Thermal limits and benefits offered by different packaging options.
Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-die package options. Particular attention must be placed on the thermal limitations and benefits offered by each design. Since multi-die packages have many junctions of interest, a method for characterizing the package with arbitrary power conditions is required. A superposition method, using a matrix approach, is presented that will enable the end-user to investigate the effects of power levels on junction temperatures. Experimental data measured on a 2.5D package were taken to demonstrate the matrix approach for predicting junction temperature based on an independent power map. The agreement between the matrix model and data generated by an independent power map is within 8%.
To read more, click here.
Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Explosion of data is forcing significant changes in where processing is done.
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
Researchers digging into ways around the von Neumann bottleneck.
Showing that a processor core adheres to a specification becomes more difficult when the specification is extensible.
Optimizing complex chips requires decisions about overall system architecture, and memory is a key variable.
Why data scrubbing and social issues could limit the speed of adoption and the usefulness of this technology.
Wally Rhines, Mentor’s CEO Emeritus, points to big shifts caused by AI, customization, uncertainty in the global economy and a changing customer base.
Smaller features and AI are creating system-level issues, but traditional ways of solving these problems don’t always work.
Agile development is gaining traction for developing hardware testbenches, but challenges remain.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply