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Manufacturing, Packaging & Materials

Top Stories

Gearing Up For High-NA EUV
High-NA EUV scanners could cost nearly $320M each, but big foundries already are lining up.
Published on October 21st,  2021 by Mark LaPedus

Progress On General-Purpose Quantum Computers
Repeatable results and behavior, but still plenty of issues to solve.
Published on October 21st,  2021 by Katherine Derbyshire

What’s Next For Transistors And Chiplets
Imec's SVP drills down into GAA FETs, interconnects, chiplets, and 3D packaging.
Published on October 21st,  2021 by Mark LaPedus

Fan-Out And Packaging Challenges
Experts at the Table: Wafer-level and panel-level approaches, packaging economics, and the need for new materials.
Published on October 6th,  2021 by Mark LaPedus

The Silicon Carbide Race Begins
As SiC moves to higher voltages, BEV users get faster charging, extended range, and lower system costs
Published on September 20th,  2021 by Patrick Waurzyniak

Gearing Up For Next-Gen Power Semis
Aluminum nitride, diamond semiconductors, gallium oxide and vertical GaN are all being readied, each with its own pros and cons.
Published on September 16th,  2021 by Mark LaPedus

Nudging 2D semiconductors forward
Stacked nanosheet transistors promise to extend silicon’s reign beyond the finFET era.
Published on September 16th,  2021 by Katherine Derbyshire

Challenges With Chiplets And Packaging
Experts at the Table: The impact of optics, copper hybrid bonding, more standardized interconnects, and many other technologies under development.
Published on September 15th,  2021 by Mark LaPedus

How Chips Will Change Health Care
Imec's chief strategy officer explains how ICs are being used today, and how they will impact medical treatment in the future.
Published on August 25th,  2021 by Ed Sperling

Inside Intel’s Ambitious Roadmap
Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.
Published on August 23rd,  2021 by Mark LaPedus and Ed Sperling

More Top Stories »



Round Tables

Fan-Out And Packaging Challenges
Experts at the Table: Wafer-level and panel-level approaches, packaging economics, and the need for new materials.
Published on October 6th,  2021 by Mark LaPedus

Challenges With Chiplets And Packaging
Experts at the Table: The impact of optics, copper hybrid bonding, more standardized interconnects, and many other technologies under development.
Published on September 15th,  2021 by Mark LaPedus

Current And Future Packaging Trends
Experts at the Table: Rising costs and the physical limits of reticles is forcing more companies to examine alternatives to shrinking geometries.
Published on August 19th,  2021 by Mark LaPedus

What’s Next In Fab Tool Technologies?
Experts at the Table: Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and other next-generation fab technologie...
Published on May 12th,  2021 by Mark LaPedus

Applications, Challenges For Using AI In Fabs
Deep learning and digital twins can help identify patterns and ultimately may be able to fix any problems that arise, but it will take awhile.
Published on April 14th,  2021 by Mark LaPedus

More Roundtables »



Multimedia

Open Cavity Plastic Packaging
Dealing with obsolescence through retrofitting.
Published on September 30th,  2021 by Ed Sperling

What’s Changing In DRAM
The impact of shrinking features on memory.
Published on September 15th,  2021 by Ed Sperling

Changing The Rules For Chip Scaling
The potential impact of curvilinear photomask capabilities on transistor density.
Published on March 10th,  2021 by Ed Sperling

Virtual Fabrication At 7/5/3nm
Using data from multiple sources to improve yield.
Published on October 23rd,  2020 by Ed Sperling

Challenges At 3/2nm
New structures, processes and yield/performance issues.
Published on September 15th,  2020 by Ed Sperling

More Multimedia »



See All Posts in Manufacturing Packaging and Materials »

Latest Blogs

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Curvilinear Design Benefits For Wafers
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The Need For Open Molded Plastic Packages
Cost-effective solutions for low to mid-volume packaging.
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Semico Spin

Semiconductor CapEx To Grow 13.0% In 2021
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Beyond-Line-Of-Sight Troposcatter Communications Primer
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Knowledge Centers
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