Low Power-High Performance

Top Stories

Moving Data And Computing Closer Together

This is far from simple, but the power/performance and latency benefits are potentially huge.

Designing For Extreme Low Power

Power is becoming a differentiator in many designs, and for IoT and edge devices it may be the most important competitive differentiation.

Power Impact At The Physical Layer Causes Downstream Effects

PHYs have a growing impact on performance and power in both planar and multi-die designs.

What’s After PAM-4?

Second of two parts: Parallel vs. serial options

High-Speed Signaling Drill-Down

First of two parts: Different schemes emerge for moving signals down channels more quickly.

Aging Problems At 5nm And Below

Semiconductor aging has moved from being a foundry issue to a user problem. As we get to 5nm and below, vectorless methodologies become too inaccur...

ESD Requirements Are Changing

Some are getting easier, others are getting tougher. Here's why.

New Approaches For Dealing With Thermal Problems

Keeping chips operating within acceptable limits is becoming more difficult and expensive.

Startup Funding: May 2020

Interesting startups to watch: 18 brought in $446M this month, with chips getting some big funding.

Design For Narrowband IoT

The challenge of creating chips for ultra-low-power applications with long lifetimes and always-on circuitry.

More Top Stories »



Round Tables

Addressing Pain Points In Chip Design

Partitioning, debug and first-pass working silicon lead the list of problems that need to be solved.

Why DRAM Won’t Go Away

New materials, new architectures and higher density have limited what can be done with DRAM, but it's still king (Experts At The Table Part 3)

DRAM Tradeoffs: Speed Vs. Energy

Experts at the Table: Which type of DRAM is best for different applications, and why performance and power can vary so much.

HBM2 Vs. GDDR6: Tradeoffs In DRAM

Experts at the Table, part 1: Choices vary depending upon application, cost and the need for capacity and bandwidth, but the number of options is c...

Planning For 5G And The Edge

Experts at the Table, part 2: Understanding 5G's benefits, limitations and design challenges.

More Roundtables »



Multimedia

Visualizing Differences In Analog Design

Why analog engineers require visuals, why digital engineers do not.

High-Performance Memory For AI And HPC

Processing more data much more quickly.

Reliability In Automotive Chips

Understanding the mission profile and how that changes over time.

Where Timing And Voltage Intersect

Factors that limit whether a design can perform to spec.

Thermal Guardbanding

How more accurate measurements can impact efficiency and performance.

More Multimedia »



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Latest Blogs

A Bit About Memory

An Expanding Application Space For GDDR6 Memory

The memory developed for high-end graphics cards isn't just for gaming anymore.
July 9, 2020
The Disruptive Edge

Different Roles, Different Tools

On a big chip, tools to support communication are a critical factor in success.
Everything Low Power

Enabling Cost-Effective, High-Performance Die-to-Die Conn...

When it comes to die-to-die PHY interfaces, the best solution is highly depen...
Best Of Both: LP & HP

Easier Low Power ICs With Reference Flows

Adding simplicity, predictability, and flexibility to the physical implementa...
At The Core

Building Fugaku, The World’s Fastest Supercomputer

The technology and collaboration between the new Arm-based supercomputer at R...
Let's Talk PVT Monitoring

‘Speak No Evil’ And SoC Problems

Getting at the truth of an SoC's state calls for an impartial source of infor...
Power Source

Simulation Of Semiconductor Edge-Emitting Lasers

A flow to design and optimize gain elements and lasers on indium phosphide an...
Editor's Note

3 Challenges In Edge Designs

The rollout of new devices will require both high performance and low power, ...
June 15, 2020
Spotlight On Reliability

Trustworthy Electronics

Reliability of electronics is critical, and standardization will be essential...
June 11, 2020
IP And LP In SoCs

Essential DDR5 Features Designers Must Know

To support better performance, DDR5 offers new reliability, availability, and...

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

China Speeds Up Advanced Chip Development

Efforts underway to develop 7nm, DRAM, 3D NAND, and EUV domestically as trade war escalates.

The Next Advanced Packages

New approaches aim for better performance, more flexibility — and for some, lower cost.

ML Opening New Doors For FPGAs

Programmability shifts some of the burden from hardware engineers to software developers for ML applications.

Interconnect Challenges Grow, Tools Lag

More data, smaller devices are hitting the limits of current technology. The fix may be expensive.

Improving Reliability For GaN And SiC

Why these chips are gaining ground, and what still needs to be addressed.