Author's Latest Posts


Security, Scaling and Power


If anyone has doubts about the slowdown and increasing irrelevance of Moore's Law, Intel's official unveiling of its advanced packaging strategy should leave little doubt. Inertia has ended and the roadmap is being rewritten. Intel's discussion of advanced packaging is nothing new. The company has been public about its intentions for years, and started dropping hints back when Pat Gelsinger ... » read more

Making Sense Of DRAM


Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Open-Source RISC-V Hardware And Security


Semiconductor Engineering sat down with Helena Handschuh, a Rambus fellow; Richard Newell, senior principal product architect at Microsemi, a Microchip Company; and Joseph Kiniry, principal scientist at Galois. What follows are excerpts of that conversation. (L-R) Joseph Kiniry, Helena Handschuh and Richard Newell. SE: Is open-source hardware more secure, or does it just open up vulnera... » read more

4 Issues In Test


When most design engineers think about test, they envision a large piece of equipment in the fab they probably will never actually see or interact with. But as chips become more complex—driven by an explosion in both quantity and different types of data—test is emerging as one of the big challenges in design and manufacturing. There are four primary segments for test, each with its own s... » read more

Concurrent Test


Derek Wu, senior staff applications engineer at Advantest, looks at the need for doing multiple tests at the same time as chip designs become more complex, increasingly heterogeneous, and much more difficult to test at advanced nodes. https://youtu.be/-8inbjX_af0       __________________________________ See more tech talk videos here. » read more

The Growing Promise Of Printed Electronics


Printing electronics using conductive ink rather than lithography is starting to move out of the research phase, with chipmakers now looking at how to commercialize this technology across a broad range of sensor applications. Unlike traditional semiconductors, which use tiny wires as circuits, printed electronics rely on conductive inks and often flexible films, although they can be printed ... » read more

Where Advanced Packaging Makes Sense


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Planarization Challenges At 7nm And Beyond


Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU     _________________________________ See more tech talk videos here   » read more

The Case For Chiplets


Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches. https://youtu.be/7QHEeagdLzk » read more

Dawn Of The Data-Driven Age


Autonomous vehicles, 5G, a security breach at Marriott hotels, and AI. These may seem unrelated, but they're all linked by one common thread—data. Data creation, management and processing always have been a winning business formula. In 2004, IBM sold off its PC business on the assumption that it could still achieve significant growth by managing its customers' data. The rapid buildup by co... » read more

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