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The Need For Open Molded Plastic Packages


When you need to meet a project or customer deadline, can you count on your outsourced semiconductor assembly and test (OSAT) provider to get you the parts when you need them? If the answer is “no” or “it depends,” you’ll understand the value of having open molded plastic packages – plastic packages with open cavities – readily available for quick-turn assembly. OSATs are v... » read more

Rethinking Business As Usual


Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like nothing any of us have experienced before. QP Technologies has been fortunate to weather the pandemic well – less than 0.05% of our staff has tested positive, w... » read more

Reshoring Vital To The Future Of Chipmaking


Repatriating offshore manufacturing efforts to the United States – i.e., “reshoring” – is not a new concept. The Reshoring Initiative was founded in 2010, and the Reshoring Institute, founded in 2014, conducts annual surveys of global manufacturers regarding their reshoring plans. The institute’s 2019 survey found that, while a growing number of businesses were rethinking their global... » read more

Packaging Demands For RF And Microwave Devices


RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

Wafer Prep Key To Thinning SiP


In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different functionalities into systems-in-package (SIPs). Known as heterogeneous integration (HI), this approach now drives the industry’s roadmap for advancement. SiPs enable power-efficient, high-bandwidth conne... » read more

The Ten Commandments Of Packaging


Semiconductor packaging continues to evolve as chipmakers find new ways to fit more functionality into smaller spaces. Whereas the package once served primarily as a means of attaching a chip to a circuit board and protecting it from damage due to heat, moisture, etc., packaging today plays an important role in adding value to the device, boosting customization while helping to reduce costs. ... » read more

Packaging Demands For RF And Microwave


RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more