tag: thermal modeling

ANN Framework for Thermal-Aware Modeling of GAAFETs (NYCU)
By Technical Paper Link - 12 May, 2026 - Comments: 0

A new technical paper, "A Device-Physics-Informed Artificial Neural Network Approach for Thermal-Aware I-V and C-V Modeling of GAA FETs," was published by researchers at National Yang Ming Chiao Tung University. Abstract "This work introduces a device-physics-informed neural network framework for simultaneous modeling of thermal-aware I-V and C-V characteristics of gate-all-around (GAA) f... » read more

A Better Path To Better 3D-IC Thermal Modeling
By Andras Vass-Varnai - 17 Jul, 2025 - Comments: 0

By Andras Vass-Varnai, Lee Wang, John Parry, Byron Blackmore, and Sudarshan Deo In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits has become a make-or-break factor in product success. The traditional approach of treating thermal analysis as an ... » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets
By Technical Paper Link - 16 Oct, 2024 - Comments: 0

A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” was published by researchers at Swiss Federal Institute of Technology Lausanne (EPFL) and University of Applied Sciences and Arts of Western Switzerland (HES-SO). Abstract Excerpt "In this work, we propose a new task mapping heuristic that leverages in-package wireless t... » read more

No Hot Products
By Mike Donnelly - 14 Sep, 2023 - Comments: 0

While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component manufacturers and their OEM customers increasingly battle thermal design issues. Analog electronic component manufacturers have traditionally provided models in SPICE format so customers can sim... » read more

Electro-Thermal Design Breakthrough
By Siemens EDA - 13 Sep, 2023 - Comments: 0

Electronic component manufacturers have traditionally provided models in SPICE format, so customers can simulate their application circuits and better understand the features, capabilities, and interactions of those parts in the system context. Now, with BCI ROM, a similar and parallel thermal model supply chain can develop. This technology breakthrough arrives at a time of component design-in ... » read more

Adding Circuit Aging To Variability
By Brian Bailey - 12 Aug, 2021 - Comments: 0

Moving to a smaller node usually means another factor becomes important. The industry has become accustomed to doing process, temperature, voltage (PVT) corner analysis, but now it has to add aging into that mix. The problem is that planning for circuit aging is no longer a purely statistical process. Aging is dependent on activity over the lifetime of the device. Tools need to be modified a... » read more

Thermal Impact On Reliability At 7/5nm
By Ed Sperling - 28 Sep, 2018 - Comments: 0

Haroon Chaudhri, director of RedHawk Analysis Fusion at Synopsys, talks about why thermal analysis is shifting left in the design cycle and why this is so critical at the most advanced process nodes. https://youtu.be/wjkrEFLb2vY » read more

Multi-Die Packaging And Thermal Superposition Modeling
By eSilicon - 25 Apr, 2018 - Comments: 0

Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-di... » read more

Controlling Heat
By Ann Mutschler - 12 Sep, 2016 - Comments: 0

Modeling on-chip thermal characteristics and chip-package interactions is becoming much more critical for advanced designs, but how to get there isn't always clear. Every chip, based on its target application, has a thermal design power (TDP) target. This is the typical power it can consume without overreaching the acceptable thermal limits in its intended environment. But in order to rate t... » read more

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