ECTC Packaging Trends


At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

Week In Review: Manufacturing, Test


Trade wars The trade war between the United States and China is escalating and it is here to stay. Victor Davis Hanson, a senior fellow at think tank Hoover Institution, said the United States is at a crossroads with China. It could define America’s security and the international order for decades to come. Here’s the latest blog on trade tensions between the U.S. and China. “Tensions ... » read more

Week In Review: Design, Low Power


M&A NXP will acquire Marvell's Wi-Fi Connectivity business in an all-cash, asset transaction valued at $1.76 billion. The deal includes the Wi-Fi and Bluetooth technology portfolios and related assets; the business employs approximately 550 people worldwide. The deal is expected to close by calendar Q1 2020. Tools Cadence unveiled a data center-optimized FPGA-based prototyping system, ... » read more

Blog Review: May 22


Synopsys' Taylor Armerding warns that critical infrastructure is still vulnerable to cyber threats, with Kaspersky finding that 42.7% of the industrial control system computers it protected last year were attacked by malware, email phishing, or other threats. Cadence's Paul McLellan listens in as Jon Masters of Red Hat considers how to tackle speculative execution and branch prediction vulne... » read more

Week In Review: Design, Low Power


Tools & IP Cadence introduced the Tensilica Vision Q7 DSP, which provides up to 1.82 TOPS and is specifically optimized for simultaneous localization and mapping (SLAM). The DSP has a very long instruction word (VLIW) SIMD architecture, an enhanced instruction set supporting 8/16/32-bit data types and optional VFPU support for single and half precision, and a number of iDMA enhancements in... » read more

Blog Review: May 15


Cadence's Sean Dart shares an example of the kind of optimizations HLS tools can perform that would be difficult to find and implement by hand-coding RTL. Synopsys' Taylor Armerding takes a look at three cybersecurity initiatives from the U.S. government, from an IoT bill to improved voting machines, and whether they're likely to work. In a video, Mentor's Colin Walls points to why flashi... » read more

Creating A Roadmap For Hardware Security


The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

Making Chip Packaging Simpler


Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

Blog Review: Feb. 20


Synopsys' Chirag Tyagi examines how Display Stream Compression 1.2 allows the commonly used MIPI DSI display interface to support 8k UHD displays in applications like infotainment and AR/VR even with the limited bandwidth of PHY layers. Cadence's Paul McLellan listens in on a panel discussion at DesignCon on how to create PDKs for silicon photonics so non-photonics experts can complete at le... » read more

The Race To Multi-Domain SoCs


K. Charles Janac, president and CEO of Arteris IP, sat down with Semiconductor Engineering to discuss the impact of automotive and AI on chip design. What follows are excerpts of that conversation. SE: What do you see as the biggest changes over the next 12 to 24 months? Janac: There are segments of the semiconductor market that are shrinking, such as DTV and simple IoT. Others are going ... » read more

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