Can Germany’s Auto Industry Keep Pace?


Germany's strength for the past half-century has been its automotive industry. The big question now is whether that also will become its biggest vulnerability. Challenged on all fronts by fundamental shifts in automotive technology, the German auto industry is struggling to transform itself from precision metal bending to advanced electronics, and so far its future in the face of competitors... » read more

Week In Review: IoT, Security, Auto


Internet of Things SiFive is bringing RISC-V to IoT makers and university developers through the RISC-V-based SiFive Learn Initiative, an open-source learning package that can be used to create a low-cost RISC-V hardware compatible with AWS IoT Core. The development platform SiFive Learn Inventor has a software package and education enablement course. It includes: The programmable SiFive Lear... » read more

OneSpin Users Gather in Munich


Even more than most other high-tech companies, EDA vendors rely on their users for many aspects of their success. Of course, customers provide the revenue that fuels the business, but their influence goes far beyond that. Many features in EDA tools, and even entire categories of products, arise from working closely with advanced users. Even before traditional Beta-testing, selected users provid... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Addressing Pain Points In Chip Design


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Week In Review: Manufacturing, Test


Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

Power Semi Wars Begin


Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Week In Review: Design, Low Power


Tools & IP Synopsys debuted its new DesignWare ARC EV7x Embedded Vision Processor family for machine learning and AI edge applications. The ARC EV7x Vision Processors integrate up to four enhanced vector processing units (VPUs) and an optional Deep Neural Network (DNN) accelerator with up to 14,080 MACs to deliver up to 35 TOPS performance in 16nm FinFET process technologies under typical ... » read more

Week In Review: Design, Low Power


VESA published the DisplayPort 2.0 standard, which allows for a max payload of 77.37 Gbps, a 3X increase in data bandwidth performance compared to DisplayPort 1.4a. The latest release also includes capabilities to address beyond 8K resolutions, higher refresh rates and HDR support at higher resolutions, multiple display configurations, and support for 4K-and-beyond VR resolutions. It is backwar... » read more

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