Manufacturing, Packaging & Materials

Top Stories

Lithography Options For Next-Gen Devices

EUV is the clear winner down to 5nm, but what comes after that may be a combination of tools and techniques.

Inspecting IC Packages Using Die Sorters

Why this obscure tool is becoming crucial for finding cracking defects in optoelectronics, sensors and advanced nodes.

Moore’s Law Now Requires Advanced Packaging

Experts at the Table, part 1: Shrinking features isn't enough anymore. The big challenge now is how to achieve economies of scale and minimize comp...

Finding The Source Of EUV Stochastic Effects

Resolving problems in advanced lithography could push this technology much more into the mainstream, but that won't be easy.

EUV Arrives, But More Issues Ahead

Improvement still needed for uptime, defectivity, line edge roughness and process flows.

Making Chip Packaging Simpler

The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.

EUV Mask Readiness Challenges

Experts at the Table, Part 1: 250W power source appears sustainable and reliable, but defects in mask blanks, 3D mask effects and fabrication of th...

The Good And Bad Of 2D Materials

Single-layer materials are a long way from displacing or even complementing silicon, but no one is ruling them out.

Engineering Talent Shortage Now Top Risk Factor

New market opportunities and global competitiveness are limited by qualified people.

In-Memory Vs. Near-Memory Computing

New approaches are competing for attention as scaling benefits diminish.

More Top Stories »



Round Tables

Moore’s Law Now Requires Advanced Packaging

Experts at the Table, part 1: Shrinking features isn't enough anymore. The big challenge now is how to achieve economies of scale and minimize comp...

EUV Mask Readiness Challenges

Experts at the Table, Part 1: 250W power source appears sustainable and reliable, but defects in mask blanks, 3D mask effects and fabrication of th...

Machine Learning For IC Production

Experts at the Table, part 3: Where this technology can be applied and what’s ahead.

Reducing Advanced Packaging Costs

Experts at the Table, Part 2: What's needed to make different packaging approaches more affordable, and why that may not be a critical factor in th...

FD-SOI At The Edge

Experts at the Table, Part 3: Pushing fully depleted SOI to 10/7nm for AI at the edge; what's missing in the supply chain.

More Roundtables »



Multimedia

The Case For Chiplets

Issues in advanced packaging.

Smart Manufacturing

How to utilize manufacturing data and AI/ML to improve efficiency and yield.

Variation At 10/7nm

Why the middle of line is now a major problem.

22nm Process Technology

How FD-SOI compares with bulk technologies.

New Roadmap For Electronics

How new packaging and materials are changing the traditional physical boundaries of ICs.

More Multimedia »



See All Posts in Manufacturing Packaging and Materials »

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  Trending Articles

Making Chip Packaging Simpler

The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.

EUV Arrives, But More Issues Ahead

Improvement still needed for uptime, defectivity, line edge roughness and process flows.

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Why this choice isn’t as obvious as it might look.

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Why are so many companies rushing to do 7nm designs?

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Rising costs and gaps in equipment emerge as technology scales; new tools under development.