Chip Industry Week In Review

By The SE Staff - 26 Apr, 2024 - Comments: 0

President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

Chip Industry Technical Paper Roundup: April 23

By Linda Christensen - 23 Apr, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=216 /] Find last week’s technical paper additions here. » read more

Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Future-Proofing Automotive V2X

By Ann Mutschler - 17 Apr, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment with Shawn Carpenter, program director, 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hybrid... » read more

Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Comparison Of The Meta Modeling Approach With HGLs

By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "The Argument for Meta-Modeling-Based Approaches to Hardware Generation Languages" was published by researchers at Infineon Technologies and TU Munich. Abstract "The rapid evolution of Integrated Circuit (IC) development necessitates innovative methodologies such as code generation to manage complexity and increase productivity. Using the right methodology for g... » read more

Chip Industry Week In Review

By The SE Staff - 05 Apr, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

Data Center Security Issues Widen

By Adam Kovac - 04 Apr, 2024 - Comments: 0

The total amount of data will swell to about 200 zettabytes of data next year, much of it stored in massive data centers scattered across the globe that are increasingly vulnerable to attacks of all sorts. The stakes for securing data have been rising steadily as the value of that data increases, making it far more attractive to hackers. This is evident in the scope of the attack targets —... » read more

Protecting Automotive Power Distribution

By Vasiliki Makantasi - 04 Apr, 2024 - Comments: 0

It was on a warm summer’s evening aboard a cruise boat on one of Austria’s most beautiful lakes that I was co-hosting an Infineon event to conclude a professional experience week for a group of around 50 students from technical high schools in the region. It was time for the final round for us to showcase our creations. Smaller groups of around 10 students went from co-host to co-host, a... » read more

Enabling The Next Generation Of Smarter Self-Navigating Robots Using Hybrid ToF Technology

By Infineon - 03 Apr, 2024 - Comments: 0

Previous generations of robot vacuum cleaners have used a random pattern for cleaning that is inefficient and slow. Next-generation robots are much smarter and generate a map of the environment using sensors to localize themselves. This provides users with a floorplan of their home, from which the rooms and areas can be selected for cleaning or restricted from access. The new robots accomplish ... » read more

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tag: Infineon

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: April 23

Chip Industry Week In Review

Future-Proofing Automotive V2X

Chip Industry Week In Review

Comparison Of The Meta Modeling Approach With HGLs

Chip Industry Week In Review

Data Center Security Issues Widen

Protecting Automotive Power Distribution

Enabling The Next Generation Of Smarter Self-Navigating Robots Using Hybrid ToF Technology

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