tag: advanced packaging

Using Picosecond Ultrasonic Technology For AI Packages: Part 2
By Cheolkyu Kim - 10 Jul, 2025 - Comments: 0

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve tremendous performance gains. However, the heterogeneous integration of advanced packages has its own set of process control obstacles that must be addressed, including new interconnect challenges invol... » read more

How Advanced Packaging Is Reshaping Inspection
By Gregory Haley - 10 Jul, 2025 - Comments: 0

As semiconductor devices continue advancing into more sophisticated packaging schemes, traditional optical inspection technologies are brushing up against physical and computational boundaries. The growing reliance on 2.5D and 3D integration, hybrid bonding, and wafer-level processes has made it much harder to detect defects consistently and early enough to protect yields. While optical insp... » read more

3D-IC Stress Analysis
By Shetha Nolke - 08 Jul, 2025 - Comments: 0

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional density, a smaller footprint and enhanced system performance. However, these same innovations introduce new mechanical stressors within complex assemblies, posing novel reliability risks across the dev... » read more

Development and Deployment of 2.5D Multi-Foundry Chiplet Solution Scaling Beyond Multi-Reticle Approaches (Intel)
By Technical Paper Link - 03 Jul, 2025 - Comments: 0

A new technical paper titled "System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution" was published by researchers at Intel Corporation. Abstract "The proliferation of chiplet-based designs, driven by the escalating computational demands of AI, presents unique validation challenges when integrating heterogenous chiplets. This paper investigat... » read more

Research Bits: July 1
By Jesse Allen - 01 Jul, 2025 - Comments: 0

Copper-to-copper bonding for GaN integration Researchers from MIT, Georgia Tech, and Air Force Research Laboratory propose a bonding process to integrate gallium nitride (GaN) transistors onto standard silicon CMOS chips. They used the process to create a power amplifier. “We wanted to combine the functionality of GaN with the power of digital chips made of silicon, but without having to ... » read more

Novel Assembly Approaches For 3D Device Stacks
By Laura Peters - 30 Jun, 2025 - Comments: 0

The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age. Not all of these issues are fully solved but the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that... » read more

3D Packaging vs 3D Integration eBook
By Cadence - 25 Jun, 2025 - Comments: 0

In this eBook, you will: •    Explore the background and trends of multi-die packages •    Learn about the distinct approaches of 3D packaging and 3D integration •    Examine the challenges within heterogeneous integration Read more here. » read more

Power Delivery Challenges For AI Chips
By Gregory Haley - 19 Jun, 2025 - Comments: 0

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
By Cheolkyu Kim - 10 Jun, 2025 - Comments: 0

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the front-end of the process. In other words, the technologies that were once exclusively deployed in the first part of the process are being used to meet the increasingly stringent requirements of ad... » read more

Big Changes In Medical Electronics
By Ed Sperling - 09 Jun, 2025 - Comments: 0

Medical devices are becoming more capable, more complicated, and more deployable in the field rather than in a hospital or a doctor's office. But getting these purpose-built devices into the hands of consumers requires a whole bunch of new challenges, from safeguarding fragile on-board chemistries that can be destroyed by existing chip manufacturing and packaging processes to ensuring the mater... » read more

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