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Low Power-High Performance

Top Stories

Interconnects In A Domain-Specific World

When and where tradeoffs between efficiency and flexibility make sense.

Energy Harvesting Shows New Signs of Life

Focus is shifting to helping batteries rather than replacing them.

More Data Drives Focus On IC Energy Efficiency

Decisions that affect how, when, and where data gets processed.

Designing 2.5D Systems

Connecting dies using an interposer requires new and modified processes, as well as organizational changes.

Domain-Specific Memory

Rethinking fundamental approaches to memory could have a huge impact on performance.

Tradeoffs To Improve Performance, Lower Power

Customized designs are becoming the norm, but making them work isn't so simple.

MRAM Evolves In Multiple Directions

But one size does not fit all, and fine-tuning is required.

FeFETs Bring Promise And Challenges

New technology could have an impact on NVM, in-memory processing, and neuromorphic computing.

Design For Reliability

How long a chip is supposed to function raises questions design teams need to think about, including how much they trust aging models.

Usage Models Driving Data Center Architecture Changes

The way the world is accessing data is changing. The data center is evolving to adapt.

More Top Stories »



Round Tables

Performance and Power Tradeoffs At 7/5nm

Experts at the Table: Security, reliability, and margin are all in play at leading-edge nodes and in advanced packages.

Custom Designs, Custom Problems

Experts at the Table: Power and performance issues at the most advanced nodes.

Power And Performance Optimization At 7/5/3nm

Experts at the Table: What happens when AI chips max out at reticle size?

Addressing Pain Points In Chip Design

Partitioning, debug and first-pass working silicon lead the list of problems that need to be solved.

Why DRAM Won’t Go Away

New materials, new architectures and higher density have limited what can be done with DRAM, but it's still king (Experts At The Table Part 3)

More Roundtables »



Multimedia

Data Overload In The Data Center

Which architectures and interfaces work best for different applications.

112G SerDes Reliability

How to ensure consistent performance in the real world.

Ins And Outs Of In-Circuit Monitoring

Techniques to predict failures and improve reliability.

Visualizing Differences In Analog Design

Why analog engineers require visuals, why digital engineers do not.

High-Performance Memory For AI And HPC

Processing more data much more quickly.

More Multimedia »



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Latest Blogs

Power Source

Faster Than Moore’s Law: Exponential Innovation In ...

Advances in solver technology enable simulation of full RFICs with a high lev...
April 13, 2021
Best Of Both: LP & HP

Verification Effectiveness In The Face Of FPGA Complexity...

What's causing non-trivial bug escapes in FPGA projects?
April 8, 2021
At The Core

3D Stacking For Performance And Efficiency

Testing the feasibility and readiness of high-density, face-to-face, wafer-bo...
IP And LP In SoCs

Meeting Fundamental Interface Requirements For Camera And...

MIPI isn't just for mobile, with new capabilities for automotive and embedded...
Spotlight On Reliability

Improving Industrial Processes

Making factories run faster and better.
A Bit About Memory

PCI Express 5.0 Takes Center Stage For Data Centers

Upcoming server platforms will take performance to a new level thanks to incr...
Everything Low Power

National Security And Artificial Intelligence

A new report urges the U.S. government to invest in both chip manufacturing a...
Linking Real And Digital Worlds

SiC MOSFETs In The Landscape Of Modern Power Devices

Comparing silicon carbide MOSFETs to IGBTs and superjunction devices.
Editor's Note

The Next Phase Of Computing

Apple's new chip is just the tip of a technological revolution.
November 16, 2020

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

The Future Of Transistors And IC Architectures

The more compute power, the better. But what’s the best way to get there?

EUV Pellicles Finally Ready

Yield rises with mask protection; multiple sources will likely reduce costs.

What Goes Wrong In Advanced Packages

More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.

Chasing After Carbon Nanotube FETs

CNTs promise big performance improvements, but achieving consistency and replacing incumbent technologies will be difficult.

Waiting For Chiplet Standards

An ecosystem is required to make chiplets a viable strategy for long-term success, and ecosystems are built around standards. Those standards are beginning to emerge today.