Low Power-High Performance

Top Stories

Agentic AI Is Changing Data Center Architectures

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce lat...

Can AI Create Missing Models?

It depends on what those models are used, which also can have a big impact on the cost.

PCIe Benefits From AI, Despite Scaling Protocols

CXL is also gaining traction in AI processing, while MIPI and others are growing at the edge.

Chiplets Need A New Workflow

Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early an...

Flash Getting Stacked High-Bandwidth Version

Inspired by HBM, HBF could improve AI efficiency in 3D flash memory.

Gates Add Functionality, But Wires Create Problems

Wires are treated as a lesser concern, but their neglect is becoming critical at advanced nodes.

Can Edge AI Keep Up?

As models evolve faster than silicon cycles, experts weigh how much adaptability architects can afford without sacrificing power, area, or efficiency.

DRAM’s Whac‑A‑Mole Security Crisis

New refresh commands chase Rowhammer and Rowpress, but a permanent fix remains years away.

A New Era For Co-Processing

Processor architectures are evolving faster than ever, but they still lag the pace of AI development. Chip architects must predict what will be req...

Fast Isn’t Fast Enough: Redefining Metrics for Edge AI

Why latency guarantees, memory movement, power budgets, and rapid model deployment now matter more than raw TOPS.

More Top Stories »



Round Tables

Can Edge AI Keep Up?

As models evolve faster than silicon cycles, experts weigh how much adaptability architects can afford without sacrificing power, area, or efficiency.

Fast Isn’t Fast Enough: Redefining Metrics for Edge AI

Why latency guarantees, memory movement, power budgets, and rapid model deployment now matter more than raw TOPS.

Balancing Training, Quantization, And Hardware Integratio...

Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures.

Addressing Critical Tradeoffs In NPU Design

Flexibility, future-proofing, and performance considerations for neural processing units.

How And Why To Optimize NPUs

PPA constraints need to be paired with real workloads, but they also need to be flexible to account for future changes.

More Roundtables »



Multimedia

New USB Standards: Benefits And Incompatibilities

A roadmap for integrating different versions of the USB and eUSB.

1 Megawatt Racks In Data Centers

A look inside the next-generation AI server rack.

New CPU Memory Module

Benefits and questions surrounding a next-gen low-power standard for high-performance compute.

Why More CPUs Are Needed For Agentic AI

General-purpose processing demands will multiply once machines are talking to machines.

State Of The Market For Edge Silicon

What makes one AI chip better than another?

More Multimedia »



See All Posts in Low Power-High Performance »

Latest Blogs

IP And LP In SoCs

Cloud HPC For AI: Addressing Latency, Cost, And Scale At ...

Low-latency fabrics, topology-aware scheduling, and tiered memory bring compu...
June 22, 2026
Best Of Both: LP & HP

Mastering 3D-IC Verification Complexity

Multiphysics analysis for advanced packaging.
June 11, 2026
A Bit About Memory

Clocked DDR5 Client Memory Modules Enable Scaling To 9600...

Reliable performance at higher data rates requires tight coordination between...
June 11, 2026
Inside Edge AI Processing

How To Start Building Edge-Native AI

Packet-based architecture enables out-of-order execution to optimize hardware...
June 11, 2026
Co-Packaged Optics Insights

Building A Production-Ready Optically Connected Rack For ...

Delivering the bandwidth density and efficiency needed to scale AI compute cl...
June 11, 2026
Everything Low Power

DDR5 MRDIMM: A Transformational Evolution For DDR5 DIMM

A new architecture enables higher data rates and densities while remaining pi...
June 11, 2026
At The Core

Beyond The Demo: Deploying And Evaluating Open-Source AI ...

Turn model experimentation into concrete observation of edge AI workloads acr...
June 11, 2026
Embedded ML Design

Vision-Language-Action Models Arrive

An emerging AI architecture for embedded autonomy challenges edge efficiency.
May 14, 2026
MIPI And Beyond

Exploring The Latest Innovations In MIPI D-PHY And MIPI C...

Enhanced performance and flexibility for the next generation of high-speed ...
January 15, 2026

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Chip Industry Week In Review

Onsemi to buy Synaptics; IBM's 7Å chip w/40% more SRAM area; 1nm MoS2 nanotubes; AI pressure points; memory updates; $250M CHIPS Act award; trade secret theft; new advanced packaging site; MEMS capacity; humanoids; earnings.

Executive Outlook: Agentic AI’s Impact On Chip Design

Can engineers trust AI to get everything right in semiconductor design and verification?

Chip Industry Week In Review

Apple-Intel is on, says Trump; Amkor's big win; Intel 18A-P; Amazon to sell its AI chips; Rambus' automotive RoT; Brewer's buy; VLSI Symposium tech; CHIPS Act funding; MIT sensor; RISC-V CPU fuzzing.

Agentic AI Is Changing Data Center Architectures

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.

I/O Design Challenges Grow In AI Data Centers And HPC Clusters

Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnect protocols, requiring design tradeoffs and extra reliability measures.