Low Power-High Performance

Top Stories

Designing 5G Chips

The next-gen wireless technology is riddled with problems, but that hasn't slowed the pace of development.

What Happened To UPF?

Did the power intent standard miss the mark, or is it quietly being adopted? It's hard to tell.

Processing Moves To The Edge

Definitions vary by market and by vendor, but an explosion of data requires more processing to be done locally.

High-Performance Memory Challenges

Capacity, speed, power and cost become critical factors in memory for AI/ML applications.

Mesh Networking Grows For ICs

Approach is yet another way to scale SoCs and systems, but it also adds new level of complexity.

How To Choose The Right Memory

Different types and approaches can have a big impact on cost, power, bandwidth and latency.

Why All Nodes Won’t Work

Cost of porting tools and IP will limit choices at partial nodes and create confusion at others.

IP And Power

How can power be optimized across an entire chip when most of a chip's content comes from third-party IP?

New Issues In Advanced Packaging

The race is on to simulate thermal and electromagnetic effects.

Wireless Charging Creeps Forward

Electric cars, mobile devices and industrial applications are focusing renewed attention on this technology.

More Top Stories »

Round Tables

Power Modeling And Analysis

Experts at the Table, part 3: Juggling accuracy and fidelity while making the problem solvable with finite compute resources and exciting developme...

Power Modeling and Analysis

Experts at the Table, part 2: What does a power model look like and how do you ensure software utilizes power control properly?

Power Modeling And Analysis

Experts at the Table, part 1: Are power models created early enough to be useful, and is that the best approach?

IP Challenges Ahead

Part 2: For the IP industry to remain healthy it has to constantly innovate, but it's getting harder.

Optimization Challenges For 10nm And 7nm

Experts at the Table, Part 3: Modeling accuracy, skin effects and new packaging techniques take center stage.

More Roundtables »


Tech Talk: Analog Simplified

Why it's so critical to speed up analog design across a broad swath of markets, and how to get there.

Tech Talk: Electrical Overstress

How to plan for electrical overstress and aging at advanced nodes and in safety-critical designs.

Tech Talk: 7/5/3nm Signoff

How to make sure that advanced node designs will work as planned.

Tech Talk: Applying Machine Learning

How to use AI, deep learning and machine learning across a variety of applications.

Tech Talk: 7nm Process Variation

A look at the issues caused by process variation and why it's difficult to find them.

More Multimedia »

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Latest Blogs

Electromagnetic Crosstalk

IP Electromagnetic Crosstalk Requires Contextual Signoff

A look at the issues that crop up when re-using IP and how to avoid them.
April 16, 2018
Editor's Note

Architecture, Materials And Software

Why developments in all three areas will change the power/performance equatio...
April 12, 2018
Spotlight On Reliability

Aging Models: The Basis For Predicting Circuit Reliability

Identifying the mechanisms that trigger future chip reliability issues, plus ...
Best Of Both: LP & HP

Power-Aware Intent And Structural Verification Of Low-Pow...

Part 2: Key features of the PA static verification library, plus best static ...
A Bit About Memory

Navigating The Foggy Edge Of Computing

It's not just cloud and edge anymore as a new layer of distributed computing ...
At The Core

AI Signals A New Change Of Perspective

Major transitions in technology are driven by simple changes in perspective, ...
Let's Talk PVT Monitoring

Supply Monitoring On 28nm & FinFET: The Challenges P...

Analysis of power consumption and IR drop should happen as part of the design...
IP And LP In SoCs

HDMI 2.1 For A More Immersive Viewing Experience

From uncompressed 8K to Dynamic HDR, the latest specification presents a leap...
Everything Low Power

Scaling Up Vision And AI DSP Performance

To keep up with growing vision processing requirements, new solutions are nee...
Power Source

Multiphysics Reliability Signoff For Next-Gen Auto Electr...

How to get from where we are today to fully autonomous vehicles.
March 12, 2018
Power Awareness

Heterogeneous Hubbub

The combination of heterogenous architectures and RISC-V is encouraging new t...
March 8, 2018

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

What Happened To Nanoimprint Litho?

Next-gen lithography technology resurfaces for a variety of tasks.

Get Ready For Integrated Silicon Photonics

This more than Moore technology is still ramping up, and problems need to be solved, but it could lead to some fundamental changes.

Embedded Die Packaging Emerges

Why this technology approach is suddenly getting attention, and what hurdles still remain.

New Shifts In Automotive Design

How electric vehicles, autonomous driving and car sharing are impacting chip design.

Tech Tackles Health Care

Academia, startups and technology giants are addressing health care through collaboration, creativity, and tremendous compute power.