tag: advanced packaging

Security, Scaling and Power
By Ed Sperling - 13 Dec, 2018 - Comments: 0

If anyone has doubts about the slowdown and increasing irrelevance of Moore's Law, Intel's official unveiling of its advanced packaging strategy should leave little doubt. Inertia has ended and the roadmap is being rewritten. Intel's discussion of advanced packaging is nothing new. The company has been public about its intentions for years, and started dropping hints back when Pat Gelsinger ... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

The Case For Chiplets
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches. https://youtu.be/7QHEeagdLzk » read more

Some Chipmakers Sidestep Scaling, Others Hedge
By Ed Sperling - 15 Nov, 2018 - Comments: 0

The rising cost of developing chips at 7nm coupled with the reduced benefits of scaling have pried open the floodgates for a variety of options involving new materials, architectures and packaging that either were ignored or not fully developed in the past. Some of these approaches are closely tied to new markets, such as assisted and autonomous vehicles, robotics and 5G. Others involve new ... » read more

Why Chips Die
By Brian Bailey - 12 Nov, 2018 - Comments: 3

Semiconductor devices contain hundreds of millions of transistors operating at extreme temperatures and in hostile environments, so it should come as no surprise that many of these devices fail to operate as expected or have a finite lifetime. Some devices never make it out of the lab and many others die in the fab. It is hoped that most devices released into products will survive until they be... » read more

Die-to-Die Interconnects for Chip Disaggregation
By Mondeep Thiara - 10 Nov, 2018 - Comments: 0

Today, data growth is at an unprecedented pace. We’re now looking at petabytes of data moving into zettabytes. What that translates to is the need for considerably more compute power and much more bandwidth to process all that data. In networking, high-speed SerDes PHYs represent the linchpin for blazing fast back and forth transmission of data in data centers. In turn, demand is increa... » read more

Design For Advanced Packaging
By Brian Bailey - 08 Nov, 2018 - Comments: 0

Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

The Impact of Moore’s Law Ending
By Brian Bailey - 29 Oct, 2018 - Comments: 2

Over the past couple of process nodes the chip industry has come to grips with the fact that Moore's Law is slowing down or ending for many market segments. What isn't clear is what comes next, because even if chipmakers stay at older nodes they will face a series of new challenges that will drive up costs and increase design complexity. Chip design has faced a number of hurdles just to get ... » read more

System-Level, Post-Layout Electrical Analysis For High-Density Advanced Packaging
By Mentor, a Siemens Business - 24 Oct, 2018 - Comments: 0

As HDAP designs become more popular, the need for post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification (DRC and LVS) is growing. Mentor provides an accurate, automated flow that generates the required HDAP netlist for simulation/STA to enable HDAP designers to ensure that the HDAP will perform as designed. To read more, click here. » read more

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