Why Chiplets Are So Critical In Automotive


Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Chip Ecosystem Apprenticeships Help Close The Talent Gap


Competency-based apprenticeship programs are gaining wider acceptance across the chip industry as companies and governments look for new ways to address talent shortages, and as workers look for new skills that can span multiple industry sectors and industries. Funded in part by the CHIPS Act in the U.S. the European Chips Act, and various other nation-specific and regional programs, apprent... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Chip Industry Week In Review


By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Money Pours Into New Fabs And Facilities


Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

A Configurable Test Infrastructure Using A Mixed-Language And Mixed-Level IP Integration IP-XACT Flow


This paper written with NXP describes an efficient integration flow for mixed-language and mixed-abstraction level IPs through IP-XACT flow automation. Authors Erwin de Kock (NXP), Jos Verhaegh (NXP) and Serge Amougou (Arteris) describe: A configurable and reusable test infrastructure for RTL designs as an application of mixed-level and mixed-language integration using the IP-XACT stand... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Auto Network Speeds Rise As Carmakers Prep For Autonomy


In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle using fewer protocols, less wiring, and ultimately lower cost. Zonal architectures will partition vehicles into zones that are more manageable and flexible, but getting there will take time. There is so much legacy technology in ... » read more

Chip Industry’s Technical Paper Roundup: Dec 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=171 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

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