Research Bits: July 22
Sub-1nm gate; data storage metamaterial; counterfeit chip detection.
Chip Industry Technical Paper Roundup: July 22
SiC packaging; functional test sequences; 6G and beyond; verification for NVM; thwarting ML/algorithmic structural attacks; 3D PICs; excitonic phen...
Chip Industry Technical Paper Roundup: July 16
On-chip communication for programmable accelerators; neuromorphic roadmap; RTL optimization; DRAM read disturbance; programmable quantum emitter in...
Research Bits: July 16
Kirigami-inspired mechanical computer; TMD defects; switching magnetite with light.
Chip Industry Technical Paper Roundup: July 8
Hot spot cooling; scalable MatMul-free LLM; DfT for 3DIC; photonic ICs; high-density in-memory computing; self-assembly nano; LLM on-chip security ...
Chip Industry Technical Paper Roundup: June 25
Metals for advanced interconnects; future of plasma etching; IR drop prediction; power electronics packaging; NVM bitflips; probabilistic circuits;...
Research Bits: June 18
Gallium nitride can take the heat; liquid metal logic; ultra-thin lens.
Chip Industry Technical Paper Roundup: June 18
Chiplet probing attacks; RISC-V Rowhammer; HPC QPU eval; CTFET at varying temps; KANs as alternative to MLPs; TNN inference on RISC-V edge systems;...
Chip Industry Technical Paper Roundup: June 10
Neuromorphic processors; RISC-V formal verification; GaN at high temps; thermal properties of system-on-foil; thermally aged flip-chip package; rad...
Research Bits: June 4
Quantum on silicon: Ultra-pure silicon chips; diamond qubit array on CMOS; tiny light detector.
