Blog Review: Oct. 4


Synopsys' Prishkrit Abrol digs into how USB Type-C Alternate Mode allows MHL, DisplayPort, HDMI, and Thunderbolt over cable. Mentor's Paul Morrison dives into how hardware emulation can help verify the complexities of new storage devices. Cadence's Madhavi Rao listens in as Somshubhro Pal Choudhury of Bharat Innovations describes the IoT stack, hype cycle, and why it's happening now. R... » read more

The Week In Review: Design


M&A Synopsys acquired materials modeling company QuantumWise. QuantumWise tools focus on atomic-scale modeling of nanostructures using quantum-mechanical computational methods, classical potentials, and electrostatic models. Based in Denmark, the company was started in 2008 when it acquired the assets of Atomistix. The technology will be integrated with Synopsys' Sentaurus TCAD. Terms of t... » read more

ARM Moves Further Into Automotive With NXP’s Launch of S32K Series To The General Market


NXP has now launched its new S32K range of microcontrollers for the general market. These devices are targeted at automotive body and motor control applications. NXP is thus now offering ARM-based devices to a broad range of customers in a segment that has been dominated by proprietary-architecture devices. The increasing demands on controllers in body applications mean that this is unlikely to... » read more

Portable Stimulus Status Report


The first release of the Portable Stimulus (PS) standard is slated for early next year. If it lives up to its promise, it could be the first new language and abstraction for verification in two decades. [getentity id="22028" e_name="Accellera"] uncorked the PS Early Adopter release at the Design Automation Conference (DAC) in June. The standard has been more than two years in the making by t... » read more

Cheaper Fan-Outs Ahead


Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

Advanced Packaging Moves To Cars


By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slowâ€... » read more

The Week In Review: Manufacturing


Chipmakers UMC has generated sales from its recently-announced 14nm finFET technology. The foundry vendor also plans to enter the 22nm process technology market. UMC will join other players in the 22nm arena, such as GlobalFoundries, Intel and TSMC. “So we do have a plan to introduce our 22nm as well and it will be available around 2018,” said Jason Wang, the newly appointed co-president o... » read more

Foundries Accelerate Auto Efforts


Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

Blog Review: July 19


Synopsys' Prishkrit Abrol provides a detailed explanation of how the USB Type-C connector works. Mentor's Ricardo Anguiano examines how the RISC-V ecosystem is expanding and latest developments in the open source toolchain. Cadence's Gopi Krishnamurthy explains the lane margining requirements of the PCIe 4.0 specification. ARM's Chet Babla unravels some claims about Narrowband IoT, Cat... » read more

The Week In Review: Manufacturing


Chipmakers Toshiba and its fab partner, Western Digital, have jointly rolled out a 96-layer 3D NAND product amid a legal dispute. The companies have developed prototype samples of a 96-layer 3D NAND device. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, is scheduled for release in the second half of 2017 and mass production is targeted for 2018. Separately, ... » read more

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