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tag: Infineon

Energy Harvesting Shows New Signs of Life
By Bryon Moyer - 08 Apr, 2021 - Comments: 1

Energy harvesting is seeing renewed activity in select markets, years after some high-profile attempts to build this into consumer electronics stalled out. Costs, manufacturing challenges, and market resistance kept this technology from moving forward, more than a decade after it was being touted as the best way forward for consumer electronics and devices that were hard to access. While sol... » read more

More Data Drives Focus On IC Energy Efficiency
By Ann Steffora Mutschler - 08 Apr, 2021 - Comments: 0

Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

SiC MOSFETs In The Landscape Of Modern Power Devices
By Peter Friedrichs - 08 Apr, 2021 - Comments: 0

Over the years, low losses possible by high breakdown field made silicon carbide (SiC) MOSFETs extremely popular amongst engineers. At present, they are mostly used in areas where IGBTs (Insulated Gate Bipolar Transistors) have been the prevailing component of choice before. But which role do SiC MOSFETs play in today’s landscape of power devices? With SiC MOSFETs (Metal-Oxide-Semicond... » read more

Benefits Of Multilevel Topologies In Power-Efficient Energy Storage Systems (ESS)
By Infineon - 07 Apr, 2021 - Comments: 0

In this paper, we discuss the adaption of efficient energy storage systems (ESS) in residential solar and utility-scale applications. System requirements and possible topologies are looked into. For utility-scale, we introduce a multilevel converter topology concept. Click here to read more.   » read more

New Uses For AI
By Ed Sperling - 01 Apr, 2021 - Comments: 0

AI is being embedded into an increasing number of technologies that are commonly found inside most chips, and initial results show dramatic improvements in both power and performance. Unlike high-profile AI implementations, such as self-driving cars or natural language processing, much of this work flies well under the radar for most people. It generally takes the path of least disruption, b... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 19 Mar, 2021 - Comments: 0

Security Infineon announced it has a Trusted Platform Module (TPM 2.0), called OPTIGA TPM 2.0, used to secure remote software updates, disc encryption, and user authentication on Linux-based systems. OPTIGA is an open software stack for securing comprehensive TSS* host software implementing the latest FAPI standard. Infineon developed the open-source software with Intel Corporation and Fraunho... » read more

Controlling The Reliability Of Silicon Carbide-Based Devices
By Peter Friedrichs - 11 Mar, 2021 - Comments: 0

The development of wide bandgap silicon carbide (SiC) compound semiconductors has proved to be extremely beneficial for power conversion applications. Capable of switching at significantly higher frequencies, and with higher breakdown voltage characteristics, SiC power transistors are quickly becoming an attractive silicon alternative for high power density and/or high-efficiency power conver... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Mar, 2021 - Comments: 0

Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Mar, 2021 - Comments: 0

Automotive/Mobility Chip-telemetry company proteanTecs has joined TSMC’s IP Alliance Program, which puts proteanTecs’ Universal Chip Telemetry (UCT) IP into TSMC’s catalog of production-proven IP. UCT is a monitoring system designed directly into chips to pull measurements from inside the chip throughout its lifecycle, including after placement in systems in the field. Monitoring the hea... » read more

Auto OEMs Face New Competitive Threats
By Ann Steffora Mutschler - 04 Mar, 2021 - Comments: 0

Automotive design and manufacturing are undergoing a fundamental shift to the left as cars increasingly are electrified and chips take over more functions formerly done by mechanical parts, setting the stage for massive disruption across a supply chain that has been in place for decades. The success of Tesla — a company that had never actually built a chip or a car — was both a surprise ... » read more

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