Manufacturing, Packaging & Materials

Top Stories

Etch Processes Push Toward Higher Selectivity, Cost Control

Etching tools are becoming more application-specific, with each new node requiring higher selectivity.

Challenges Grow For Creating Smaller Bumps For Flip Chips

Pitches continue to decrease, but new tooling and technologies are required.

Managing Yield With EUV Lithography And Stochastics

How overlay, roughness and edge placement contribute to yield.

New Standards Push Co-Packaged Optics

Speed, density, distance, and heat all need to be considered; pluggables still have a future.

Assist Layers: The Unsung Heroes of EUV Lithography

Various materials work in concert with the scanner, photoresist and photomasks to make EUV lithography work.

Smarter Ways To Manufacture Chips

Early successes are spurring further investments, with a concentration on high ROI projects.

Power Semiconductors: A Deep Dive Into Materials, Manufac...

Premium Content: How these devices are made and work, challenges in manufacturing, related startups, as well as the reasons why so much effort and ...

Big Changes Ahead In Power Delivery, Materials, And Inter...

How manufacturing and packaging will shift over the next couple decades.

Mini-Consortia Forming Around Chiplets

Commercial chiplet marketplaces are still on the distant horizon, but companies are getting an early start with more limited partnerships.

Tech Forecast: Fab Processes To Watch Through 2040

Key pivot and innovation points in semiconductor manufacturing.

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Round Tables

Big Changes Ahead For Chip Technology And Industry Dynamics

How customization, complexity, and geopolitical tensions are upending the global status quo.

Collaboration Widens Among Big Chip Companies

Top equipment and tools vendors see need for earlier cooperation as complexity rises for advanced nodes and packages.

Unsolved Issues In Next-Gen Photomasks

New technologies and data formats will be required below 3nm.

Photomask Challenges At 3nm And Beyond

What are the next lithography-related issues as device scaling continues to the next process nodes?

Business, Technology Challenges Increase For Photomasks

Complexity and costs are rising, and not all litho equipment and processes are fully vetted.

More Roundtables »


Challenges In Packaging 5G And 6G

From package-defined antennas to antenna-defined packages, and lots of tradeoffs in between.

How Curvilinear Mask Writing Affects Chip Design

The impact of curved shapes on design rules and manufacturability.

Heterogeneous Integration Issues And Developments

Why putting different chips and chiplets into a package is harder than it sounds.

Increased Photomask Density And Its Impact On EDA

Why curvilinear shapes can simplify design rules for chip manufacturing.

Why Changes In Computing Are Driving Changes In Photomasks

How different photomask shapes can improve semiconductor reliability and performance.

More Multimedia »

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Connect With SEMI

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MEMS speakers and bio-inspired sensors expected to flourish.
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Material Science

Hybrid Bonding Basics: What Is Hybrid Bonding?

Advanced packaging requires pitches below 10 µm.
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A Sputnik Moment For Chips

New funding recognizes supply chain risks, but it raises a lot of challenges ...
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Ultra-Small Fan-Out Packaging Solution

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Knowledge Centers
Entities, people and technologies explored

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Challenges Grow For Creating Smaller Bumps For Flip Chips

Pitches continue to decrease, but new tooling and technologies are required.

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