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Week In Review: Design, Low Power


MoSys, a provider of SRAM solutions and networking accelerators, and Peraso Technologies, a provider of 5G mmWave devices, are merging. Stockholders of Peraso are expected to hold a 61% equity interest in the combined company, with the remaining 39% equity interest to be retained by the stockholders of MoSys. Peraso CEO Ronald Glibbery said, "By joining with MoSys, we believe we can deliver a b... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Arm announced a new software architecture, two reference hardware implementations, and its role leading a new industry group that will work on open-source software for automotive use. The Scalable Open Architecture for Embedded Edge (SOAFEE) is based on Arm’s Project Cassini and SystemReady, aims to help the automotive industry move to software-defined systems by tackling the comp... » read more

Blog Review: Sept. 15


Synopsys' Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time. Siemens EDA's Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.... » read more

Long-Haul Trucking With Fewer Drivers


The trucking industry is betting heavily on increasing levels of autonomy and electrification to reduce the cost of moving goods and to overcome persistent problems. The economics of autonomous driving are compelling, not least of which is an almost perpetual shortage of qualified drivers. But there also are a number of technical hurdles to making this work. On top of the challenges facing t... » read more

Week In Review: Design, Low Power


Tools & IP Cadence and Samsung Foundry are offering Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm. Enabling access to mixed-signal designs in a common OpenAccess database, the co-design methodology promotes shared responsibilities and collaboration between the analog and digital teams ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Intel’s Mobileye and Sixt SE said they are collaborating on an autonomous ride-hailing services in Munich in 2022. Mobileye will own the robotaxi fleet. Mobileye also recently unveiled its electric autonomous vehicle (AV), which it will use in ridehailing in Munich and Tel Aviv.. To increase the supply of automotive chips, Intel said it will build new chip manufacturing facilit... » read more

Wrestling With Analog At 3nm


Analog engineers are facing big challenges at 3nm, forcing them to come up with creative solutions to a widening set of issues at each new process node. Still, these problems must be addressed, because no digital chip will work without at least some analog circuitry. As fabrication technologies shrink, digital logic improves in some combination of power, performance, and area. The process te... » read more

Tradeoffs Between Edge Vs. Cloud


Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

The Next Generation Of General-Purpose Compute At Hot Chips


At the recent HOT CHIPS, the first day opened with the chips that you first think of when you hear the word processor. These are the next generation of chips from the likes of Intel, AMD, and IBM. There were lots of other chips too, such as Arm's Neoverse N2, and NVIDIA's new data-processing unit (DPU), or AMD's next-generation graphics architecture. But for this post, anyway, I'm going to focu... » read more

Blog Review: Sept. 8


Synopsys' Scott Durrant considers the IP used in HPC SoCs and the efforts to simultaneously minimize data movement and maximize the speed at which data is transferred from one location to another, whether that data transfer is across long distances or from one chip to another within a server. Cadence's Paul McLellan looks into a new version of the Rowhammer DRAM vulnerability that can allow ... » read more

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