecture and assembly through software enablement, validation, and implementatio... » read more

Designing Chips That Can Explain Themselves


Key Takeaways: On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed increase, observability must be architected hierarchically across local hardware response, on-die processing, and fleet-level learning. The real payoff is architectural: str... » read more

Keeping Security Algorithms Current Is Getting Harder


Key Takeaways: Keeping security algorithms current is now a lifecycle challenge that spans chip design, manufacturing, deployment, and long-term maintenance across the supply chain. To stay ahead of emerging threats — especially post-quantum risks — hardware must be built with cryptographic agility, secure roots of trust, and reliable update mechanisms from the start. The bigge... » read more

Swapping Out Chiplets: I/Os Vs. Compute


Key Takeaways: Companies can save time and money by swapping out a compute, memory, or I/O chiplet to gain technology improvements, while keeping the other dies stable. Chip architects may choose to keep their I/Os stable and swap out compute to move from a 5nm process node to 3nm to achieve performance and power improvements, or swap out memory from LPDDR5X to LPDDR6. Swapping out... » read more

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