Moore’s Law: Toward SW-Defined Hardware


Pushing to the next process node will continue to be a primary driver for some chips—CPUs, FPGAs and some ASICS—but for many applications that approach is becoming less relevant as a metric for progress. Behind this change is a transition from using customized software with generic hardware, to a mix of specialized, heterogeneous hardware that can achieve better performance with less ene... » read more

Speeding Up Neural Networks


Neural networking is gaining traction as the best way of collecting and moving critical data from the physical world and processing it in the digital world. Now the question is how to speed up this whole process. But it isn't a straightforward engineering challenge. Neural networking itself is in a state of almost constant flux and development, which makes it something of a moving target. Th... » read more

Design Complexity Drives New Automation


As design complexity grows, so does the need for every piece in the design flow—hardware, software, IP, as well as the ecosystem — to be tied together more closely. At one level, design flow capacity is simply getting bigger to accommodate massive [getkc id="185" kc_name="finFET"]-class designs. But beyond sheer size, there are new interactions in the design flow that place much more emp... » read more

Historic FinFET/2.5D Firsts


Recently, I had an opportunity to watch the Academy Award nominated movie “Hidden Figures.” If you’re a geek at heart, you need to see this movie. It chronicles the strong contributions of three black women to the NASA space program during the 1960s. The civil rights backstory of the movie is powerful, but there is another aspect of the movie that stayed with me as well: all of the “fir... » read more

Why Is TCAM Essential For The Cloud?


With port speeds exceeding 100Gbps, route lookups that are fundamental to all routers have relied on ternary content addressable memories (TCAMs) to provide a lookup response within a clock cycle. However, TCAMs in discrete form are expensive, consume a lot of power, compete for precious real estate on the printed circuit board (PCB), and often lack required flexibility. Embedding a TCAM block ... » read more

Moore’s Law: A Status Report


Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

The Hunt For A Low-Power PHY


Physics has been on the side of chipmakers throughout most of the lifetime of [getkc id="74" comment="Moore's Law"], but when dealing with the world outside the chip, physics is working against them. Pushing data at ever-faster rates through boards and systems consumes increasing amounts of power, but the power budget for chips has not been increasing. Could chips be constrained by their int... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

The Great Machine Learning Race


Processor makers, tools vendors, and packaging houses are racing to position themselves for a role in machine learning, despite the fact that no one is quite sure which architecture is best for this technology or what ultimately will be successful. Rather than dampen investments, the uncertainty is fueling a frenzy. Money is pouring in from all sides. According to a new Moor Insights report,... » read more

HBM Upstages DDR In Bandwidth, Power


For graphics, networking, and high performance computing, the latest iteration of high-bandwidth memory (HBM) continues to rise up as a viable contender against conventional DDR, GDDR designs, and other advanced memory architectures such as the Hybrid Memory Cube. [getkc id="276" kc_name="HBM"] enables lower power consumption per I/O and higher bandwidth memory access with a more condensed f... » read more

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