Addressing Pain Points In Chip Design


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Week In Review: Manufacturing, Test


Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

Power Semi Wars Begin


Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Week In Review: Design, Low Power


Tools & IP Synopsys debuted its new DesignWare ARC EV7x Embedded Vision Processor family for machine learning and AI edge applications. The ARC EV7x Vision Processors integrate up to four enhanced vector processing units (VPUs) and an optional Deep Neural Network (DNN) accelerator with up to 14,080 MACs to deliver up to 35 TOPS performance in 16nm FinFET process technologies under typical ... » read more

Week In Review: Design, Low Power


VESA published the DisplayPort 2.0 standard, which allows for a max payload of 77.37 Gbps, a 3X increase in data bandwidth performance compared to DisplayPort 1.4a. The latest release also includes capabilities to address beyond 8K resolutions, higher refresh rates and HDR support at higher resolutions, multiple display configurations, and support for 4K-and-beyond VR resolutions. It is backwar... » read more

Inspection, Metrology Challenges Grow For SiC


Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

SiC Demand Growing Faster Than Supply


The silicon carbide (SiC) industry is in the midst of a major expansion campaign, but suppliers are struggling to meet potential demand for SiC power devices and wafers in the market. In just one example of the expansion efforts, Cree plans to invest up to $1 billion to increase its SiC fab and wafer capacities. As part of the plan, Cree is developing the world’s first 200mm (8-inch) SiC f... » read more

Blockchain May Be Overkill for Most IIoT Security


Blockchain crops up in many of the pitches for security software aimed at the industrial IoT. However, IIoT project owners, chipmakers and OEMs should stick with security options that address the low-level, device- and data-centered security of the IIoT itself, rather than the effort to promote blockchain as a security option as well as an audit tool. Only about 6% of Industrial IoT (IIoT) p... » read more

Week In Review: Manufacturing, Test


Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

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