Fan-Outs vs. TSVs


Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Enabling Automotive Design


Falling automotive electronics prices, propelled by advances in chip manufacturing and innovations on the design side, are driving a whole new level of demand across the automotive industry. Innovations that were introduced at the luxury end of the car market over the past couple years already are being implemented in more standard vehicles. The single biggest driver of change in the automo... » read more

Semiconductor Wafer Demand: Growing Pains


Semico Research is forecasting total semiconductor unit growth to exceed 13% this year, the first double-digit growth year since 2010. The exceptional unit growth is what the industry hopes for, but it does come with some growing pains. MOS logic, optoelectronics, MEMS and sensors, and even analog and discrete products are experiencing more than 10% unit growth in 2017. The challenge is that... » read more

Tech Talk: Pseudo SRAM


eSilicon's Kar Yee Tang explains how to improve performance at 10/7nm without affecting power and area. https://youtu.be/4LI1pBLxxS4 » read more

The Week In Review: Design


M&A Synopsys acquired Sidense, a provider of antifuse one-time programmable (OTP) non-volatile memory (NVM) for standard-logic CMOS processes. Sidense was founded in 2004 in Canada. Terms of the deal were not disclosed. ArterisIP acquired the software and intellectual property rights of iNoCs, a provider of network-on-chip IP and design tools. Founded in 2007, the Swiss company was spun... » read more

Memory Test Challenges, Opportunities


The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

Tech Talk: TCAM


Dennis Dudeck, IP solutions FAE at eSilicon, talks about how to save power and area with ternary content addressable memory. https://youtu.be/y1FhdoNdzOw » read more

NVDIMM Market Buoyed By Evolving Data Center Demands


The NVDIMM market A recent report published by Transparency Market Research (TMR) confirms that the global Non-Volatile Dual In-line Memory Module (NVDIMM) market is being propelled by an increased demand for advanced data center infrastructure. Indeed, NVDIMMs offer fault-tolerant data integrity, while simultaneously optimizing the performance of storage and cache, as well as indexing, messag... » read more

Power/Performance Bits: Aug. 29


Colored solar panels Researchers from AMOLF, the University of Amsterdam (UvA) and the Energy Research Centre of the Netherlands (ECN) developed a technology to create efficient bright green solar panels in the hopes that a greater array of colors will prompt greater adoption among architects and builders who might see the traditional blue or black panels as an eyesore. The panels have a gr... » read more

Four Foundries Back MRAM


Four major foundries plan to offer MRAM as an embedded memory solution by this year or next, setting the stage for what finally could prove to be a game-changer for this next-generation memory technology. GlobalFoundries, Samsung, TSMC and UMC plan to start offering spin-transfer torque magnetoresistive RAM (ST-MRAM or STT-MRAM) as an alternative or a replacement to NOR flash, possibly start... » read more

← Older posts