AI Begins To Reshape Chip Design


Artificial intelligence is beginning to impact semiconductor design as architects begin leveraging its capabilities to improve performance and reduce power, setting the stage for a number of foundational shifts in how chips are developed, manufactured and updated in the future. AI—and machine learning and deep learning subsets—can be used to greatly improve the functional control and pow... » read more

Week In Review: Design, Low Power


Tools OneSpin launched a formal verification tool that integrates with all major simulators, coverage databases and viewers, and chip design verification planning tools to provide a comprehensive view of verification progress. Comprised of two new formal apps, it can identify unreachable coverage points and provide them to the simulator to reduce wasted effort. Synopsys released the latest ... » read more

EDA Cloud Adoption Hits Speed Bumps


If moving semiconductor design to the Cloud was easy and beneficial, everyone would be doing it. But so far, few have done more than dip a toe. The level of difficulty associated with migrating to the Cloud varies, depending upon who you talk to. The reality is that not everyone makes it as easy as it could be, or is not willing to put the necessary effort into making it easier. There is cer... » read more

High-Speed Serial Comms: Getting There Is Half The Fun


Last month I wrote about our 56G SerDes announcement – silicon validated and running in Rome at a major show. We had a great time at that show and got a lot of compliments about the quality and flexibility of our SerDes. These kinds of unfiltered, unsolicited customer comments are really what makes it all worthwhile. It was a gratifying and exciting time. This month, we’re at it again. O... » read more

From Physics To Applications


Jack Harding, president and CEO of eSilicon, sat down with Semiconductor Engineering to talk about the shift toward AI and advanced packaging, and the growing opportunities at 7nm at a time when Moore's Law has begun slowing down. What follows are excerpts of that conversation. SE: Over the past year, the industry has changed its focus from shrinking features and consolidation to all sorts o... » read more

eSilicon 7nm SerDes Hits 56Gbps


ASIC provider eSilicon focuses on high-performance devices for communications infrastructure, networking, and other data-center applications. Using 7nm TSMC pro- cess technology, it has developed ASIC-design platforms under the NeuASIC brand. Each platform includes hard and soft macros for networking applications along with a new architecture and intellectual-property (IP) library for building ... » read more

Power Delivery Affecting Performance At 7nm


Complex interactions and dependencies at 7nm and beyond can create unexpected performance drops in chips that cannot always be caught by signoff tools. This isn't for lack of effort. The amount of time spent trying to determine if an advanced-node chip will work after it is fabricated has been rising steadily for several process nodes. Additional design rules handle everything from variation... » read more

Defect Challenges Growing In Advanced Packaging


The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

Lab-To-Fab Testing


Test equipment vendors are working on integrating testing and simulation in the lab with testing done later in the fab, setting the stage for what potentially could be the most significant change in semiconductor test in years. If they are successful, this could greatly simplify design for test, which has become increasingly difficult as chips get more complex, denser, and as more heterogene... » read more

Cloud Drives Changes In Network Chip Architectures


Cloud data centers have changed the networking topology and how data moves throughout a large data center, prompting significant changes in the architecture of the chips used to route that data and raising a whole new set of design challenges. Cloud computing has emerged as the fast growing segment of the data center market. In fact, it is expected to grow three-fold in the next few years, a... » read more

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