Author's Latest Posts


More Knobs, Fewer Markers


The next big thing in chip design may be really big — the price tag. In the past, when things got smaller, so did the cost per transistor. Now they are getting more expensive to design and manufacture, and the cost per transistor is going up along with the number of transistors per area of die, and in many cases even the size of the die. That's not exactly a winning economic formula, which... » read more

Using Static Analysis For Functional Safety


Fadi Maamari, group director for R&D at Synopsys, explains why static analysis is suddenly in demand in auto chip design, how it can help to choose the best implementation of functional safety approaches, and where it fits into the design flow. » read more

Uses And Limitations Of AI In Chip Design


Raik Brinkmann, president and CEO of OneSpin Solutions, sat down with Semiconductor Engineering to talk about AI changes and challenges, new opportunities for using existing technology to improve AI, and vice versa. What follows are excerpts of that conversation. SE: What's changing in AI? Brinkmann: There are a couple of big changes underway. One involves AI in functional safety, where y... » read more

Things That Go Bump In The Daytime


There is no argument that autonomous technology is better at certain things than systems controlled by people. A computer-guided system has only one mission — to stay on the road, avoid object, and reach the end destination. It doesn't get tired, text, or look out the window. And it can park within a millimeter of a wall or another vehicle without hitting it, and do that every time — as lon... » read more

Making 3D Structures And Packages More Reliable


The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

3 Safety Standards For Auto Electronics


Kurt Shuler, vice president of marketing at Arteris IP, drills down into the three main safety standards, ISO 26262, SOTIF (Safety of the Unintended Function) and UL 4600, what each one covers, what the intent is behind them, and what this means for companies developing technology for future vehicles. » read more

The Evolution Of Pervasive Computing


The computing world has gone full circle toward pervasive computing. In fact, it has done so more than once, which from the outside may look like a more rapid spin cycle than a real change of direction. Dig deeper, though, and it's apparent that some fundamental changes are at work. This genesis of pervasive computing dates back to the introduction of the PC in 1981, prior to which all corpo... » read more

Security Risks In The Supply Chain


Semiconductor Engineering sat down to discuss security in the supply chain with Warren Savage, research scientist in the Applied Research Laboratory for Intelligence and Security at the University of Maryland; Neeraj Paliwal, vice president and general manager of Rambus Security; Luis Ancajas, marketing director for IoT security software solutions at Micron; Doug Suerich, product evangelist at ... » read more

Bridging Math And Engineering In ML


Steve Roddy, vice president of products for Arm’s Machine Learning Group, examines the intersection of high-level mathematics in the data science used in machine learning within area, speed, and power limitations, and how to bring these two worlds together with the least amount of disruption. » read more

EDA, IP Growth Surge


EDA and IP grew 8.9% in Q3 of 2019, according to a just-released report, indicating continued confidence in semiconductor growth. Total revenue was up 8.9% globally compared with the same period in 2018, but that number is deceptively low. Revenue in China, for example, increased 5.7% compared to the same quarter in 2018, despite trade restrictions on sales of any IP developed in the United ... » read more

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