Manufacturing, Packaging & Materials

Top Stories

Advanced Packaging Options Increase

But putting multiple chips into a package is still difficult and expensive.

GaN Versus Silicon For 5G

Silicon still wins in sub-6 GHz, but after that GaN looks increasingly attractive.

Wanted: More Fab Tool Part Standards

More complex equipment and advanced processes require higher reliability from thousands of parts.

Cloudy Outlook Seen For IC Biz

The remainder of 2019 is mixed, but 2020 is looking better—at least for now.

200mm Cools Off, But Not For Long

New market opportunities, a push by SiC vendors to larger wafers and a shortage of used equipment are raising concerns across the industry.

Challenges Grow For 5G Packages And Modules

5G wireless networks drive need for new IC packages and modules.

Creating 2D Compounds

Van der Waals heterostructure becomes a building block for physicists.

Debate Over Health Of Moore’s Law Continues

Reporter's Notebook: At Semicon West, CEOs from across the industry continue to debate whether Moore’s Law is alive or dead.

EUV, Deep Learning Issues In Mask Making

Experts at the Table: Deep learning is a hot topic, but can the industry use it for mask making? (Part 3)

5nm Vs. 3nm

Half nodes, different transistor types, and numerous other options are adding uncertainty everywhere.

More Top Stories »

Round Tables

EUV, Deep Learning Issues In Mask Making

Experts at the Table: Deep learning is a hot topic, but can the industry use it for mask making? (Part 3)

Power, Reliability And Security In Packaging

Experts at the Table, part 3: Why advanced packaging is now a critical element in compute architectures, 5G, automotive and AI systems.

EUV Mask Gaps And Issues

Experts at the Table, part 2: EUV mask tools are ready, but pellicles and turnaround times remain problematic.

Focus Shifting From 2.5D To Fan-Outs For Lower Cost

Experts at the Table, part 2: Interposer costs continue to limit adoption of fastest and lowest-power options, but that's about to change.

Moore’s Law Now Requires Advanced Packaging

Experts at the Table, part 1: Shrinking features isn't enough anymore. The big challenge now is how to achieve economies of scale and minimize comp...

More Roundtables »


Manufacturing Printed Sensors

An inside look at the unique properties and uses of this technology.

Process Window Optimization

How to deal with variation, and interactions between various types of variation.

Material Choices In Printed Temperature Sensors

How printed sensors compare with sensors in chips.

Changes In Smart Manufacturing

The impact of more data and AI on overall efficiency and ROI.

Advanced Process Control

How to eke another node's worth of power, performance and area benefits from existing nodes.

More Multimedia »

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Latest Blogs

Piecing It Together

Why Scaling Must Continue

But calling this an extension of Moore's Law is a mistake.
August 15, 2019
On The Mark

Outlook For Masks, Materials and Wafers

Business is supposed to rebound in 2020, but that's not so clear anymore.
Perfecting The Process

Advanced Patterning Techniques For 3D NAND Devices

Comparing various 3D NAND split and staircase patterning schemes to understan...
Applied Innovation

Silicon Carbide’s Superpowers

Limitations of silicon power switches are driving development of new material...
Connect With SEMI

Breaking The AI Memory Bottleneck

Realizing the promise of AI requires making sure memory systems can handle th...
Semico Spin

Recent Earthquakes Highlight Risk To Semiconductor Manufa...

The semiconductor industry has consolidated into several main manufacturing c...
July 24, 2019
Material Science

Material Solutions For FOWLP Die Shift And Wafer Warpage

For FOWLP technology, a number of process factors come into play when conside...
June 20, 2019
Lam Tech Insights

From Sand To Wafers

The journey of silicon and its many uses.
April 18, 2019
Riding The Silicon Rapids

What’s For Dinner?

Next frontier for robots—the kitchen.
February 12, 2019
The Foundry Files

Adaptation In A Volatile Era

There are ways to achieve the net effect of Moore's Law without billions of d...
January 24, 2019
Yield Management

Digging Deep Into High Aspect Ratio Process Control For M...

3D NAND has led to complex deposition and etch with angstrom-level precision ...
October 18, 2018

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

Using Memory Differently To Boost Speed

Getting data in and out of memory faster is adding some unexpected challenges.

HBM2E: The E Stands for Evolutionary

The new version of the high bandwidth memory standard promises greater speeds and feeds and that’s about it.

Week In Review: Manufacturing, Test

Apple buys Intel’s phone modem biz; Optimal+ adds ML analytics; Q2 numbers; Japan-Korea trade war.

Cloudy Outlook Seen For IC Biz

The remainder of 2019 is mixed, but 2020 is looking better—at least for now.

Hardware-Software Co-Design Reappears

There may be a second chance for co-design, but the same barriers also may get in the way.