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EDA, IP Revenues Soar


EDA and IP revenues increased 15.4% to $3.032 billion in Q4 2020, according to a just-released report, with huge increases reported in China and India, and a solid double-digit increase in the Americas. EDA/IP revenue from China increased 66.4% in Q4 EDA/IP compared with the same period in 2019, and for the 2020 calendar year it was up 52.3%. India's spending was up 32% for the quarter. And ... » read more

New Uses For AI


AI is being embedded into an increasing number of technologies that are commonly found inside most chips, and initial results show dramatic improvements in both power and performance. Unlike high-profile AI implementations, such as self-driving cars or natural language processing, much of this work flies well under the radar for most people. It generally takes the path of least disruption, b... » read more

Network Interface Card Evolution


Longer chip lifetimes, more data to process and move, and a slowdown in the rate of processor improvements has created a series of constantly shifting bottlenecks. Kartik Srinivasan, director of data center marketing at Xilinx, looks at one of those bottlenecks, the network interface card, why continuous enhancements and changes will be required, and how to extend the life of NICs as the networ... » read more

How Heterogeneous ICs Are Reshaping Design Teams


Experts at the Table: Semiconductor Engineering sat down to discuss the complex interactions developing between different engineering groups as designs become more heterogeneous, with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Mai... » read more

What Goes Wrong In Advanced Packages


Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Customized Micro-Benchmarks For HW/SW Performance


Raw performance used to be the main focus of benchmarks, but they may have outlived their usefulness for many applications. Dana McCarty, vice president of sales and marketing for AI Inference Products at Flex Logix, talks about why companies need to develop and utilize their own specific models to accurately gauge hardware and software performance, which can be slowed by bottlenecks in I/O and... » read more

Changing The Rules For Chip Scaling


Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about the incessant drive for chip density, how to improve that density through other means than just scaling, and why this is so important for the chip industry. » read more

Using 5nm Chips And Advanced Packages In Cars


Semiconductor Engineering sat down to discuss the impact of advanced node chips and advanced packaging on automotive reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of... » read more

The Other Side Of AI System Reliability


Adding intelligence into pervasive electronics will have consequences, but not necessarily what most people expect. Nearly everything electronic these days has some sort of "smart" functionality built in or added on. This can be as simple as a smoke alarm that alerts you when the batteries are running low, a home assistant that learns your schedule and dials the thermostat up or down, or a r... » read more

Design Issues For Chips Over Longer Lifetimes


Semiconductor Engineering sat down to discuss the myriad challenges associated with chips used in complex systems over longer periods of time them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architec... » read more

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