Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Toward Software-Defined Vehicles


Speed is everything when it comes to designing automotive electronics, but not in the usual way. In the past, product cycles often lasted five to seven years, from initial design to implementation inside of vehicles. That no longer works as vehicles adopt more electronic features to replace mechanical ones, and as competition heats up over the latest features and nearly instantaneous over-the-a... » read more

Chip Industry Week In Review


The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Chip Industry Week In Review


The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Decarbonizing Commercial Vehicles with Infineon Semiconductors


Commercial, construction and agricultural vehicles (CAVs) are the backbone of industries that drive our global economy. Motivated by recent developments, the CAV industry is now undergoing a radical change: the journey toward electrification--from CAVS to eCAVs. The electrification of CAVs is a huge and promising challenge in which the semiconductors play a crucial role. Find more informatio... » read more

Security Focus Widens To HW, SW, Ecosystems


Hardware security strategies are pushing much further left in the chip design flow as the number of vulnerabilities in complex designs and connected devices continues to grow, taking into account potential vulnerabilities in both hardware and software, as well as the integrity of an extended global supply chain. These approaches leverage the speed of fixing problems in software, and the effe... » read more

Power Stage Selection Considerations For High-Current Voltage Regulators


There are several key things to consider when selecting a power stage for high-current voltage regulators: What area does the power stage need to fit in? What is the continuous output current? What is the maximum peak current? This should not exceed the peak current rating of the power stage. What is the power loss for sustained output current? This can be calculated... » read more

Chip Industry Week In Review


The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

Moving Software-Defined Vehicles Forward


Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Chip Industry Week In Review


BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

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