Manufacturing, Packaging & Materials

Top Stories

The Next Advanced Packages

New approaches aim for better performance, more flexibility — and for some, lower cost.

Improving Reliability For GaN And SiC

Why these chips are gaining ground, and what still needs to be addressed.

Challenges For Compute-In-Memory Accelerators

The key is to build these with real devices because the application has to work.

The Good And Bad Of Chiplets

IDMs leverage chiplet models, others are still working on it.

Latest IC Outlook: More Uncertainty

Analysis: Downturn is likely, but there are some bright spots.

EUV’s Uncertain Future At 3nm And Below

Manufacturing chips at future nodes is possible from a technology standpoint, but that's not the only consideration.

Challenges In Stacking, Shrinking And Inspecting Next-Gen...

One-on-one with Lam CTO Rick Gottscho.

Compute-In Memory Accelerators Up-End Network Design Trad...

Compute paradigm shifting as more data needs to be processed more quickly.

What’s Next With AI In Fabs?

Where machine/deep learning is useful and where it's not.

Scaling CMOS Image Sensors

Manufacturing issues grow as cameras become more sophisticated.

More Top Stories »



Round Tables

What’s Next With AI In Fabs?

Where machine/deep learning is useful and where it's not.

How And Where ML Is Being Used In IC Manufacturing

Experts at the Table: ML is playing a bigger role in metrology and lithography, but it can't replace physics-based models.

What Machine Learning Can Do In Fabs

Experts at the Table: It's not as accurate as simulation, but it's a lot faster.

Making And Protecting Advanced Masks

Experts at the Table: AI, EUV pellicles and inverse lithography are hot topics in mask making today.

Inspecting, Patterning EUV Masks

Experts at the Table: EUV mask making requires certain tools, but are the solutions ready?

More Roundtables »



Multimedia

Using Digital Twins And DL In Lithography

How to speed up manufacturing with inverse lithography technology with complex curvilinear data.

Curvilinear Full-Chip ILT

Why inverse lithography technology has finally come of age.

Manufacturing Printed Sensors

An inside look at the unique properties and uses of this technology.

Process Window Optimization

How to deal with variation, and interactions between various types of variation.

Material Choices In Printed Temperature Sensors

How printed sensors compare with sensors in chips.

More Multimedia »



See All Posts in Manufacturing Packaging and Materials »

Latest Blogs

Piecing It Together

Spreading Out The Cost At 3nm

Why advanced nodes make sense for more companies.
June 18, 2020
On The Mark

Pandemics And Panic Chip Buying

Demand is strong for mature process nodes.
Meet The eBeamers

Enabling Curvilinear Masks

Mask-wafer co-optimization for faster curvilinear ILT.
Connect With SEMI

The Future Of Mobility: Autonomous, Connected, Electric, ...

Microelectronics are driving major trends in the automotive industry.
Perfecting The Process

Introducing Nanosheets Into Complementary-Field Effect Tr...

Understanding the benefits and challenges of a new, next-generation semicondu...
June 1, 2020
Lam Tech Insights

Fan-Out Wafer-Level Packaging And Copper Electrodeposition

Achieving high-quality, smooth surfaces at the tops of the megapillars and un...
May 21, 2020
The Leading Edge

How Silicon Carbide Is Improving Energy Efficiency &...

Demand is increasing for high-efficiency power supplies and power conversion ...
February 24, 2020
Semico Spin

A Promising Future For Interconnect IP

As designs include more IP blocks and subsystems, interconnect IP vendors wil...
December 17, 2019
Material Science

Printed Sensor Market Expands

What's important in building printed electronics and sensors and which applic...
October 17, 2019

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Aging Problems At 5nm And Below

Semiconductor aging has moved from being a foundry issue to a user problem. As we get to 5nm and below, vectorless methodologies become too inaccurate.

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The Next Advanced Packages

New approaches aim for better performance, more flexibility — and for some, lower cost.

Interconnect Challenges Grow, Tools Lag

More data, smaller devices are hitting the limits of current technology. The fix may be expensive.

ML Opening New Doors For FPGAs

Programmability shifts some of the burden from hardware engineers to software developers for ML applications.