Power/Performance Bits: Feb. 23
Photonic AI accelerator; a clearer look at HDD write heads; drawing circuits with a pen.
Power/Performance Bits: Feb. 16
Superconducting microprocessor; integrating LEDs into chips; wireless for Industry 4.0.
Power/Performance Bits: Feb. 8
Transparent sensor; graphene-enhanced heat pipes; large perovskite solar cells.
Power/Performance Bits: Feb. 2
MXene antennas; recycling Li-ion batteries; mid infrared sensing.
Power/Performance Bits: Jan. 26
Neural networks on MCUs; lighting up AI; tiny memristor.
Manufacturing Bits: Feb. 23
Space crystals; edge computing in space; Mars metrology.
Manufacturing Bits: Feb. 16
Hybrid bonding consortium for packaging; quantum interposers.
Manufacturing Bits: Feb. 8
Metalens for AR/VR; optical coatings using FROCs.
Manufacturing Bits: Feb. 2
Capacitor-less DRAM; 14nm STT-MRAM; non-ideal ReRAM.
Manufacturing Bits: Jan. 26
EU FIB project; hydrogen depassivation lithography.