The Week in Review: IoT


Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

System Bits: Dec. 12


Increasing performance scaling with packageless processors Demand for increasing performance is far outpacing the capability of traditional methods for performance scaling. Disruptive solutions are needed to advance beyond incremental improvements. Traditionally, processors reside inside packages to enable PCB-based integration. However, a team of researchers from the Department of Electrical ... » read more

Manufacturing Bits: Dec. 5


Intel vs. GlobalFoundries At the IEEE International Electron Devices Meeting (IEDM) this week, GlobalFoundries and Intel will square off and present papers on their new logic processes. Intel will present more details about its previously-announced 10nm finFET technology, while GlobalFoundries will discuss its 7nm finFET process. As expected, Intel and GlobalFoundries will use 193nm immersi... » read more

System Bits: Dec. 5


[caption id="attachment_429586" align="aligncenter" width="300"] Vivienne Sze, an associate professor of electrical engineering and computer science at MIT. Source: MIT[/caption] Building deep learning hardware A new course at MIT is bringing together both electrical engineering and computer science to educate student in the highly sought after field of deep learning. Vivienne Sze, an assoc... » read more

System Bits: Nov. 21


MIT-Lamborghini to develop electric car Members of the MIT community were recently treated to a glimpse of the future as they passed through the Stata Center courtyard as the Lamborghini Terzo Millenio (Third Millennium) was in view, which is an automobile prototype for the third millennium. [caption id="attachment_429209" align="alignnone" width="300"] Lamborghini is relying on MIT to make i... » read more

System Bits: Nov. 7


Exposing logic errors in deep neural networks In a new approach meant to brings transparency to self-driving cars and other self-taught systems, researchers at Columbia and Lehigh universities have come up with a way to automatically error-check the thousands to millions of neurons in a deep learning neural network. Their tool — DeepXplore — feeds confusing, real-world inputs into the ... » read more

System Bits: Oct. 31


Software enables cars to auto-report diagnostics Thanks to researchers at MIT, it may soon be possible to hop into a ride-share car, glance at a smartphone app, and tell the driver that the car’s left front tire needs air, its air filter should be replaced next week, and its engine needs two new spark plugs. [caption id="attachment_409967" align="alignnone" width="300"] A new smartphone a... » read more

Power/Performance Bits: Oct. 31


Battery material supplies Researchers at MIT, the University of California at Berkeley, and the Rochester Institute of Technology conducted an analysis of whether there are enough raw materials to support increased lithium-ion battery production, expected to grow significantly due to electric vehicles and grid-connected battery systems. They conclude that while in the near future there shou... » read more

Making high-capacity data caches more efficient


Source: Researchers from MIT, Intel, and ETH Zurich Xiangyao Yu (MIT), Christopher J. Hughes (Intel), Nadathur Satish (Intel) Onur Mutlu (ETH Zurich), Srinivas Devadas (MIT) Technical Paper link MIT News article As the transistor counts in processors have gone up, the relatively slow connection between the processor and main memory has become the chief impediment to improving comp... » read more

System Bits: Oct. 24


Optical communication on silicon chips With the huge increase in computing performance in recent decades achieved by squeezing ever more transistors into a tighter space on microchips, at the same time this downsizing has also meant packing the wiring within microprocessors ever more tightly together. This has led to effects such as signal leakage between components, which can slow down commun... » read more

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