Mask/Lithography Issues For Mature Nodes


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. ... » read more

Impact Of EUV Resist Thickness On Local Critical Dimension Uniformities For <30nm CD Via Patterning


This paper describes the impact of extreme ultraviolet (EUV) resist thickness on <30 nm via local critical dimension uniformity (LCDU) measured during after development inspection (ADI) and after etch inspection (AEI). For the same post-etch CD targets, increasing resist thickness from 40 to 60 nm helped reduced CD variability. This work was performed via virtual fabrication using Coventor... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Manufacturing Bits: Oct. 12


MoSi2 pellicles for EUV Hanyang University has presented a paper that describes a novel molybdenum disilicide (MoSi2) pellicle membrane for use in extreme ultraviolet (EUV) lithography. With a 28nm thickness, a MoSi2 membrane has demonstrated a 89.33% transmittance for EUV lithography. The pellicle technology is still in R&D. MoSi2, which is a silicide of molybdenum, is a refractory cer... » read more

Manufacturing Bits: Oct. 6


High-NA EUV mask materials A team of researchers have presented a new paper on the tradeoffs of photomask absorber materials for high-NA extreme ultraviolet (EUV) lithography. In the paper, researchers concluded that the industry will likely require an alternative mask absorber stack for high-numerical aperture (high-NA) EUV lithography. Fraunhofer, Imec, ASML and Zeiss contributed to the... » read more

eBeam Initiative Surveys Report Upbeat Photomask Market Outlook


Every year, the eBeam Initiative conducts surveys that provide valuable insight into the key trends that are shaping the semiconductor industry. This year, industry luminaries representing 42 companies from across the semiconductor ecosystem participated in the 2020 eBeam Initiative Luminaries survey. 89% of respondents to the survey predict that photomask (mask) revenues in 2020 will stay the ... » read more

Manufacturing Bits: Sept. 29


Exploring chemical reactions using EUV The University of Tokyo has established a facility to study fast chemical reactions using a coherent extreme ultraviolet light source. The new coherent extreme ultraviolet (XUV) source facility enables researchers to explore time-dependent phenomena, such as ultrafast chemical reactions of biological or physical samples. Located in an underground fa... » read more

Upturn Seen In Semi Equipment Biz


Business continues to get better in the semiconductor equipment sector. VLSI Research, for one, has raised its forecast in the arena. But there is still some uncertainty amid mixed growth for semiconductors, trade wars and other factors. After a downturn in 2019, the semiconductor equipment market expected an upturn in 2020. Then, the Covid-19 pandemic struck. Suddenly, a large percentage... » read more

Survey: 2019 eBeam Initiative Perceptions Survey Results


Results of the 2020 eBeam Initiative Perceptions survey, now called the Luminaries survey, will be made available starting on September 22 here: Meanwhile, here is the 8th Annual Perceptions Survey – 2019 (July). 68 luminaries across 42 different companies participated. Some highlights: Deep learning impact predicted by 2020: 76% of the respondents say it’s somewhat to very lik... » read more

Challenges At 3/2nm


David Fried, vice president of computational products at Lam Research, talks about issues at upcoming process nodes, the move to EUV lithography and nanosheet transistors, and how process variation can affect yield and device performance. » read more

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