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Manufacturing, Packaging & Materials

Top Stories

The Quest For Curvilinear Photomasks

Why this technology is vital for chip scaling, and what problems still need to be resolved.

Making Chip Packaging More Reliable

Challenges rise for both advanced packages and for new innovations in older technologies.

Going Vertical With GaN Devices

Technology may finally be on the verge of commercialization.

Applications, Challenges For Using AI In Fabs

Deep learning and digital twins can help identify patterns and ultimately may be able to fix any problems that arise, but it will take awhile.

What Goes Wrong In Advanced Packages

More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.

EUV Pellicles Finally Ready

Yield rises with mask protection; multiple sources will likely reduce costs.

Chasing After Carbon Nanotube FETs

CNTs promise big performance improvements, but achieving consistency and replacing incumbent technologies will be difficult.

The Future Of Transistors And IC Architectures

The more compute power, the better. But what's the best way to get there?

IC Materials For Extreme Conditions

NASA looks to SiC and diamond for Venus electronics.

Brazil Paves New Semiconductor Path

After failing in the fab race, the country has started focusing on less capital-intensive segments.

More Top Stories »



Round Tables

Applications, Challenges For Using AI In Fabs

Deep learning and digital twins can help identify patterns and ultimately may be able to fix any problems that arise, but it will take awhile.

The Future Of Transistors And IC Architectures

The more compute power, the better. But what's the best way to get there?

AI And High-NA EUV At 3/2/1nm

EUV double patterning likely at 3nm; what comes after that is uncertain.

Challenges Linger For EUV

Experts at the Table: The challenges of putting EUV into production, and why DRAM will require advanced litho in the future.

Mask/Lithography Issues For Mature Nodes

Experts at the Table: Spare parts are scarce for some tools and they don't do everything, but they are nearly free to operate. That limits purchase...

More Roundtables »



Multimedia

Changing The Rules For Chip Scaling

The potential impact of curvilinear photomask capabilities on transistor density.

Virtual Fabrication At 7/5/3nm

Using data from multiple sources to improve yield.

Challenges At 3/2nm

New structures, processes and yield/performance issues.

Using Digital Twins And DL In Lithography

How to speed up manufacturing with inverse lithography technology with complex curvilinear data.

Curvilinear Full-Chip ILT

Why inverse lithography technology has finally come of age.

More Multimedia »



See All Posts in Manufacturing Packaging and Materials »

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