Author's Latest Posts


Why 56Gb/s And 112Gb/s SerDes Matter In Our Daily Social-Media-Driven Lives


Hyper-scalers and service providers are moving from 100GbE to 400GbE Ethernet rates and beyond. Wireline and wireless networks are driving new architectures to support the move from 4G LTE to 5G infrastructure. These transitions are driven by the increasing global IP traffic as the world becomes more connected and digital. At the same time, the decentralization of the cloud and data centers are... » read more

Realizing the Benefits of 14/16nm Technologies


The scaling benefits of Moore’s Law are challenging below 28nm. It is no longer a given that the cost per gate will go down at process nodes below 28nm, e.g., 20nm though 14nm and 7nm. Rising design and manufacturing costs are contributing factors to this trend. Meanwhile, the competing trend of fewer but more complex system-on-chip (SoC) designs is reducing the knowledge base of many chip... » read more

Why 56Gb/s And 112Gb/s SerDes Matter In Our Daily Social-Media-Driven Lives


Hyper-scalers and service providers are moving from 100GbE to 400GbE Ethernet rates and beyond. Wireline and wireless networks are driving new architectures to support the move from 4G LTE to 5G infrastructure. These transitions are driven by the increasing global IP traffic as the world becomes more connected and digital. At the same time, the decentralization of the cloud and data centers are... » read more

eSilicon 7nm SerDes Hits 56Gbps


ASIC provider eSilicon focuses on high-performance devices for communications infrastructure, networking, and other data-center applications. Using 7nm TSMC pro- cess technology, it has developed ASIC-design platforms under the NeuASIC brand. Each platform includes hard and soft macros for networking applications along with a new architecture and intellectual-property (IP) library for building ... » read more

The New Deep Learning Memory Architectures You Should Know About


Artificial intelligence (AI) has come a long way. While our parents grew up with the dream to one day roam with robots, today we are interviewing Sophia, a citizen of Saudi Arabia, who is also the first humanoid robot to be granted a citizenship in any country. Deep learning, a brain-inspired discipline of AI has been around for a long time but has only recently taken off due to abundant data, ... » read more

Multi-Die Packaging And Thermal Superposition Modeling


Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-di... » read more

The New Deep Learning Memory Architectures You Should Know About


Artificial intelligence (AI) has come a long way. While our parents grew up with the dream to one day roam with robots, today we are interviewing Sophia, a citizen of Saudi Arabia, who is also the first humanoid robot to be granted a citizenship in any country. Deep learning, a brain-inspired discipline of AI has been around for a long time but has only recently taken off due to abundant data, ... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design


How advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company has many leading system companies as custome... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design


This paper explores how advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company we profile is eSilicon, which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company ha... » read more

When The Chips Are Down, Software-Defined Data Centers Can Ease R&D Creases


The design team of a fabless semiconductor company seemed to go into a tizzy every 6 months. They had to deliver the latest chips to their end customer amid extremely aggressive deadlines. They realized that if they needed the might of the millennials to bump up their bottom line, they would have to give their models and designs a makeover (read upgrade) every few months. To read more, click... » read more

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