Manufacturing, Packaging & Materials

Top Stories

Advanced Packaging Options Increase
But putting multiple chips into a package is still difficult and expensive.
Published on August 19th,  2019 by Ed Sperling

GaN Versus Silicon For 5G
Silicon still wins in sub-6 GHz, but after that GaN looks increasingly attractive.
Published on August 15th,  2019 by Kevin Fogarty

Wanted: More Fab Tool Part Standards
More complex equipment and advanced processes require higher reliability from thousands of parts.
Published on August 15th,  2019 by Mark LaPedus

Cloudy Outlook Seen For IC Biz
The remainder of 2019 is mixed, but 2020 is looking better—at least for now.
Published on July 29th,  2019 by Mark LaPedus

200mm Cools Off, But Not For Long
New market opportunities, a push by SiC vendors to larger wafers and a shortage of used equipment are raising concerns across the industry.
Published on July 18th,  2019 by Mark LaPedus

Challenges Grow For 5G Packages And Modules
5G wireless networks drive need for new IC packages and modules.
Published on July 18th,  2019 by Mark LaPedus

Creating 2D Compounds
Van der Waals heterostructure becomes a building block for physicists.
Published on July 18th,  2019 by Katherine Derbyshire

Debate Over Health Of Moore’s Law Continues
Reporter's Notebook: At Semicon West, CEOs from across the industry continue to debate whether Moore’s Law is alive or dead.
Published on July 10th,  2019 by Ann Steffora Mutschler

EUV, Deep Learning Issues In Mask Making
Experts at the Table: Deep learning is a hot topic, but can the industry use it for mask making? (Part 3)
Published on July 1st,  2019 by Mark LaPedus

5nm Vs. 3nm
Half nodes, different transistor types, and numerous other options are adding uncertainty everywhere.
Published on June 24th,  2019 by Mark LaPedus

More Top Stories »



Round Tables

EUV, Deep Learning Issues In Mask Making
Experts at the Table: Deep learning is a hot topic, but can the industry use it for mask making? (Part 3)
Published on July 1st,  2019 by Mark LaPedus

Power, Reliability And Security In Packaging
Experts at the Table, part 3: Why advanced packaging is now a critical element in compute architectures, 5G, automotive and AI systems.
Published on June 19th,  2019 by Ed Sperling

EUV Mask Gaps And Issues
Experts at the Table, part 2: EUV mask tools are ready, but pellicles and turnaround times remain problematic.
Published on May 8th,  2019 by Mark LaPedus

Focus Shifting From 2.5D To Fan-Outs For Lower Cost
Experts at the Table, part 2: Interposer costs continue to limit adoption of fastest and lowest-power options, but that's about to change.
Published on April 29th,  2019 by Ed Sperling

Moore’s Law Now Requires Advanced Packaging
Experts at the Table, part 1: Shrinking features isn't enough anymore. The big challenge now is how to achieve economies of scale and minimize comp...
Published on April 18th,  2019 by Ed Sperling

More Roundtables »



Multimedia

Manufacturing Printed Sensors
An inside look at the unique properties and uses of this technology.
Published on August 15th,  2019 by Ed Sperling

Process Window Optimization
How to deal with variation, and interactions between various types of variation.
Published on August 7th,  2019 by Ed Sperling

Material Choices In Printed Temperature Sensors
How printed sensors compare with sensors in chips.
Published on July 24th,  2019 by Ed Sperling

Changes In Smart Manufacturing
The impact of more data and AI on overall efficiency and ROI.
Published on July 23rd,  2019 by Ed Sperling

Advanced Process Control
How to eke another node's worth of power, performance and area benefits from existing nodes.
Published on June 20th,  2019 by Ed Sperling

More Multimedia »



See All Posts in Manufacturing Packaging and Materials »

Latest Blogs

Piecing It Together

Why Scaling Must Continue
But calling this an extension of Moore's Law is a mistake.
August 15, 2019
by Ed Sperling
On The Mark

Outlook For Masks, Materials and Wafers
Business is supposed to rebound in 2020, but that's not so clear anymore.
by Mark LaPedus
Perfecting The Process

Advanced Patterning Techniques For 3D NAND Devices
Comparing various 3D NAND split and staircase patterning schemes to understan...
by Yu De Chen
Applied Innovation

Silicon Carbide’s Superpowers
Limitations of silicon power switches are driving development of new material...
by Llew Vaughan-Edmunds
Connect With SEMI

Breaking The AI Memory Bottleneck
Realizing the promise of AI requires making sure memory systems can handle th...
by Michael Hall
Semico Spin

Recent Earthquakes Highlight Risk To Semiconductor Manufa...
The semiconductor industry has consolidated into several main manufacturing c...
July 24, 2019
by Adrienne Downey
Material Science

Material Solutions For FOWLP Die Shift And Wafer Warpage
For FOWLP technology, a number of process factors come into play when conside...
June 20, 2019
by Shelly Fowler
Lam Tech Insights

From Sand To Wafers
The journey of silicon and its many uses.
April 18, 2019
by Steve Proia
Riding The Silicon Rapids

What’s For Dinner?
Next frontier for robots—the kitchen.
February 12, 2019
by Katherine Derbyshire
The Foundry Files

Adaptation In A Volatile Era
There are ways to achieve the net effect of Moore's Law without billions of d...
January 24, 2019
by Thomas Caulfield
Yield Management

Digging Deep Into High Aspect Ratio Process Control For M...
3D NAND has led to complex deposition and etch with angstrom-level precision ...
October 18, 2018
by Mark Shirey

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Using Memory Differently To Boost Speed

Getting data in and out of memory faster is adding some unexpected challenges.

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HBM2E: The E Stands for Evolutionary

The new version of the high bandwidth memory standard promises greater speeds and feeds and that’s about it.

by Andy Patrizio

Week In Review: Manufacturing, Test

Apple buys Intel’s phone modem biz; Optimal+ adds ML analytics; Q2 numbers; Japan-Korea trade war.

by Ed Sperling

Cloudy Outlook Seen For IC Biz

The remainder of 2019 is mixed, but 2020 is looking better—at least for now.

by Mark LaPedus

Hardware-Software Co-Design Reappears

There may be a second chance for co-design, but the same barriers also may get in the way.

by Brian Bailey

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