Research Bits: Oct. 1
Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep learning protocol.
Chip Industry Technical Paper Roundup: Oct. 1
KAN for lightweight edge inference; bendable non-silicon RISC-V microprocessor; low-latency, energy-efficiency LLM inference; using both faces of ...
Research Bits: Sept. 24
Novel memories: Modeling negative capacitance; nonvolatility of RRAM; MTJ degradation
Chip Industry Technical Paper Roundup: Sept. 24
PIM memory management; carbon nanotube FETs; high-degree polynomial gradients in memory; STT-MRAM; neuro-symbolic AI HW architecture; state of the ...
Research Bits: Sept. 17
DNA data storage plus compute; printed metal oxides; optimizing STM probes.
Chip Industry Technical Paper Roundup: Sept. 17
3DIC partitioning; graphene FETs; analog in-memory DNN training; leakage contracts for processors; electromechanical resonators; quantum error corr...
Research Bits: Sept. 9
6G: All-silicon polarization multiplexer; non-volatile hBN switch; tunable YIG filter.
Chip Industry Technical Paper Roundup: Sept. 9
ECTC metrology report; microfludic cooling; Fano resonance in Si Photonics; enhancing transport properties of polymers; cooling power electronics; ...
Research Bits: Sept. 3
3D printing: Specialized antennas; recyclable ink; chip-based printer.
Chip Industry Technical Paper Roundup: Sept. 3
GPU energy efficiency; logic locking; HLS LLMs; thin films reflectometry and TEM; silicon quantum dot errors; DL compiler for AI chips; low leakage...
