Using Machine Learning In Fabs


Amid the shift towards more complex chips at advanced nodes, many chipmakers are exploring or turning to advanced forms of machine learning to help solve some big challenges in IC production. A subset of artificial intelligence (AI), machine learning, uses advanced algorithms in systems to recognize patterns in data as well as to learn and make predictions about the information. In the fab, ... » read more

System Bits: Sept. 17


Quantum computing R&D in Germany IBM is teaming with the Fraunhofer Society for research and development of quantum computing technology, backed by the German government, which is providing €650 million (about $715.4 million) in funding over two years for the program. IBM has agreed to install a Q System One system at one of its facilities in Germany for the program. The system has 20... » read more

Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing its acquisition of Northwest Logic, a supplier of memory, PCIe, and MIPI digital controllers. Meanwhile, the company named Sean Fan as chief operating officer. He previously served as vice president and general manager of the data center business unit at Renesas Electronics. Prior to its acquisition by Renesas earlier this year, Fan held senior execu... » read more

Week in Review: IoT, Security, Autos


Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Surround And Conquer


The processor wars are back in full swing, this time with some new players in the field. But what defines winning this time around is far less obvious than it was in the past, and it will take years before we know the outcome. The strategy is the same, though, and it's one that has been in use for years in the tech world. It began in the 1990s, when IBM came to the realization that it could ... » read more

Chiplets, Faster Interconnects, More Efficiency


Big chipmakers are turning to architectural improvements such as chiplets, faster throughput both on-chip and off-chip, and concentrating more work per operation or cycle, in order to ramp up processing speeds and efficiency. Taken as a whole, this represents a significant shift in direction for the major chip companies. All of them are wrestling with massive increases in processing demands ... » read more

Manufacturing Bits: Aug. 20


Making carbon nanotubes with AI Russia’s Skolkovo Institute of Science and Technology (Skoltech) has developed a method to monitor the growth of carbon nanotubes using an artificial intelligence (AI) technology called machine learning. Skoltech used AI to predict the performance of the synthesis of single-walled carbon nanotubes using a chemical vapor deposition (CVD) process. The tec... » read more

Week In Review: Manufacturing, Test


Chipmakers In its latest move to cut costs and focus on its core business, GlobalFoundries (GF) has announced plans to jettison its U.S. photomask operations in Burlington, Vt., but the foundry vendor will maintain a stake in its joint venture mask unit. Under the plan, Toppan Photomasks will acquire certain assets of GF’s Burlington photomask facility. “GF is transferring its mask tool... » read more

Week in Review: IoT, Security, Autos


Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Power Modeling Standard Released


Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

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