tag: ARM

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

On-Device Speaker Identification For Digital Television (DTV)
By Marcus Corbin - 18 Jul, 2024 - Comments: 0

In recent years, the way we interact with our TVs has changed. Multiple button presses to navigate an on-screen keyboard have been replaced with direct interaction through our voices. While this has resulted in significant improvements to the Digital Television (DTV) user experience, more can be done to provide immersive and engaging experiences. Imagine you say, “recommend me a film” or... » read more

Evolving Edge Computing
By Arm - 17 Jul, 2024 - Comments: 0

Edge computing is a term that has been in use for a long time. Throughout the industry, there are many references to edge and many pre-conceptions about what that might mean. The term ‘edge’ is typically used for devices that exist on the edge of a network and can cover a plethora of use cases, ranging from the router in your house, a smart video camera surveying a parking lot, to a control... » read more

Blog Review: July 17
By Jesse Allen - 17 Jul, 2024 - Comments: 0

Cadence's Xin Mu explains the PCIe ECN Unordered IO (UIO) feature in the PCIe 6.1 specification, which defines a new wire semantic and related capabilities to enable multiple-path fabric support and helps avoid unnecessary traffic for better bandwidth and latency. Synopsys' Dana Neustadter, Gary Ruggles, and Richard Solomon highlight the latest updates in the CXL 3.1 standard, including new ... » read more

Intel Vs. Samsung Vs. TSMC
By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Blog Review: July 10
By Jesse Allen - 10 Jul, 2024 - Comments: 0

Cadence's Paul Graykowski suggests using real number modeling to streamline digital mixed-signal verification using logic simulators and hardware emulators. Siemens' John McMillan and Microsoft's Amit Kumar introduce the basics of 3D-IC, describe the flow and data management challenges, look at the evolution of TSMC 3DBlox 1.0 and 2.0, and detail a physical verification and reliability analy... » read more

Chip Industry Week In Review
By The SE Staff - 28 Jun, 2024 - Comments: 0

The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

Blog Review: June 26
By Jesse Allen - 26 Jun, 2024 - Comments: 0

Cadence's Neelabh Singh examines the Gen4 link recovery mechanism in USB4 Version 2.0, an autonomous process that is initiated by a router when it encounters uncorrectable error events, and identified verification challenges. Synopsys' Gary Ruggles and Priyank Shukla highlight improvements to PCIe 7.0 that will enable secure data transfers and boost bandwidth for the next generation of AI an... » read more

Moving Software-Defined Vehicles Forward
By Ann Mutschler - 26 Jun, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Blog Review: June 19
By Jesse Allen - 19 Jun, 2024 - Comments: 0

Siemens' John McMillan and Todd Burkholder suggest using an automatic formal-based approach to verifying chiplet package connections early in the design process. Cadence's Veena Parthan explores the intricacies of wind tunnel testing in automotive design and how the collaborative relationship between computational fluid dynamics (CFD) and wind tunnels has resulted in accelerated and more nua... » read more

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