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Home > > Videos










AI/ML/DL

  • Problems In Testing AI Chips

    Problems In Testing AI Chips

  • Conversing With Your Dishwasher

    Conversing With Your Dishwasher

  • The Evolution of HBM

    The Evolution of HBM

  • MCU Changes At The Edge

    MCU Changes At The Edge

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Electrostatic effects

  • What To Do About Electrostatic Discharge In Chips

    What To Do About Electrostatic Discharge In Chips

  • Ins And Outs Of In-Circuit Monitoring

    Ins And Outs Of In-Circuit Monitoring

  • Electromagnetic Challenges In High-Speed Designs

    Electromagnetic Challenges In High-Speed Designs

  • Multi-Physics At 5/3nm

    Multi-Physics At 5/3nm

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Communication

  • What's Changing In SerDes

    What’s Changing In SerDes

  • Optimizing Data Movement In SoCs And Advanced Packages

    Optimizing Data Movement In SoCs And Advanced Packages

  • Cracking The Memory Wall

    Cracking The Memory Wall

  • PCIe Over Optics

    PCIe Over Optics

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Memory

  • Cracking The Memory Wall

    Cracking The Memory Wall

  • The Road To Super Chips

    The Road To Super Chips

  • The Evolution of HBM

    The Evolution of HBM

  • Cache Coherency In Heterogeneous Systems

    Cache Coherency In Heterogeneous Systems

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Architectures

  • The Road To Super Chips

    The Road To Super Chips

  • Scaling Performance In AI Systems

    Scaling Performance In AI Systems

  • Globally Asynchronous, Locally Synchronous Clocks

    Globally Asynchronous, Locally Synchronous Clocks

  • Data Routing In Heterogeneous Chip Designs

    Data Routing In Heterogeneous Chip Designs

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Packaging

  • GDDR6 - HBM2 Tradeoffs

    GDDR6 – HBM2 Tradeoffs

  • Multi Die Integration

    Multi Die Integration

  • CXL Vs. CCIX

    CXL Vs. CCIX

  • The Case For Chiplets

    The Case For Chiplets

  • Testing 2.5D And 3D-ICs

    Testing 2.5D And 3D-ICs

  • The Next Big Chip Companies (2018)

    The Next Big Chip Companies (2018)

  • System In Package (2017)

    System In Package (2017)

  • Thermal Challenges In Advanced Packaging

    Thermal Challenges In Advanced Packaging

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Manufacturing & Test

  • Problems In Testing AI Chips

    Problems In Testing AI Chips

  • What's Changing In Outlier Detection

    What’s Changing In Outlier Detection

  • Using AI In Semiconductor Inspection

    Using AI In Semiconductor Inspection

  • Speeding Up Acoustic Wafer Inspection

    Speeding Up Acoustic Wafer Inspection

  • Real-Time Safety Monitoring

    Real-Time Safety Monitoring

  • Making Adaptive Test Work Better

    Making Adaptive Test Work Better

  • Electromigration And IR Drop At Advanced Nodes

    Electromigration And IR Drop At Advanced Nodes

  • Overlay Optimization In Advanced IC Substrates

    Overlay Optimization In Advanced IC Substrates

  • Secure Movement Of Data In Test

    Secure Movement Of Data In Test

  • Cost And Quality Of Chiplets

    Cost And Quality Of Chiplets

  • Yield Tracking In RDL

    Yield Tracking In RDL

  • Reducing Power In Data Centers

    Reducing Power In Data Centers

  • Using Deep Data For Improved Reliability Testing

    Using Deep Data For Improved Reliability Testing

  • Total Overlay With Multiple RDLs

    Total Overlay With Multiple RDLs

  • Challenges Of Testing Advanced Packages

    Challenges Of Testing Advanced Packages

  • Challenges In Ramping New Manufacturing Processes

    Challenges In Ramping New Manufacturing Processes

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Power & Performance

  • Speeding Up Die-To-Die Interconnectivity

    Speeding Up Die-To-Die Interconnectivity

  • What's Changing In SerDes

    What’s Changing In SerDes

  • Changes In Motor Control

    Changes In Motor Control

  • PCIe Over Optics

    PCIe Over Optics

  • The Road To Super Chips

    The Road To Super Chips

  • Next-Gen High-Speed Communication In Data Centers

    Next-Gen High-Speed Communication In Data Centers

  • Real-World Applications Of Computational Fluid Dynamics

    Real-World Applications Of Computational Fluid Dynamics

  • Making Electronics More Efficient

    Making Electronics More Efficient

  • MCU Changes At The Edge

    MCU Changes At The Edge

  • Challenges With Chiplets And Power Delivery

    Challenges With Chiplets And Power Delivery

  • Rethinking Chip Economics

    Rethinking Chip Economics

  • New Issues In Power Semiconductors

    New Issues In Power Semiconductors

  • Reducing Power In Data Centers

    Reducing Power In Data Centers

  • Very Short Reach SerDes In The Data Center

    Very Short Reach SerDes In The Data Center

  • Issues In Calculating Glitch Power

    Issues In Calculating Glitch Power

  • Improving Image Resolution At The Edge

    Improving Image Resolution At The Edge

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Design & Verification

  • Optimizing Data Movement In SoCs And Advanced Packages

    Optimizing Data Movement In SoCs And Advanced Packages

  • What's Changing In Outlier Detection

    What’s Changing In Outlier Detection

  • Scenario Coverage In Formal Verification

    Scenario Coverage In Formal Verification

  • Livelocks And Deadlocks In NoCs

    Livelocks And Deadlocks In NoCs

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Automotive

  • Changes In Motor Control

    Changes In Motor Control

  • Real-Time Safety Monitoring

    Real-Time Safety Monitoring

  • Software-Defined Vehicles

    Software-Defined Vehicles

  • Adapting To Evolving IC Requirements

    Adapting To Evolving IC Requirements

  • Sensor Fusion Challenges In Automotive

    Sensor Fusion Challenges In Automotive

  • Changes And Challenges In Auto MCUs

    Changes And Challenges In Auto MCUs

  • LPDDR Flash In Automotive

    LPDDR Flash In Automotive

  • End-To-End Traceability

    End-To-End Traceability

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Security

  • Conversing With Your Dishwasher

    Conversing With Your Dishwasher

  • Using Formal For RISC-V Security

    Using Formal For RISC-V Security

  • Why Connectivity Is Changing Microcontrollers

    Why Connectivity Is Changing Microcontrollers

  • Adapting To Evolving IC Requirements

    Adapting To Evolving IC Requirements

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