Author's Latest Posts


System Integration With Standards-Based Automation


Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic systems-on-chip (SoCs) to increasingly complex multi-die and chiplet-based architectures. These heterogeneous systems often incorporate IP developed at different times, by different teams, or sourc... » read more

CSR Management: Life Beyond Spreadsheets


The ASIC, ASSP, and system-on-chip (SoC) design landscape has undergone significant evolution over the past two decades. For example, while early devices contained only tens of intellectual property (IP) blocks, modern high-end SoCs may integrate up to 1000 IPs, each containing millions of logic gates. Furthermore, unlike their predecessors, today’s SoCs are no longer primarily hardware; i... » read more

Streamlining Complex Semiconductor Designs With IP-XACT-Based Structured Assembly


Semiconductor design is rapidly evolving because technologies such as AI and machine learning (ML) applications push the boundaries of complexity and specialization. Modern chips require hundreds or thousands of IP blocks, leading to significant design challenges. Multi-die architectures, which distribute functional blocks across multiple dice, demand expert planning to ensure connectivity and ... » read more