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Design Technology Co-Optimization


Rising complexity is making it increasingly difficult to optimize chips for yield and reliability. David Fried, vice president of computational products at Lam Research, examines the benefits of automated rules to manage the relationship between layout and design requirements on one side, and process flows and rules/checks on the other. Benefits include reduced margin, shortened time to market,... » read more

The Risk Of Losing Track Of Your IP


What happens when you misuse IP, intentionally or otherwise? Pedro Pires, applications engineer at Cliosoft, talks about the challenges of keeping track of IP across multiple chip design projects, which can grow to include dozens of third-party IP blocks, last for long periods of years, and span multiple continents. » read more

Setting Ground Rules For 3D-IC Designs


Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

The Importance Of Layering Data


The chip industry generates enormous quantities of data, from design through manufacturing, but much of it is unavailable or incomplete. And even when and where it is available, it is frequently under-utilized. While there has been much work done in terms of establishing traceability and data formats, the cross-pollination of data between companies and between equipment makers at various pro... » read more

The Gargantuan 5G Chip Challenge


Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

Always-On DSPs


There are tradeoffs between powering circuits down to save power and waking them up to respond to voice and visual commands. Prakash Madhvapathy, director of product marketing and product management at Cadence, talks about the best ways to deploy digital signal processors, why multiple DSPs are often better than just one, and what penalties there are for various approaches. » read more

Challenges With Stacking Memory On Logic


Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Radiation Hardening Chips For Outer Space


What’s the difference between radiation tolerant and radiation hardening, and where is each one used? Minal Sawant, director of the aerospace and defense vertical market at Xilinx, talks about different striations in the Earth’s atmosphere, how those various levels can affect radiation, and what impact that has on the functionality of increasingly dense chip circuits over extended periods o... » read more

Why It’s So Difficult — And Costly — To Secure Chips


Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a variety of ways, some obvious and others less so. Until very recently, semiconductor security was viewed more as a theoretical threat than a real one. Governments certainly worried about adversaries taking control of secure systems through... » read more

Creating IoT Devices That Will Remain Secure


What’s secure today may not be secure in the future, and even if you include an IoT device with state-of-the-art security, it may be surrounded by less secure devices. Steve Hanna, distinguished engineer at Infineon, examines the impact of security on IoT adoption, why resilience across a system is the new target for secure designs, and how to minimize the impact of less secure devices. » read more

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