tag: Rambus

Defending Against AI-Enabled Data Fusion
By Ann Mutschler - 02 Jul, 2026 - Comments: 0

Key Takeaways:  By fusing vast amounts of white-, gray-, and black-market data, attackers can build a digital twin of a person and their environment, making targeted attacks far easier.  The intersection of AI and cybersecurity is the data itself. Trustworthy fusion depends on authenticated, integrity‑checked inputs and verifiable, attributable AI outputs.   Defending a... » read more

Securing The Software-Defined Vehicle Starts With Re-Architecting Trust
By Vincent van der Leest - 02 Jul, 2026 - Comments: 0

The automotive industry is being rebuilt around software. Architectures built on dozens of distributed ECUs are giving way to centralized and zonal compute platforms. Functions that once ran on dedicated hardware now share the same SoC. Software updates are no longer occasional events tied to recalls. They happen continuously, over the air, across the vehicle’s lifetime. This is what the s... » read more

Securing the Software Defined Vehicle: How Rambus and Telechips Enable Safe, Scalable Automotive SoC
By Rambus - 01 Jul, 2026 - Comments: 0

Automotive architectures are rapidly shifting from distributed ECUs to centralized, zonal computing models designed for the software-defined vehicle (SDV). As workloads such as AI-driven ADAS, digital cockpits, and OTA updates increase system complexity, automakers are consolidating functions onto high-performance SoCs, improving efficiency but raising new challenges in isolation and security. ... » read more

I/O Design Challenges Grow In AI Data Centers And HPC Clusters
By Liz Allan - 25 Jun, 2026 - Comments: 0

Key Takeaways: A designer’s choice of I/O connectors and interconnect protocols can be the difference between a massively profitable AI chip and a flop. I/O tradeoffs impact airflow, cooling, rack design, power coming into the rack, and other critical aspects of HPC chip design. Reliability is paramount, so standards must be followed, and I/Os need redundant pins. Other innovations... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jun, 2026 - Comments: 0

Dealmaking Amkor inked a 10-year agreement with TSMC to provide advanced packaging and test services in Arizona, tying TSMC’s U.S. fab expansion to domestic OSAT capacity. Trump said in a post that Apple will partner with Intel on chip design and production in the U.S., marking a second reported win for the chipmaker this month. Intel Foundry will also reportedly manufacture 3 million... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jun, 2026 - Comments: 0

Notable deals Cadence and Intel Foundry inked a multi-year agreement to advance design technology co-optimization and create PDKs for Intel Foundry's 14A process. Nvidia and SK hynix announced a multi-year partnership to co-develop memory technology for AI infrastructure and physical AI. Teradyne unveiled an integrated test cell solution with TEL that supports known-good device scree... » read more

Clocked DDR5 Client Memory Modules Enable Scaling To 9600 MT/s For AI PCs
By Carlos Weissenberg - 11 Jun, 2026 - Comments: 0

AI PCs are driving a new class of client workloads that behave very differently from traditional productivity or multimedia applications. Agentic AI systems are expected to plan, execute, and adapt in real time, maintaining persistent context while orchestrating multiple concurrent tasks. These usage patterns place sustained pressure on the memory subsystem, requiring not only higher peak bandw... » read more

PCIe Benefits From AI, Despite Scaling Protocols
By Bryon Moyer - 10 Jun, 2026 - Comments: 0

Key takeaways: PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and even some scale-up. CXL is seeing uptake, and some even think it could participate in AI processing. PCIe has been the go-to network for most data traffic moving from a processor to devices located elsewhere, which is also what the new data... » read more

Orbital Data Centers Are Souped-Up Satellites – For Now
By Liz Allan - 04 Jun, 2026 - Comments: 0

Key Takeaways: Today’s orbital data centers are better described as compute centers in space, as they resemble satellite constellations more than terrestrial data centers. The most common power solution is sun-synchronous solar at the poles, but this requires a multi-hop data relay from power-hungry compute to standard satellite constellations in the low-orbit mesh, then to Earth. ... » read more

Keeping Security Algorithms Current Is Getting Harder
By Ann Mutschler - 04 Jun, 2026 - Comments: 0

Key Takeaways: Keeping security algorithms current is now a lifecycle challenge that spans chip design, manufacturing, deployment, and long-term maintenance across the supply chain. To stay ahead of emerging threats — especially post-quantum risks — hardware must be built with cryptographic agility, secure roots of trust, and reliable update mechanisms from the start. The bigge... » read more

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