Author's Latest Posts


How to Design, Optimize and Validate Safe Laser Headlamps Through Virtual Experimentation


Today, car manufacturers and their suppliers are facing a real challenge: designing attractive laser headlamps that will illuminate the road without blinding drivers and pedestrians. Validating the safety of these headlight systems using physical prototypes would require millions of miles of night-driving testing and cost-prohibitive investment. Simulation is the only option for adequately a... » read more

Insight Into The Evolution Of Vehicle Electrification


This SAE 2018 Reader Survey was conducted on behalf of ANSYS to discover subscribers’ level of involvement with vehicle electrification trends and technologies. Survey respondents work in the automotive industry, with corporate management, management and design engineering job functions and a technology interest in power and propulsion. To read more, click here. » read more

Chipping Away At Functional Safety Flaws In Automotive Electronics


Today’s automobiles are packed with electronics. From autonomous driving support and infotainment systems to mission-critical functions like braking, a car’s performance depends on the reliability of these electronics systems. While the semiconductors that lie at the heart of these systems have been not been a focus in the past, today their reliability is coming under closer scrutiny by bot... » read more

Disruption in High-Tech Is Here: Are You Ready?


Smart connected technology first transformed consumer electronics such as phones and tablets. Then it proliferated into cars, jets, health care, manufacturing and beyond. Today every product development team is asking “How can we incorporate smart connected technology to take our products’ performance to a new level?” Industry leaders are tackling this challenge with engineering simulatio... » read more

Fostering Thermal Design Innovation Using Chip-Package-System Analysis Techniques


As devices continue to become smaller and more portable Moore’s Law continues to increase the number of transistors that fit within a chip albeit many predict an end to this in the near future. However new interconnect technologies that use Through-Silicon-Vias (TSVs) can place ICs next to each other using 2.5D Interposers or stack chips in 3D resulting in even greater system scaling. This co... » read more

Disruption Is Here In Automotive And Ground Transportation: Are You Ready?


The automotive and ground transportation industry is being disrupted with the rise of shared, connected, self-driving, electrified vehicles. For those who can innovate fast, it is a once-in-a-century opportunity to leapfrog the competition and win the race to dominate the new mobility industry. Simulation is the key enabler. Are you ready for innovation through simulation? Engineering simula... » read more

Fast-Tracking Safe Autonomous Vehicles


You can't put a car on the road, a drone in the air or a robot in a warehouse without satisfying the strictest of safety standards. For an autonomous car, for example, this means driving billions of miles — a practical impossibility when time to market is critical. With ANSYS' complete solution for autonomous vehicles, you can put your machine through the required paces in a fraction of the t... » read more

Digital Twins: Making The Vision Achievable


Few business concepts are generating the buzz of digital twins — product replicas that can help target performance issues and allow for true predictive maintenance. While the benefits are obvious, companies have struggled with how to achieve this vision. But now there is a practical solution. To read more, click here. » read more

Chipping Away At Functional Safety Flaws In Automotive Electronics


Today’s automobiles are packed with electronics. From autonomous driving support and infotainment systems to mission-critical functions like braking, a car’s performance depends on the reliability of these electronics systems. While the semiconductors that lie at the heart of these systems have been not been a focus in the past, today their reliability is coming under closer scrutiny by bot... » read more

Performance Improvement By System Aware Substrate Noise Analysis For Mixed-signal IC


The market wants mixed ICs that are smaller and cheaper, and even provide advanced features. To satisfy this contradiction, many mixed ICs makers are reducing their bill of materials (BOM) cost by decreasing the amount of materials in the package or on a board. But these cost-effective methods can cause significant performance degradation with intensified coupling effects due to substrate noise... » read more

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