Week In Review: Manufacturing, Test


The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Week In Review: Auto, Security, Pervasive Computing


AI, machine learning Cadence says it has optimized its Tensilica HiFi digital signal processor IP to efficiently execute TensorFlow Lite for Microcontrollers, which are used in Google’s machine learning platform for edge. This means developers of AI/ML on the edge systems can now put better audio processing on edge devices with ML applications like keyword detection, audio scene detection, n... » read more

Chiplet Momentum Rising


The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Week In Review: Auto, Security, Pervasive Computing


Internet of Things SEMI-FlexTech launched six flexible hybrid electronics (FHE) projects, collaborating with U.S. Army Research Laboratory (ARL), to accelerate innovations in sensor and sensor systems. Participating in the projects are American Semiconductor, Inc., University of Texas El Paso, Tekscan, PARC, Alertgy, and Iowa State University, among others. Some of the projects include develop... » read more

Big Design, IP and End Market Shifts In 2020


EDA is on a roll. Design starts are up significantly thanks to increased investment in areas such as AI, a plethora of new communications standards, buildout of the Cloud, the race toward autonomous driving and continued advancements in mobile phones. Many designs demand the latest technologies and push the limits of complexity. Low power is becoming more than just reducing wasted power at t... » read more

Week In Review: IoT, Security, Autos


AI/Edge Vastai Technologies is using Arteris IP’s FlexNoC Interconnect IP and AI Package for its Artificial Intelligence Chips for artificial intelligence and computer vision systems-on-chip (SoCs). Startup Vastai Technologies was founded in December 2018, designs ASICs and software platforms for computer vision and AI applications, such as smart city, smart surveillance, smart education, ac... » read more

Big Growth Areas: Connectivity, AI, Reliability


Connectivity and artificial intelligence (AI) will be the biggest drivers for 2020, with an emphasis on improved reliability across all areas. New standards, new applications, and new pressures being placed on old technology will created boundless opportunities for those ready to fill the need. Of course, there will also be a lot of carnage along the way, and we can expect to see a lot of that ... » read more

Week In Review: Design, Low Power


A new working group has been proposed by Accellera to focus on the standardization of analog/mixed signal extensions (AMS) for the Universal Verification Methodology (UVM) standard. “Our ambition is to apply UVM for both digital and analog/mixed-signal verification,” said Martin Barnasconi, Accellera Technical Committee Chair. “The UVM-AMS PWG will assess the benefits of creating analog a... » read more

Week In Review: Design, Low Power


Tools & IP Engineering simulation company ANSYS says thanks to new features in its ANSYS Twin Builder, product developers may be able save money in warranty and operational costs. The Twin Builder creates a digital twin of a systems in the field, enabling a convenient way to monitor and maintain systems remotely. The latest release adds predictive maintenance features for digital-twin runt... » read more

Week In Review: Design, Low Power


Tools & IP OneSpin revealed its latest formal app, Connectivity XL, providing formal connectivity checking to 7nm, multi-billion gate SoC designs. The app generates detailed connectivity specification tables from abstract connectivity specs through a dedicated checking engine that integrates structural and formal analysis to perform on-the-fly, automated abstractions. It supports verificat... » read more

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