Chip Industry Week In Review

By The SE Staff - 26 Apr, 2024 - Comments: 0

President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

EDA Looks Beyond Chips

By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

How 6G Research Will Revolutionize Mobile Experiences

By Ben Coffin - 25 Apr, 2024 - Comments: 0

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented bandwidths, and ultra-low latencies. It will transform various sectors, including telecommunications, manufacturing, healthcare, transportation, and entertainment. In this article, get a glimpse of the 6G world coming to us over the next decade, and explore the 6G rese... » read more

Key Critical Specs You Should Know Before Selecting a Function Generator

By Keysight - 24 Apr, 2024 - Comments: 0

Selecting a benchtop function generator for your everyday use is very important. You want to be sure it produces the signal types that you need for your tests without introducing unwanted jitters, noise, harmonic distortions, or signal flaws. Introducing unwanted signal flaws inadvertently causes false test rejects due to your function generator. It is a common mistake to purchase the least exp... » read more

Blog Review: April 24

By Jesse Allen - 24 Apr, 2024 - Comments: 0

Cadence's Vatsal Patel notes the factors that make high-bandwidth memory ideal for AI, such as improved bandwidth and area from vertical stacking and power reduction features like data bus inversion. Synopsys' Rob van Blommestein points to early power network analysis as a way to ensure that enough power is delivered to each transistor to mitigate potential power-related issues within the ch... » read more

Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Blog Review: April 17

By Jesse Allen - 17 Apr, 2024 - Comments: 0

Siemens' Sumit Vishwakarma highlights the importance of crystal oscillators to the proper functioning of many semiconductor devices and applications, from clock signals to transmission and reception of radio waves. Cadence's Jay Domadia introduces some of the new features in GDDR7, such as a semi-independent row and column command address bus and two modes of data signaling, enabling PAM3 fo... » read more

Using AI/ML To Minimize IR Drop

By Ann Mutschler - 11 Apr, 2024 - Comments: 1

IR drop is becoming a much bigger problem as technology nodes scale and more components are packed into advanced packages. This is partly a result of physics, but it's also the result of how the design flow is structured. In most cases, AI/ML can help. The underlying problem is that moving to advanced process nodes, and now 3D-ICs, is driving current densities higher, while the power envelop... » read more

Linear Drive Optics May Reduce Data Latency

By Karen Heyman - 11 Apr, 2024 - Comments: 0

Optical and electrical are starting to cross paths at a much deeper level, particularly with the growing focus on 3D-ICs and AI/ML training in data centers, driving changes both in how chips are designed and how these very different technologies are integrated together. At the root of this shift are the power and performance demands of AI/ML. It can now take several buildings of a data cente... » read more

PCI Express Test Overview

By Keysight - 10 Apr, 2024 - Comments: 0

PCl Express, short for Peripheral Component Interconnect Express, is a high-performance and high-bandwidth serial communication interconnect standard. First proposed by Intel and further developed by the Peripheral Component Interconnect Special Interest Group (PCI-SIG) in replacement of bus-based communication architecture, such as PCI, PCI Extended (PCI-X), and Accelerated Graphics Port (AGP)... » read more

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tag: Keysight

Chip Industry Week In Review

EDA Looks Beyond Chips

How 6G Research Will Revolutionize Mobile Experiences

Key Critical Specs You Should Know Before Selecting a Function Generator

Blog Review: April 24

Chip Industry Week In Review

Blog Review: April 17

Using AI/ML To Minimize IR Drop

Linear Drive Optics May Reduce Data Latency

PCI Express Test Overview

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