Low Power-High Performance

Top Stories

New Power Concerns At 10/7nm

Dynamic, thermal, packaging and electromagnetic effects grow, and so do the interactions between all of them.

Data Centers Turn To New Memories

DDR5, NVDIMMs, SGRAM, 3D XPoint add more options, but solutions may be a mix and much more complex.

Noise Abatement

Will noise compromise your next design? The only way to answer that is to understand which aspects of noise are getting worse and the availability ...

Power Modeling And Analysis

Experts at the Table, part 3: Juggling accuracy and fidelity while making the problem solvable with finite compute resources and exciting developme...

Managing Peak Power

Slimmer margins and more data create big challenges for 5G mobile devices, infrastructure and within data centers.

Frenzy At 10/7nm

Focus is on cutting costs across the board, and it turns out there is still quite a bit to cut.

Multi-Physics Combats Commoditization

In a world of billion-gate designs, it is increasingly difficult to create a differentiated product without incorporating multi-physics elements.

How Reliable Are FinFETs?

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Using CNNs To Speed Up Systems

Just relying on faster processor clock speeds isn't sufficient for vision processing, and the idea is spreading to other markets.

Is Design Innovation Slowing?

The answer appears to be a resounding no, but innovation isn't necessarily happening in the same places as in the past.

More Top Stories »

Round Tables

Power Modeling And Analysis

Experts at the Table, part 3: Juggling accuracy and fidelity while making the problem solvable with finite compute resources and exciting developme...

Power Modeling and Analysis

Experts at the Table, part 2: What does a power model look like and how do you ensure software utilizes power control properly?

Power Modeling And Analysis

Experts at the Table, part 1: Are power models created early enough to be useful, and is that the best approach?

IP Challenges Ahead

Part 2: For the IP industry to remain healthy it has to constantly innovate, but it's getting harder.

Optimization Challenges For 10nm And 7nm

Experts at the Table, Part 3: Modeling accuracy, skin effects and new packaging techniques take center stage.

More Roundtables »


Tech Talk: 7nm Thermal Effects

The impact of heat on reliability at advanced nodes and in automotive electronics.

Tech Talk: ADAS

What will change in automotive design on the road to autonomous vehicles.

Tech Talk: 7nm Power

Dealing with thermal effects, electromigration and other issues at the most advanced nodes.

Tech Talk: Neural Networks

How to design and implement convolution neural networks, and what to watch out for.

Tech Talk: Power Signoff

A look at the impact of margin in advanced designs and how to ensure there is sufficient coverage.

More Multimedia »

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Latest Blogs

Power Source

Improving Automotive Reliability

Signoff requirements for next-gen automotive electronics....
Editor's Note

New Materials For Computing

Allowing high-performance devices to operate in extreme temperatures could have ...
Power Awareness

The Evolving Data Center

The growth of public clouds will open many new opportunities for the semiconduct...
Best Of Both: LP & HP

Body Bias: What It Is, And Why You Should Care

Tuning a circuit's behavior to meet both power and performance specifications....
Electromagnetic Crosstalk

Crosstalk Analysis At 7nm

Faster speeds and smaller features are increasing the noise volume....
Everything Low Power

High Performance, Low Power, And Test: DFT's Impact On System PPA And Safety

As test grows in importance, earlier integration is key....
A Bit About Memory

Industry Heavyweights Eye High-Speed DDR4 Server DIMM Chipsets

Memory buffer chips continue to evolve as prices drop and shipments ramp up....
IP And LP In SoCs

Securing High-Value Embedded Targets

Embedded devices are becoming lucrative targets for attackers....
At The Core

AI Technology Is Changing Voice Recognition

What is an embedded glue layer and why does it matter? ...
On-Chip Power Integrity

10nm And 7nm Routability - How Is Your CAD Flow Doing?

Power integrity optimization can no longer be a reactive step in the backend pro...

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

What Happened To ReRAM?

After years of delays, this next-gen memory is finally gaining traction.

Looming Issues And Tradeoffs For EUV

New lithography tools will be required at 5nm, but pellicles, resists and uptime are still problematic.

Unsolved Litho Issues At 7nm

Computational challenges on the rise with EUV. Scanners are no longer interchangeable.

What’s Next for the IoT?

Industrial IoT now dominates the market, but confusion is still rampant in all sectors.

IoT Cyber-Security: A Missing Piece Of The Smart City Puzzle

How to protect devices in a smart city from a wide range of cyber threats.