Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.
Chiplet Interconnects Add Power And Signal Integrity Issues
More choices, interactions, and tiny dimensions create huge headaches.
Where Is The Software For Shift Left?
Shift left requires abstractions on which early analysis can be performed. For architectural analysis, abstractions are required for both hardware ...
Aging, Complexity, And AI In Analog Design
Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over their lifetimes.
Managing The Huge Power Demands Of AI Everywhere
More efficient hardware, better planning, and better utilization of available power can help significantly.
Shift Left Is The Tip Of The Iceberg
A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.
New AI Data Types Emerge
Several PPA considerations mean no single type of data is ideal for all AI models.
Big Changes Ahead For Analog Design
In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, but commercial EDA tools add their own set of challenges.
How Big A Deal Is Aging?
Aging must be understood, analyzed, and mastered. Until then, additional margins are the only way out.
Unbundling Analog From Digital Where It Makes Sense
The shift toward heterogeneous integration and advanced packaging have changed the dynamics of mixed-signal design — and created some new issues.
More Top Stories »
Aging, Complexity, And AI In Analog Design
Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over their lifetimes.
Big Changes Ahead For Analog Design
In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, but commercial EDA tools add their own set of challenges.
Unbundling Analog From Digital Where It Makes Sense
The shift toward heterogeneous integration and advanced packaging have changed the dynamics of mixed-signal design — and created some new issues.
Striking A Balance On Efficiency, Performance, And Cost
More efficient designs can save a lot of power, but in the past those savings have been co-opted for higher performance.
Where Power Savings Really Count
How chiplets and advanced packaging will affect power efficiency, and where design teams can have the biggest impact on energy consumption.
More Roundtables »
Next-Gen High-Speed Communication In Data Centers
New approaches to moving more data faster and more efficiently.
Real-World Applications Of Computational Fluid Dynamics
How faster processing is revolutionizing different industries.
Making Electronics More Efficient
Challenges and future directions for disaggregating SoCs.
Challenges With Chiplets And Power Delivery
Benefits and challenges in heterogeneous integration.
New Issues In Power Semiconductors
Challenges increase with higher voltage and heterogeneous integration in advanced packages.
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