The Race To 10/7nm


Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

High-Stakes Litho Game


The commercial introduction of EUV looks all but assured these days. There is enough history to show it works. Uptime and throughput are improving, and systems are shipping today. The question now is how to measure its success. In the short-term, this is a fairly simple financial exercise for companies like ASML and Zeiss, which have been closely collaborating to get these massive systems ou... » read more

Notes From The Chip Beat


Over the last several months, I’ve attended a number of conferences, such as IEDM, SPIE, the FD-SOI Summit and others. At each conference, there is a dizzying amount of information and data. Eventually, some information turns into an article, while most ends up buried in a reporter’s notebook. In any case, here are five observations I’ve made, based on those and other events in the pa... » read more

Extending EUV Beyond 3nm


Jan van Schoot, senior principal architect at [getentity id="22935" comment="ASML"], sat down with Semiconductor Engineering to talk about how far EUV can be extended and where it is today. What follows are excerpts of that discussion. SE: High numerical aperture [gettech id="31045" comment="EUV"] has been in the works for some time as a way of extending EUV. How is this technology shaping... » read more

Inside Lithography And Masks


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

The Evolution Of EUV


EUV systems are beginning to ship to large foundries in volume, setting the stage for one of the biggest leaps in technology the semiconductor industry has ever witnessed. ASML has emerged as the sole supplier in this market, but it has taken an entire ecosystem to develop EUV. It has taken billions of dollars of investment by ASML, along with enormous cash infusions by Intel and TSMC, contr... » read more

Inside Next-Gen Transistors


David Fried, chief technology officer at [getentity id="22210" e_name="Coventor"], sat down with Semiconductor Engineering to discuss the IC industry, China, scaling, transistors and process technology. What follows are excerpts of that conversation. SE: In a recent roundtable discussion you talked about some of the big challenges facing the IC industry. One of your big concerns involves th... » read more

Moore’s Law: A Status Report


Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

Inside Lithography And Masks


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

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