tag: Infineon

Week In Review: Design, Low Power
By Jesse Allen - 28 Jun, 2019 - Comments: 0

VESA published the DisplayPort 2.0 standard, which allows for a max payload of 77.37 Gbps, a 3X increase in data bandwidth performance compared to DisplayPort 1.4a. The latest release also includes capabilities to address beyond 8K resolutions, higher refresh rates and HDR support at higher resolutions, multiple display configurations, and support for 4K-and-beyond VR resolutions. It is backwar... » read more

Inspection, Metrology Challenges Grow For SiC
By Mark LaPedus - 11 Jun, 2019 - Comments: 0

Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

SiC Demand Growing Faster Than Supply
By Mark LaPedus - 23 May, 2019 - Comments: 1

The silicon carbide (SiC) industry is in the midst of a major expansion campaign, but suppliers are struggling to meet potential demand for SiC power devices and wafers in the market. In just one example of the expansion efforts, Cree plans to invest up to $1 billion to increase its SiC fab and wafer capacities. As part of the plan, Cree is developing the world’s first 200mm (8-inch) SiC f... » read more

Blockchain May Be Overkill for Most IIoT Security
By Kevin Fogarty - 13 Feb, 2019 - Comments: 0

Blockchain crops up in many of the pitches for security software aimed at the industrial IoT. However, IIoT project owners, chipmakers and OEMs should stick with security options that address the low-level, device- and data-centered security of the IIoT itself, rather than the effort to promote blockchain as a security option as well as an audit tool. Only about 6% of Industrial IoT (IIoT) p... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Dec, 2018 - Comments: 0

Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

Making Sure A Heterogeneous Design Will Work
By Ed Sperling - 03 Dec, 2018 - Comments: 0

An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

Virtual Design Chains At The EDA Forum
By Frank Schirrmeister - 29 Nov, 2018 - Comments: 0

The German edacentrum’s EDA Forum was held in Berlin, Germany, in early November. It was very interesting to see the design chain effects in the automotive domain, very visible in a panel yours truly was part of, together with Audi, Bosch, Infineon, MicroChip, Synopsys, Mentor, and the BMBF. Driven from the top of the design chain, the direction is clearly to go more virtual to optimize the c... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Nov, 2018 - Comments: 0

Test There is more consolidation in the ATE business. In October, Cohu completed the acquisition of Xcerra, a supplier of ATE and other products. Then, Astronics this week entered into an agreement for the sale of the intellectual-property and certain assets associated with its semiconductor test business to Advantest for $185 million in cash. The sale additionally includes a $30 million earn-... » read more

Panel Fan-out Ramps, Challenges Remain
By Mark LaPedus - 05 Nov, 2018 - Comments: 0

After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Carmakers To Chipmakers: Where’s The Data?
By Ed Sperling And Susan Rambo - 24 Oct, 2018 - Comments: 0

The integration of electronics into increasingly autonomous vehicles isn't going nearly as smoothly as the marketing literature suggests. In fact, it could take years before some of these discrepancies are resolved. The push toward full autonomy certainly hasn't slowed down, but carmakers and the electronics industry are approaching that goal from very different vantage points. Carmakers and... » read more

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