tag: IBM

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 09 Nov, 2018 - Comments: 0

Internet of Things What’s better than a 5G network? How about a local, private 5G network? The Industrial Internet of Things may drive the development of such networks. Of course, 5G cellular communications technology is still being worked out worldwide. BMW, Daimler, and Volkswagen are looking ahead to the future; those automotive manufacturers notified Germany’s Federal Network Agency th... » read more

The Multiple Faces And Phases Of AI
By Ed Sperling - 01 Nov, 2018 - Comments: 0

AI is being used in more ways and more devices—and in more ways in those same devices—raising the level of confusion about exactly what people are talking about when they refer to AI and AI-enabled systems. AI is both a tool and a process. It also is a thing, although not even remotely close to the singularity portrayed by Arthur C. Clarke in 2001. And as it proliferates, it's becoming h... » read more

Manufacturing Bits: Oct. 23
By Mark LaPedus - 23 Oct, 2018 - Comments: 0

3D stacked finFETs At the upcoming 2018 IEEE International Electron Devices Meeting (IEDM), Imec is expected to present a paper on a 3D stacked finFET architecture. IEDM is slated from Dec. 1-5 in San Francisco. Imec’s technology is based what on the R&D organization calls sequential integration. Another R&D organization, Leti, calls it 3D monolithic integration. Regardless, the idea... » read more

A Crisis In DoD’s Trusted Foundry Program?
By Mark LaPedus - 22 Oct, 2018 - Comments: 0

The U.S. Department of Defense’s Trusted Foundry program is in flux due to GlobalFoundries’ recent decision to put 7nm on hold, raising national security concerns across the U.S. defense community. U.S. DoD and military/aerospace chip customers currently have access to U.S.-based “secure” foundry capacity down to 14nm, but that's where it ends. No other foundries provide similar “s... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Oct, 2018 - Comments: 0

Chipmakers Amid ongoing delays with its 10nm process, Intel has reorganized its manufacturing unit, according to a report from The Oregonian/OregonLive. Sohail Ahmed, who has jointly led the unit since 2016, will retire next month, according to the report. The industry is racing to put extreme ultraviolet (EUV) lithography into production. TSMC recently taped-out its first 7nm chip using E... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 19 Oct, 2018 - Comments: 0

Internet of Things At Arm TechCon, Arm unveiled its Neoverse brand identity, providing an infrastructure foundation for 5G, the Internet of Things, edge computing, and other applications. The Arm Neoverse IP will proliferate next year from Arm and its technology partners. With Arm’s “Ares” platform, to be introduced in 2019, the company promises to deliver 30% per-generation performance ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 19 Oct, 2018 - Comments: 0

Arm announced its new roadmap promising 30% annual system performance gains on leading edge nodes through 2021. These gains are to come from a combination of microarchitecture design to hardware, software and tools. They are branding this new roadmap 'Neoverse.' The first delivery will be Ares – expected in early 2019 – for a 7nm IP platform targeting 5G networks and next-generation cloud t... » read more

RISC-V: More Than a Core
By Brian Bailey - 15 Oct, 2018 - Comments: 1

The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

Defect Challenges Growing In Advanced Packaging
By Mark LaPedus - 08 Oct, 2018 - Comments: 0

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 28 Sep, 2018 - Comments: 0

Internet of Things IBM this week launched the Watson Decision Platform for Agriculture, which combines artificial intelligence, Internet of Things technology, and cloud-based offerings, providing insights to farmers through a managed service. Among other features, growers can deploy drones to send photos to the IBM Cloud for AI-based trend analysis and detection of crop diseases. The platform ... » read more

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