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Failure Prediction Is Vital for Packaging Technology


A while back, I wrote a post on what I call the “10 Commandments of Packaging” – my list of the key things to bear in mind with respect to developing new packaging solutions. Today, packaging engineers must contend with more variables than ever, from new substrate materials to more types of packages with a greater range of complexity. With that complexity comes new challenges, and I felt ... » read more

The Ten Commandments Of Packaging


Semiconductor packaging continues to evolve as chipmakers find new ways to fit more functionality into smaller spaces. Whereas the package once served primarily as a means of attaching a chip to a circuit board and protecting it from damage due to heat, moisture, etc., packaging today plays an important role in adding value to the device, boosting customization while helping to reduce costs. ... » read more