Manufacturing & Process Technology

Top Stories

New BEOL/MOL Breakthroughs?

Different materials, approaches for contacts and interconnects begin to surface for 7/5nm.

Inside FD-SOI And Scaling

GlobalFoundries' CTO opens up on FD-SOI, 7nm finFETs, and what's next in scaling.

2.5D, ASICs Extend to 7nm

GlobalFoundries describes 7nm finFET details.

Sourcing Used Equipment

SurplusGlobal's EVP talks about equipment shortages in 200mm equipment and why this market is in crisis mode.

Samsung Unveils Scaling, Packaging Roadmaps

Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced packaging developments.

Reworking Established Nodes

Attention turns to pre-finFET processes because benefits of device scaling don't apply equally to all markets.

200mm Crisis?

Demand is up, capacity is flat. A look at what's behind this imbalance.

Extending EUV Beyond 3nm

Now that EUV is finally shipping, companies are working on extending it much further using anamorphic lenses and high numerical aperture technology.

Materials For Future Electronics

Flexible electronics, new memory types, and neuromorphic computing dominate research.

Inside Lithography And Masks

Experts at the table, part 3: EUV, DSA, nanoimprint, nanopatterning, and best guesses for how far lithography can be extended.

More Top Stories »



Round Tables

Inside Lithography And Masks

Experts at the table, part 3: EUV, DSA, nanoimprint, nanopatterning, and best guesses for how far lithography can be extended.

Inside Lithography And Masks

Experts at the table, part 2: Where EUV fits, what problems still remain, and what are the alternatives.

Inside Lithography And Masks

Experts at the table, part 1: EUV's viability still in doubt even as rollout begins. Uptime and cost are top concerns.

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

BEOL Issues At 10nm And 7nm

Experts at the table, part 2: The impact and cost of air gap; reducing RC delay with liner-less approaches and cobalt; where EUV will make a dent.....

More Roundtables »



Multimedia

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Tech Talk: Embedded Memories

Which type of memory is better and why.

Tech Talk: GPU-Accelerated Photomasks

Upcoming challenges in the mask shop and how to deal with them.

Tech Talk: Double-Triple Patterning

What comes after double patterning and why you need to understand it.

Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

More Multimedia »



See All Posts in Manufacturing and Design »

Latest Blogs

Semico Spin

Foundry Roadmaps: Real Solutions, Or Just Hedging?

The array of options is mind-boggling. ...
Piecing It Together

Architecture First, Node Second

Even the biggest proponents of scaling have changed their tune. ...
On The Mark

Inside Chip R&D

Imec CEO discusses R&D challenges, EUV and chips....
Perfecting The Process

CMOS Image Sensors (CIS): Past, Present & Future

The state-of-the-art in CMOS image sensor technology, plus what's ahead....
Connect With SEMI

Going Vertical?

Scaling and packaging emerge as key discussion points across the semiconductor i...
Applied Innovation

Making Interconnects Faster

How cobalt compares to copper, and why it matters....
Meet The eBeamers

The Future Of Patterning

An interview Imec's top patterning guru. ...
The Foundry Files

1.41 'Giga-Searches' Per Second?

Using application specific memory to improve data center search bandwidth....
Riding The Silicon Rapids

The Other Side Of H1-B Visas

How restrictions on hiring will unfold for people who have nothing to do with te...
Foundry Choices

Better Chips, Better Cars

The foundry perspective on automotive chip manufacturing....
EDA For Manufacturability

ECO Fill Can Rescue Your SoC Tapeout Schedule

Why fill is critical to reducing time to market at all process nodes....

Knowledge Centers
Entities, people and technologies explored


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