Enabling New Functionality In Medtech And Biotech Devices

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous integration (HI) to address. This two-part blog post provides a high... » read more

Panel Tackles Chiplet Packaging Challenges

QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included Daniel Lambalot, Alphawave Semi; Laura Mirkarimi, Adeia; Syrus Ziai, Eliyan; and Mik... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Figure 1 provides a high-level overview of our approach. Nearly eve... » read more

Heterogeneous Integration Device Assembly: Key To Enabling Additional Innovations

Heterogeneous integration (HI) improves device functionality by expanding the types of parts and physical configurations combined with silicon chips. Different parts add new functions – with minimal additional volume – thus increasing overall functionality per unit volume. By comparison, classic methods employed to build electronic products, e.g., circuit boards or metal boxes, increase pro... » read more

SiPs And MCMs Broaden Opportunities For Military-Aerospace System Design

Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a small form factor. Meeting these demands poses higher-level challenges for packaging of these microelectronic devices, which needs to be rugged, long-lived, and affordable. Usage of multi-chip modu... » read more

Failure Prediction Is Vital for Packaging Technology

A while back, I wrote a post on what I call the “10 Commandments of Packaging” – my list of the key things to bear in mind with respect to developing new packaging solutions. Today, packaging engineers must contend with more variables than ever, from new substrate materials to more types of packages with a greater range of complexity. With that complexity comes new challenges, and I felt ... » read more

The Need For Open Molded Plastic Packages

When you need to meet a project or customer deadline, can you count on your outsourced semiconductor assembly and test (OSAT) provider to get you the parts when you need them? If the answer is “no” or “it depends,” you’ll understand the value of having open molded plastic packages – plastic packages with open cavities – readily available for quick-turn assembly. OSATs are v... » read more

Rethinking Business As Usual

Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like nothing any of us have experienced before. QP Technologies has been fortunate to weather the pandemic well – less than 0.05% of our staff has tested positive, w... » read more

Reshoring Vital To The Future Of Chipmaking

Repatriating offshore manufacturing efforts to the United States – i.e., “reshoring” – is not a new concept. The Reshoring Initiative was founded in 2010, and the Reshoring Institute, founded in 2014, conducts annual surveys of global manufacturers regarding their reshoring plans. The institute’s 2019 survey found that, while a growing number of businesses were rethinking their global... » read more

Packaging Demands For RF And Microwave Devices

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

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