中文 English

category: Research

category: IoT, Security & Automotive

Manufacturing Bits: July 27
By Mark LaPedus - 27 Jul, 2021 - Comments: 0

Merchant quantum processors Startup QuantWare has launched the world’s first merchant and off-the-shelf superconducting processor for quantum computers. QuantWare’s quantum processor unit (QPU), called Soprano, is a 5-qubit device. The QPU can be customized for various applications. The device is ideal for research institutions and university labs. Quantum computing is a hot topic. A... » read more

Power/Performance Bits: July 27
By Jesse Allen - 27 Jul, 2021 - Comments: 0

Amplifying light for lidar Engineers at University of Texas at Austin and University of Virginia developed a light detector that can amplify weak light signals and reduce noise to improve the accuracy of lidar. "Autonomous vehicles send out laser signals that bounce off objects to tell you how far away you are. Not much light comes back, so if your detector is putting out more noise than th... » read more

Manufacturing Bits: July 20
By Mark LaPedus - 20 Jul, 2021 - Comments: 0

Interference EUV lithography ESOL has developed a standalone interference extreme ultraviolet (EUV) lithography tool for use in R&D applications. The system, called EMiLE (EUV Micro-interference Lithography Equipment), is primary used to speed up the development of EUV photoresists and related wafer processes. The system is different than ASML’s EUV lithography scanners, which are ... » read more

Power/Performance Bits: July 20
By Jesse Allen - 20 Jul, 2021 - Comments: 0

Shrinking RFID chips Researchers at North Carolina State University built a new, tiny RFID chip. They expect the chip to help drive down costs for RFID tags, making it possible to embed them in more things for supply chain security. "As far as we can tell, it's the world's smallest Gen2-compatible RFID chip," said Paul Franzon, Professor of Electrical and Computer Engineering at NC State. I... » read more

Manufacturing Bits: July 13
By Mark LaPedus - 13 Jul, 2021 - Comments: 0

Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

Power/Performance Bits: July 13
By Jesse Allen - 13 Jul, 2021 - Comments: 0

Graphene PUFs Researchers at Pennsylvania State University propose using graphene to create physically unclonable functions (PUFs) that are energy efficient, scalable, and secure against AI attacks. The team first fabricated nearly 2,000 identical graphene transistors. Despite their structural similarity, the transistors' electrical conductivity varied due to the inherent randomness arising... » read more

Manufacturing Bits: June 29
By Mark LaPedus - 29 Jun, 2021 - Comments: 0

Speeding up ALD with AI The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed various ways to make atomic layer deposition (ALD) more efficient by using artificial intelligence (AI). ALD is a deposition technique that deposits materials one layer at a time on chips. For years, ALD has been used for the production of DRAMs, logic devices and other products. In ... » read more

Power/Performance Bits: June 29
By Jesse Allen - 29 Jun, 2021 - Comments: 0

Persistent photoconductivity Researchers at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL), University of Wisconsin Madison, and the University of Toledo, discovered a unique effect in metal-halide perovskite semiconductors that could be used in neuromorphic computing systems. Perovskites are currently being investigated as highly efficient solar cells. In fact,... » read more

Manufacturing Bits: June 22
By Mark LaPedus - 22 Jun, 2021 - Comments: 1

5G metasurface antennas At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), the Institute of Microelectronics of the Chinese Academy of Sciences (CAS) presented a paper on a low-profile broadband metasurface antenna for 5G antenna-in-package applications. The National Center for Advanced Packaging and the University of Chinese Academy of Sciences also contri... » read more

Power/Performance Bits: June 22
By Jesse Allen - 22 Jun, 2021 - Comments: 0

Terahertz silicon multiplexer Researchers from Osaka University and University of Adelaide designed a silicon multiplexer for terahertz-range communications in the 300-GHz band. “In order to control the great spectral bandwidth of terahertz waves, a multiplexer, which is used to split and join signals, is critical for dividing the information into manageable chunks that can be more easily... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2021 SMG   |  Terms of Service  |  Privacy Policy