Research Bits: April 23
Probabilistic computer prototype; photonic AI chiplet; observing changes in 2D materials.
Chip Industry Technical Paper Roundup: April 23
High-NA EUVL defect inspection; ML-based HW fuzzing; low contact resistance; HW generation languages; 2D vdW magnets above room temp; interface for...
Research Bits: April 16
Tunable thermal conductivity in memristors; amorphous oxide semiconductor contact resistance; active titanium dioxide substrate.
Chip Industry Technical Paper Roundup: April 8
Verification of memory consistency; mitigating IR drop; IBM's quantum memory; Rowhammer on AMD; new MRAM material structure; hybrid all-optical swi...
Research Bits: April 8
Annealing processor; microwave signal generation; phase change memory.
Chip Industry Technical Paper Roundup: April 2
AI and memory wall; interrupt-resilient HW trojans; bandwidth-effective DRAM cache for GPUs with SCM; GenAI through lens of formal verification; op...
Research Bits: Apr. 2
Flexible electronics: Stretchy, sensitive circuits; washable photovoltaics; bendable energy storage.
Chip Industry Technical Paper Roundup: March 26
U.S. strategy on microelectronics; standard cell layout automation; penning micro-trap for quantum; TCAM-SSD; predicting warpage early in package d...
Research Bits: March 26
Skyrmion switches; helical magnets; silicon-compatible magnetic whirls.
Chip Industry Technical Paper Roundup: Mar. 19
UCIe-3D; LLMs for EDA, HW design; reprogrammable light-based processor; distributed batteries 3D IC; processing-using-DRAM; power side-channel atta...
